| Patent | Date |
|---|
Graphene And Hexagonal Boron Nitride Planes And Associated Methods
App 20200156946 - Sung; Chien-Min ; et al. | 2020-05-21 |
Graphene And Hexagonal Boron Nitride Planes And Associated Methods
App 20180044185 - Sung; Chien-Min ; et al. | 2018-02-15 |
Graphene And Hexagonal Boron Nitride Planes And Associated Methods
App 20170022065 - Sung; Chien-Min ; et al. | 2017-01-26 |
Microelectronic 3D packaging structure and method of manufacturing the same
Grant 9,288,907 - Hu , et al. March 15, 2 | 2016-03-15 |
Microelectronic 3d Packaging Structure And Method Of Manufacturing The Same
App 20150271921 - HU; SHAO-CHUNG ; et al. | 2015-09-24 |
Vision based pedestrian and cyclist detection method
Grant 9,087,263 - Fu , et al. July 21, 2 | 2015-07-21 |
Vision Based Pedestrian And Cyclist Detection Method
App 20150161447 - Fu; Li-Chen ; et al. | 2015-06-11 |
Multi-channel Glare-suppression Device Of A Digital Image System
App 20150156382 - Kuo; Chih-Wei ; et al. | 2015-06-04 |
Stress regulated semiconductor devices and associated methods
Grant 9,006,086 - Sung , et al. April 14, 2 | 2015-04-14 |
Graphene And Hexagonal Boron Nitride Planes And Associated Methods
App 20150079352 - Sung; Chien-Min ; et al. | 2015-03-19 |
Stress regulated semiconductor devices and associated methods
Grant 8,778,784 - Sung , et al. July 15, 2 | 2014-07-15 |
Thermal Conduction Device And Method For Fabricating The Same
App 20130216823 - HU; Shao-Chung ; et al. | 2013-08-22 |
Thermal conduction device and method for fabricating the same
Grant 8,453,916 - Hu , et al. June 4, 2 | 2013-06-04 |
Stress Regulated Semiconductor Devices And Associated Methods
App 20130062627 - Sung; Chien-Min ; et al. | 2013-03-14 |
Thermal Conduction Device And Method For Fabricating The Same
App 20120114932 - HU; SHAO-CHUNG ; et al. | 2012-05-10 |
Substrate And Method For Manufacturing The Same
App 20110232950 - HU; Shao-Chung ; et al. | 2011-09-29 |
hBN INSULATOR LAYERS AND ASSOCIATED METHODS
App 20110204409 - Sung; Chien-Min ; et al. | 2011-08-25 |
Electronic Substrate Having Low Current Leakage and High Thermal Conductivity and Associated Methods
App 20110127562 - Sung; Chien-Min ; et al. | 2011-06-02 |
Highly Thermal Conductive Circuit Board
App 20110011628 - Kan; Ming-Chi ; et al. | 2011-01-20 |
Packaging carrier with high heat dissipation and method for manufacturing the same
Grant 7,867,892 - Kan , et al. January 11, 2 | 2011-01-11 |
Graphene and Hexagonal Boron Nitride Planes and Associated Methods
App 20100218801 - Sung; Chien-Min ; et al. | 2010-09-02 |
Method for production of diamond-like carbon film having semiconducting property
Grant 7,727,798 - Wang , et al. June 1, 2 | 2010-06-01 |
Circuit board with high thermal conductivity and method for manufacturing the same
App 20090266599 - Kan; Ming-Chi ; et al. | 2009-10-29 |
Support substrate structure for supporting electronic component thereon and method for fabricating the same
App 20090250248 - Kan; Ming-Chi ; et al. | 2009-10-08 |
Packaging carrier with high heat dissipation and method for manufacturing the same
App 20090085180 - Kan; Ming-Chi ; et al. | 2009-04-02 |
Process of metal interconnects
Grant 7,397,124 - Hu , et al. July 8, 2 | 2008-07-08 |
Methods And Devices For Cooling Printed Circuit Boards
App 20080144291 - Hu; Shao Chung ; et al. | 2008-06-19 |
Method of removing contaminants from a silicon wafer after chemical-mechanical polishing operation
Grant 7,232,752 - Hu , et al. June 19, 2 | 2007-06-19 |
Methods and devices for cooling printed circuit boards
App 20070035930 - Sung; Chien-Min ; et al. | 2007-02-15 |
Structure and process of metal interconnects
App 20050250312 - Hu, Shao-Chung ; et al. | 2005-11-10 |
Structure and process of metal interconnects
App 20050098892 - Hu, Shao-Chung ; et al. | 2005-05-12 |
Method of fabricating a dual damascene copper wire
Grant 6,849,541 - Hu , et al. February 1, 2 | 2005-02-01 |
Chemical mechanical polishing system and method for planarizing substrates in fabricating semiconductor devices
App 20040092112 - Hsu, Chia-Lin ; et al. | 2004-05-13 |
Chemical mechanical polishing equipment
Grant 6,709,544 - Hu , et al. March 23, 2 | 2004-03-23 |
Control system for in-situ feeding back a polish profile
Grant 6,706,140 - Hsu , et al. March 16, 2 | 2004-03-16 |
Post-CMP removal of surface contaminants from silicon wafer
Grant 6,696,361 - Hu , et al. February 24, 2 | 2004-02-24 |
Post-CMP removal of surface contaminants from silicon wafer
App 20040033696 - Hu, Shao-Chung ; et al. | 2004-02-19 |
Chemical Mechanical Polishing Equipment
App 20040016507 - Hu, Shao-Chung ; et al. | 2004-01-29 |
Method for planarization of wafers with high selectivities
Grant 6,660,627 - Hu , et al. December 9, 2 | 2003-12-09 |
Method for planarization of wafers with high selectivities
App 20030181050 - Hu, Shao-Chung ; et al. | 2003-09-25 |
Slurry composition of chemical mechanical polishing
App 20030052308 - Hu, Shao-Chung ; et al. | 2003-03-20 |
Control system for in-situ feeding back a polish profile
App 20030051035 - Hsu, Chia-Lin ; et al. | 2003-03-13 |
Polishing pad conditioner and application thereof
App 20030015215 - Hsu, Chia-Lin ; et al. | 2003-01-23 |
Method for reducing dishing in copper chemical mechanical polishing process
App 20020192941 - Hsu, Chia-Lin ; et al. | 2002-12-19 |
Chemical mechanical polishing system and method for planarizing substrates in fabricating semiconductor devices
App 20020185224 - Hsu, Chia-Lin ; et al. | 2002-12-12 |
Chemical mechanical polishing system and method for planarizing substrates in fabricating semiconductor devices
App 20020162996 - Hsu, Chia-Lin ; et al. | 2002-11-07 |
Post-CMP removal of surface contaminants from silicon
App 20020155681 - Hu, Shao-Chung ; et al. | 2002-10-24 |
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