Trademark applications and grants for Hu, Junwei. Hu, Junwei has 2 trademark applications. The latest application filed is for "DIMHLCDZA"
Entity Type | INDIVIDUAL |
Address | No. 15, Baiyang St. Yaogou Village, Chenjiazhuang Township Wutai County, Xinzhou CHINA 035507 |
Patent Application | Date |
---|---|
TEMPERATURE COMPENSATION CIRCUIT AND PHASED ARRAY APPARATUS 20210249790 - 17/242525 HU; Junwei ;   et al. | 2021-08-12 |
COMPOSITION FOR ANTI-SCRATCH AND WEAR-RESISTANCE PROPERTIES, METHOD OF PREPARING THE SAME, AND ITS APPLICATIONS 20140018474 - 13/719311 Zhou; Lang ;   et al. | 2014-01-16 |
Semiconductor Device and Method of Forming Perforated Opening in Bottom Substrate of Flipchip POP Assembly to Reduce Bleeding of Underfill Material 20110278712 - 12/781754 Hu; Junwei ;   et al. | 2011-11-17 |
Method of forming perforated opening in bottom substrate of flipchip pop assembly to reduce bleeding of underfill material 9,105,647 - 12/781,754 Hu , et al. August 11, 2 | 2015-08-11 |
Method of forming perforated opening in bottom substrate of flipchip pop assembly to reduce bleeding of underfill material 9,105,647 - 12/781,754 Hu , et al. August 11, 2 | 2015-08-11 |
Mark Image Registration | Serial | Trademark Application Date |
---|---|
![]() "DIMHLCDZA" 98095482 |
DIMHLCDZA 2023-07-21 |
![]() "JINSANQIAN" 97883537 |
JINSANQIAN 2023-04-11 |
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