Hu; Shou-Cheng
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hu; Shou-Cheng.The latest application filed is for "semiconductor device with discrete blocks".
- Hu; Shou-Cheng - Tai-Chung TW
- Hu; Shou-Cheng - Tai-Chung City TW
- HU; Shou-Cheng - Hsinchu TW
| Patent | Date |
|---|---|
| Method of packaging a semiconductor die Grant 11,387,171 - Huang , et al. July 12, 2 | 2022-07-12 |
| Semiconductor Device with Discrete Blocks App 20220122944 - Hsiao; Ching-Wen ; et al. | 2022-04-21 |
| Semiconductor device with discrete blocks Grant 11,217,562 - Hsiao , et al. January 4, 2 | 2022-01-04 |
| Semiconductor Package And Method Of Making App 20210287966 - HUANG; Hui-Min ; et al. | 2021-09-16 |
| 3D die stacking structure with fine pitches Grant 10,854,577 - Yu , et al. December 1, 2 | 2020-12-01 |
| Semiconductor Device with Discrete Blocks App 20200118978 - Hsiao; Ching-Wen ; et al. | 2020-04-16 |
| Semiconductor device with discrete blocks Grant 10,510,727 - Hsiao , et al. Dec | 2019-12-17 |
| 3D Die Stacking Structure with Fine Pitches App 20190123028 - Yu; Chen-Hua ; et al. | 2019-04-25 |
| Semiconductor Device with Discrete Blocks App 20180308824 - Hsiao; Ching-Wen ; et al. | 2018-10-25 |
| Semiconductor device with discrete blocks Grant 10,008,479 - Hsiao , et al. June 26, 2 | 2018-06-26 |
| Methods for forming package-on-package structures having buffer dams Grant 9,837,289 - Hu , et al. December 5, 2 | 2017-12-05 |
| Semiconductor Device with Discrete Blocks App 20170125386 - Hsiao; Ching-Wen ; et al. | 2017-05-04 |
| Semiconductor device with discrete blocks Grant 9,543,278 - Hsiao , et al. January 10, 2 | 2017-01-10 |
| Fan-Out Interconnect Structure and Method for Forming Same App 20160284654 - Yu; Chen-Hua ; et al. | 2016-09-29 |
| Methods For Forming Package-On-Package Structures Having Buffer Dams App 20160233113 - Hu; Shou-Cheng ; et al. | 2016-08-11 |
| Methods for forming package-on-package structures having buffer dams Grant 9,330,947 - Hu , et al. May 3, 2 | 2016-05-03 |
| Semiconductor Device with Discrete Blocks App 20160111398 - Hsiao; Ching-Wen ; et al. | 2016-04-21 |
| Methods and apparatus for package on package devices with reversed stud bump through via interconnections Grant 9,293,449 - Hu , et al. March 22, 2 | 2016-03-22 |
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