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Method For Forming Lead Wires In Hybrid-bonded Semiconductor Devices
App 20220270919 - YAN; Meng ; et al. | 2022-08-25 |
Method For Forming Lead Wires In Hybrid-bonded Semiconductor Devices
App 20220216099 - YAN; Meng ; et al. | 2022-07-07 |
Method For Forming Three-dimensional Integrated Wiring Structure And Semiconductor Structure Thereof
App 20220208677 - ZHU; Jifeng ; et al. | 2022-06-30 |
Bonding Alignment Marks At Bonding Interface
App 20220173038 - Yan; Meng ; et al. | 2022-06-02 |
Method for forming lead wires in hybrid-bonded semiconductor devices
Grant 11,322,392 - Yan , et al. May 3, 2 | 2022-05-03 |
Bonding alignment marks at bonding in interface
Grant 11,289,422 - Yan , et al. March 29, 2 | 2022-03-29 |
Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof
Grant 11,276,642 - Zhu , et al. March 15, 2 | 2022-03-15 |
Hybrid bonding using dummy bonding contacts and dummy interconnects
Grant 11,205,619 - Wang , et al. December 21, 2 | 2021-12-21 |
Bonding contacts having capping layer and method for forming the same
Grant 11,177,231 - Pan , et al. November 16, 2 | 2021-11-16 |
Staircase structure for memory device
Grant 11,145,666 - Lu , et al. October 12, 2 | 2021-10-12 |
Word line contact structure for three-dimensional memory devices and fabrication methods thereof
Grant 11,101,276 - Zhu , et al. August 24, 2 | 2021-08-24 |
Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof
Grant 11,056,387 - Zhu , et al. July 6, 2 | 2021-07-06 |
Hybrid bonding using dummy bonding contacts
Grant 11,049,834 - Wang , et al. June 29, 2 | 2021-06-29 |
Bonding Contacts Having Capping Layer And Method For Forming The Same
App 20210091033 - Pan; Jie ; et al. | 2021-03-25 |
Bonding Alignment Marks At Bonding Interface
App 20210072653 - Yan; Meng ; et al. | 2021-03-11 |
Hybrid Bonding Using Dummy Bonding Contacts
App 20210035941 - Wang; Tao ; et al. | 2021-02-04 |
Method For Forming Lead Wires In Hybrid-bonded Semiconductor Devices
App 20200402841 - YAN; Meng ; et al. | 2020-12-24 |
Method For Forming Three-dimensional Integrated Wiring Structure And Semiconductor Structure Thereof
App 20200381360 - ZHU; Jifeng ; et al. | 2020-12-03 |
Hybrid bonding using dummy bonding contacts
Grant 10,833,042 - Wang , et al. November 10, 2 | 2020-11-10 |
Hybrid Bonding Using Dummy Bonding Contacts And Dummy Interconnects
App 20200335450 - Wang; Tao ; et al. | 2020-10-22 |
Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof
Grant 10,796,993 - Zhu , et al. October 6, 2 | 2020-10-06 |
Staircase Structure For Memory Device
App 20200295019 - LU; Zhenyu ; et al. | 2020-09-17 |
Method for forming lead wires in hybrid-bonded semiconductor devices
Grant 10,763,158 - Yan , et al. Sep | 2020-09-01 |
Method For Forming Three-dimensional Integrated Wiring Structure And Semiconductor Structure Thereof
App 20200266147 - ZHU; Jifeng ; et al. | 2020-08-20 |
Hybrid bonding using dummy bonding contacts and dummy interconnects
Grant 10,748,851 - Wang , et al. A | 2020-08-18 |
Word Line Contact Structure For Three-dimensional Memory Devices And Fabrication Methods Thereof
App 20200258837 - A1 | 2020-08-13 |
Hybrid Bonding Using Dummy Bonding Contacts And Dummy Interconnects
App 20200243455 - Wang; Tao ; et al. | 2020-07-30 |
Hybrid Bonding Using Dummy Bonding Contacts
App 20200243473 - Wang; Tao ; et al. | 2020-07-30 |
Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof
Grant 10,679,941 - Zhu , et al. | 2020-06-09 |
Staircase structure for memory device
Grant 10,680,003 - Lu , et al. | 2020-06-09 |
Word line contact structure for three-dimensional memory devices and fabrication methods thereof
Grant 10,672,711 - Zhu , et al. | 2020-06-02 |
Bonding Alignment Marks At Bonding Interface
App 20200159133 - Yan; Meng ; et al. | 2020-05-21 |
Method For Forming Three-dimensional Integrated Wiring Structure And Semiconductor Structure Thereof
App 20200152515 - ZHU; Jifeng ; et al. | 2020-05-14 |
Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof
Grant 10,651,087 - Zhu , et al. | 2020-05-12 |
Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof
Grant 10,607,887 - Zhu , et al. | 2020-03-31 |
Methods for forming three-dimensional memory devices
Grant 10,580,788 - Zhu , et al. | 2020-03-03 |
Bonding Contacts Having Capping Layer And Method For Forming The Same
App 20200051945 - Pan; Jie ; et al. | 2020-02-13 |
Methods For Forming Three-dimensional Memory Devices
App 20200027892 - Zhu; Jifeng ; et al. | 2020-01-23 |
Word Line Contact Structure For Three-dimensional Memory Devices And Fabrication Methods Thereof
App 20190096810 - ZHU; Jifeng ; et al. | 2019-03-28 |
Method For Forming Lead Wires In Hybrid-bonded Semiconductor Devices
App 20190088535 - Yan; Meng ; et al. | 2019-03-21 |
Staircase Structure For Memory Device
App 20190081070 - LU; Zhenyu ; et al. | 2019-03-14 |
Method For Forming Three-dimensional Integrated Wiring Structure And Semiconductor Structure Thereof
App 20190067196 - ZHU; Jifeng ; et al. | 2019-02-28 |
Method For Forming Three-dimensional Integrated Wiring Structure And Semiconductor Structure Thereof
App 20190067106 - ZHU; Jifeng ; et al. | 2019-02-28 |
Method For Forming Three-dimensional Integrated Wiring Structure And Semiconductor Structure Thereof
App 20190067105 - ZHU; Jifeng ; et al. | 2019-02-28 |
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