HU; Nianchu
Patent Applications and Registrations
Patent applications and USPTO patent grants for HU; Nianchu.The latest application filed is for "chip encapsulation structure and encapsulation method".
- HU; Nianchu - Xiamen Fujian
- Hu; Nianchu - Fujian CN
- Hu; Nianchu - Shanghai CN
- Hu; Nianchu - Tianjin CN
| Patent | Date |
|---|---|
| Chip Encapsulation Structure And Encapsulation Method App 20220230931 - WANG; Wei ; et al. | 2022-07-21 |
| Bulk acoustic wave resonator, manufacturing method of the same, and filter Grant 11,336,258 - Li , et al. May 17, 2 | 2022-05-17 |
| Mems Piezoelectric Transducer Having Optimized Capacitor Shape App 20210367135 - Feng; Duan ; et al. | 2021-11-25 |
| Bulk Acoustic Wave Resonator, Manufacturing Method Of The Same, And Filter App 20210359663 - LI; Ping ; et al. | 2021-11-18 |
| Hybrid acoustic wave resonator and preparation method therefor Grant 10,958,236 - Li , et al. March 23, 2 | 2021-03-23 |
| Hybrid Acoustic Wave Resonator And Preparation Method Therefor App 20200389146 - LI; Ping ; et al. | 2020-12-10 |
| Piezoelectric acoustic resonator with adjustable temperature compensation capability Grant 9,991,867 - Zhang , et al. June 5, 2 | 2018-06-05 |
| Piezoelectric Acoustic Resonator with Adjustable Temperature Compensation Capability App 20150263697 - Zhang; Hao ; et al. | 2015-09-17 |
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