loadpatents
name:-0.0062310695648193
name:-0.0053820610046387
name:-0.00048613548278809
Hu; Shun Patent Filings

Hu; Shun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hu; Shun.The latest application filed is for "bonding alignment marks at bonding interface".

Company Profile
0.4.6
  • Hu; Shun - Wuhan CN
  • Hu; Shun - Shenzhen CN
  • Hu; Shun - Wuhan City CN
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Bonding Alignment Marks At Bonding Interface
App 20220173038 - Yan; Meng ;   et al.
2022-06-02
Bonding alignment marks at bonding in interface
Grant 11,289,422 - Yan , et al. March 29, 2
2022-03-29
Bonding Alignment Marks At Bonding Interface
App 20210072653 - Yan; Meng ;   et al.
2021-03-11
Bonding Alignment Marks At Bonding Interface
App 20200159133 - Yan; Meng ;   et al.
2020-05-21
Honeycomb type cowcatcher and energy absorber for rail transit vehicles
Grant 10,286,933 - Luo , et al.
2019-05-14
Honeycomb Type Cowcatcher And Energy Absorber For Rail Transit Vehicles
App 20170341664 - LUO; Changjie ;   et al.
2017-11-30
Integrated device suspended at high voltage potential for power energy metering and protection of distribution network
Grant 9,018,938 - Hou , et al. April 28, 2
2015-04-28
Integrated Device Suspended At High Voltage Potential For Power Energy Metering And Protection Of Distribution Network
App 20130057255 - Hou; Tiexin ;   et al.
2013-03-07

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