Hu; Kunzhong
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hu; Kunzhong.The latest application filed is for "high density 3d interconnect configuration".
Company Profile
15.43.54
- Hu; Kunzhong - Cupertino CA
- Hu; Kunzhong - Irvine CA
- Hu; Kunzhong - Santa Monica CA
Patent Activity
| Patent | Date |
|---|---|
| High Density 3D Interconnect Configuration App 20220285273 - Dabral; Sanjay ; et al. | 2022-09-08 |
| Scalable extreme large size substrate integration Grant 11,404,337 - Hu , et al. August 2, 2 | 2022-08-02 |
| Systems And Methods For Implementing A Scalable System App 20220231687 - Dabral; Sanjay ; et al. | 2022-07-21 |
| Die Stitching And Harvesting Of Arrayed Structures App 20220199517 - Dabral; Sanjay ; et al. | 2022-06-23 |
| Systems and methods for implementing a scalable system Grant 11,309,895 - Dabral , et al. April 19, 2 | 2022-04-19 |
| High density 3D interconnect configuration Grant 11,309,246 - Dabral , et al. April 19, 2 | 2022-04-19 |
| Very Fine Pitch and Wiring Density Organic Side by Side Chiplet Integration App 20220102280 - Dabral; Sanjay ; et al. | 2022-03-31 |
| Wafer Reconstitution And Die-stitching App 20220013504 - Dabral; Sanjay ; et al. | 2022-01-13 |
| Hybrid Thermal Interface Material and Low Temperature Solder Patterns to Improve Package Warpage and Reliability App 20210366861 - Chen; Wei ; et al. | 2021-11-25 |
| Wafer reconstitution and die-stitching Grant 11,158,607 - Dabral , et al. October 26, 2 | 2021-10-26 |
| Double side mounted large MCM package with memory channel length reduction Grant 11,158,621 - Zhong , et al. October 26, 2 | 2021-10-26 |
| Multiple Chip Module Trenched Lid and Low Coefficient of Thermal Expansion Stiffener Ring App 20210305227 - Chen; Wei ; et al. | 2021-09-30 |
| High Density 3d Interconnect Configuration App 20210242170 - Dabral; Sanjay ; et al. | 2021-08-05 |
| 3D fanout stacking Grant 11,056,373 - Zhai , et al. July 6, 2 | 2021-07-06 |
| Scalable Extreme Large Size Substrate Integration App 20210202332 - Hu; Kunzhong ; et al. | 2021-07-01 |
| High Density Interconnection Using Fanout Interposer Chiplet App 20210159180 - Zhai; Jun ; et al. | 2021-05-27 |
| High density interconnection using fanout interposer chiplet Grant 10,943,869 - Zhai , et al. March 9, 2 | 2021-03-09 |
| Structure and Method for Fabricating a Computing System with an Integrated Voltage Regulator Module App 20210043511 - Ramachandran; Vidhya ; et al. | 2021-02-11 |
| High Bandwidth Die To Die Interconnect With Package Area Reduction App 20210020610 - Zhong; Chonghua ; et al. | 2021-01-21 |
| Systems And Methods For Implementing A Scalable System App 20200389172 - Dabral; Sanjay ; et al. | 2020-12-10 |
| Structure and method for fabricating a computing system with an integrated voltage regulator module Grant 10,818,632 - Ramachandran , et al. October 27, 2 | 2020-10-27 |
| High bandwidth die to die interconnect with package area reduction Grant 10,770,433 - Zhong , et al. Sep | 2020-09-08 |
| Double Side Mounted Large Mcm Package With Memory Channel Length Reduction App 20200279842 - Zhong; Chonghua ; et al. | 2020-09-03 |
| High Bandwidth Die To Die Interconnect With Package Area Reduction App 20200273843 - Zhong; Chonghua ; et al. | 2020-08-27 |
| Systems and methods for implementing a scalable system Grant 10,742,217 - Dabral , et al. A | 2020-08-11 |
| Double side mounted large MCM package with memory channel length reduction Grant 10,685,948 - Zhong , et al. | 2020-06-16 |
| Wafer Reconstitution And Die-stitching App 20200176419 - Dabral; Sanjay ; et al. | 2020-06-04 |
| Double Side Mounted Large Mcm Package With Memory Channel Length Reduction App 20200176431 - Zhong; Chonghua ; et al. | 2020-06-04 |
| Systems And Methods For Implementing A Scalable System App 20190319626 - Dabral; Sanjay ; et al. | 2019-10-17 |
| 3D thin profile pre-stacking architecture using reconstitution method Grant 10,181,455 - Zhai , et al. Ja | 2019-01-15 |
| High Density Interconnection Using Fanout Interposer Chiplet App 20180358298 - Zhai; Jun ; et al. | 2018-12-13 |
| Dual-sided silicon integrated passive devices Grant 10,103,138 - Zhai , et al. October 16, 2 | 2018-10-16 |
| SOC with integrated voltage regulator using preformed MIM capacitor wafer Grant 10,056,327 - Zhai , et al. August 21, 2 | 2018-08-21 |
| Reconstituted Interposer Semiconductor Package App 20180233440 - Law; Edward ; et al. | 2018-08-16 |
| 3d Thin Profile Pre-stacking Architecture Using Reconstitution Method App 20180204820 - Zhai; Jun ; et al. | 2018-07-19 |
| Three layer stack structure Grant 9,935,087 - Zhai , et al. April 3, 2 | 2018-04-03 |
| Structure and method for fabricating a computing system with an integrated voltage regulator module Grant 9,935,076 - Ramachandran , et al. April 3, 2 | 2018-04-03 |
| Dual-sided Silicon Integrated Passive Devices App 20170323883 - Zhai; Jun ; et al. | 2017-11-09 |
| Soc With Integrated Voltage Regulator Using Preformed Mim Capacitor Wafer App 20170256489 - Zhai; Jun ; et al. | 2017-09-07 |
| Dual-sided silicon integrated passive devices Grant 9,748,227 - Zhai , et al. August 29, 2 | 2017-08-29 |
| SOC with integrated voltage regulator using preformed MIM capacitor wafer Grant 9,691,701 - Zhai , et al. June 27, 2 | 2017-06-27 |
| Dual molded stack TSV package Grant 9,679,801 - Lai , et al. June 13, 2 | 2017-06-13 |
| Double side mounting memory integration in thin low warpage fanout package Grant 9,659,907 - Zhai , et al. May 23, 2 | 2017-05-23 |
| Three Layer Stack Structure App 20170141088 - Zhai; Jun ; et al. | 2017-05-18 |
| System in package fan out stacking architecture and process flow Grant 9,633,974 - Zhai , et al. April 25, 2 | 2017-04-25 |
| Three layer stack structure Grant 9,601,471 - Zhai , et al. March 21, 2 | 2017-03-21 |
| 3D integration of fanout wafer level packages Grant 9,589,936 - Zhai , et al. March 7, 2 | 2017-03-07 |
| Independent 3d Stacking App 20170053897 - Lai; Kwan-Yu ; et al. | 2017-02-23 |
| Independent 3D stacking Grant 9,559,081 - Lai , et al. January 31, 2 | 2017-01-31 |
| 3d Fanout Stacking App 20170025380 - Zhai; Jun ; et al. | 2017-01-26 |
| Dual-sided Silicon Integrated Passive Devices App 20170018546 - Zhai; Jun ; et al. | 2017-01-19 |
| Soc With Integrated Voltage Regulator Using Preformed Mim Capacitor Wafer App 20170018497 - Zhai; Jun ; et al. | 2017-01-19 |
| Dual Molded Stack Tsv Package App 20160358889 - Lai; Kwan-Yu ; et al. | 2016-12-08 |
| Three Layer Stack Structure App 20160315071 - Zhai; Jun ; et al. | 2016-10-27 |
| Package-on-package Options With Multiple Layer 3-d Stacking App 20160300823 - Zhai; Jun ; et al. | 2016-10-13 |
| Double Side Mounting Memory Integration In Thin Low Warpage Fanout Package App 20160300813 - Zhai; Jun ; et al. | 2016-10-13 |
| Semiconductor package with heat spreader Grant 9,449,899 - Briere , et al. September 20, 2 | 2016-09-20 |
| System In Package Fan Out Stacking Architecture And Process Flow App 20160260684 - Zhai; Jun ; et al. | 2016-09-08 |
| 3d Integration Of Fanout Wafer Level Packages App 20160148904 - ZHAI; Jun ; et al. | 2016-05-26 |
| Package-on-package Options With Multiple Layer 3-d Stacking App 20160013156 - Zhai; Jun ; et al. | 2016-01-14 |
| Reconfigured Wide I/o Memory Modules And Package Architectures Using Same App 20150364454 - Zhai; Jun ; et al. | 2015-12-17 |
| Fan Out Wafer Level Package Using Silicon Bridge App 20150364422 - Zhai; Jun ; et al. | 2015-12-17 |
| Reconstituted Interposer Semiconductor Package App 20150340308 - LAW; Edward ; et al. | 2015-11-26 |
| Thermal enhanced high density flip chip package Grant 9,153,530 - Zhong , et al. October 6, 2 | 2015-10-06 |
| Semiconductor package with conductive heat spreader Grant 9,105,619 - Briere , et al. August 11, 2 | 2015-08-11 |
| Wafer level package resistance monitor scheme Grant 8,957,694 - Hu , et al. February 17, 2 | 2015-02-17 |
| Interdigitated conductive support for GaN semiconductor die Grant 8,791,560 - Hu , et al. July 29, 2 | 2014-07-29 |
| Semiconductor Package with Heat Spreader App 20140084431 - Briere; Michael A. ; et al. | 2014-03-27 |
| Wafer Level Package Resistance Monitor Scheme App 20130314120 - Hu; Kunzhong ; et al. | 2013-11-28 |
| Semiconductor package Grant 8,564,124 - Briere , et al. October 22, 2 | 2013-10-22 |
| Semiconductor Package with Conductive Heat Spreader App 20130161803 - Briere; Michael A. ; et al. | 2013-06-27 |
| Thermal Enhanced High Density Flip Chip Package App 20120319255 - Zhong; Chonghua ; et al. | 2012-12-20 |
| Semiconductor package with metal straps Grant 8,253,224 - Hu , et al. August 28, 2 | 2012-08-28 |
| Interdigitated Conductive Support for GaN Semiconductor Die App 20110272705 - Hu; Kunzhong ; et al. | 2011-11-10 |
| Package for monolithic compound semiconductor (CSC) devices for DC to DC converters Grant 7,999,365 - Hu , et al. August 16, 2 | 2011-08-16 |
| Interdigitated conductive lead frame or laminate lead frame for GaN die Grant 7,994,632 - Hu , et al. August 9, 2 | 2011-08-09 |
| Semiconductor package with metal straps App 20110108968 - Hu; Kunzhong ; et al. | 2011-05-12 |
| Method for fabricating a semiconductor package Grant 7,867,823 - Hu , et al. January 11, 2 | 2011-01-11 |
| Copper straps Grant 7,859,089 - Hu , et al. December 28, 2 | 2010-12-28 |
| Multi-chip module Grant 7,804,131 - Cheah , et al. September 28, 2 | 2010-09-28 |
| High current lead electrode for semiconductor device Grant 7,728,420 - Cheah , et al. June 1, 2 | 2010-06-01 |
| Package For Monolithic Compound Semiconductor (csc) Devices For Dc To Dc Converters App 20090072368 - Hu; Kunzhong ; et al. | 2009-03-19 |
| High current lead electrode for semiconductor device App 20080237829 - Cheah; Chuan ; et al. | 2008-10-02 |
| Cascoded rectifier package Grant 7,402,845 - Cheah , et al. July 22, 2 | 2008-07-22 |
| Multi-chip module App 20080048342 - Cheah; Chuan ; et al. | 2008-02-28 |
| Semiconductor package Grant 7,304,372 - Hu , et al. December 4, 2 | 2007-12-04 |
| Copper straps App 20070267727 - Hu; Kunzhong ; et al. | 2007-11-22 |
| Semiconductor package App 20070210438 - Briere; Michael A. ; et al. | 2007-09-13 |
| Method for fabricating a semiconductor package App 20070212822 - Hu; Kunzhong ; et al. | 2007-09-13 |
| Interdigitated conductive lead frame or laminate lead frame for GaN die App 20070181934 - Hu; Kunzhong ; et al. | 2007-08-09 |
| Cascoded rectifier package App 20070176291 - Cheah; Chuan ; et al. | 2007-08-02 |
| Semiconductor package App 20070063216 - Hu; Kunzhong ; et al. | 2007-03-22 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 