Hu; Ian

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hu; Ian.The latest application filed is for "heat transfer element, method for forming the same and semiconductor structure comprising the same".

Company Profile

15.16.22

Hu; Ian - Kaohsiung TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Substrate and semiconductor device package and method for manufacturing the same Grant 11,410,934 - Hu , et al. August 9, 2	2022-08-09
Semiconductor device package and method of manufacturing the same Grant 11,410,902 - Wang , et al. August 9, 2	2022-08-09
Heat Transfer Element, Method For Forming The Same And Semiconductor Structure Comprising The Same App 20220243992 - HUANG; Hung-Hsien ; et al.	2022-08-04
Optical measurement equipment and method for measuring warpage of a workpiece Grant 11,375,124 - Wang , et al. June 28, 2	2022-06-28
Package Structure And Method For Manufacturing The Same App 20220093528 - HU; Ian	2022-03-24
Semiconductor package structure and electronic device Grant 11,282,767 - Chen , et al. March 22, 2	2022-03-22
Substrate Structures, Methods For Forming The Same And Semiconductor Device Structures Comprising The Same App 20220084926 - HU; Ian ; et al.	2022-03-17
Semiconductor device packages and methods of manufacturing the same Grant 11,217,502 - Hu , et al. January 4, 2	2022-01-04
Substrate And Semiconductor Device Package And Method For Manufacturing The Same App 20210327815 - HU; Ian ; et al.	2021-10-21
Multi-moldings fan-out package and process Grant 11,152,274 - Lee , et al. October 19, 2	2021-10-19
Semiconductor package structure and assembly structure Grant 11,139,226 - Chen , et al. October 5, 2	2021-10-05
Electronic device comprising heat pipe contacting a cover structure for heat dissipation Grant 11,139,222 - Tsai , et al. October 5, 2	2021-10-05
Semiconductor Device Package And Method Of Manufacturing The Same App 20210265273 - CHANG CHIEN; Chien Lin ; et al.	2021-08-26
Substrate structure and semiconductor package structure Grant 11,081,420 - Chen , et al. August 3, 2	2021-08-03
Semiconductor package Grant 11,075,186 - Hu , et al. July 27, 2	2021-07-27
Semiconductor Package Structure And Semiconductor Manufacturing Process App 20210166987 - HU; Ian ; et al.	2021-06-03
Semiconductor package structure having vapor chamber thermally connected to a surface of the semiconductor die Grant 11,024,557 - Chen , et al. June 1, 2	2021-06-01
Semiconductor Device Packages And Methods Of Manufacturing The Same App 20210134696 - HU; Ian ; et al.	2021-05-06
Semiconductor device package and method for manufacturing the same Grant 10,985,085 - Hu , et al. April 20, 2	2021-04-20
Semiconductor Device Package And Method Of Manufacturing The Same App 20210082782 - WANG; Ming-Han ; et al.	2021-03-18
Substrate Structure And Semiconductor Package Structure App 20210013118 - Chen; Hsin-En ; et al.	2021-01-14
Apparatus and method for measuring warpage Grant 10,861,726 - Tsai , et al. December 8, 2	2020-12-08
Semiconductor Device Package And Method For Manufacturing The Same App 20200365485 - HU; Ian ; et al.	2020-11-19
Optical Measurement Equipment And Method For Measuring Warpage Of A Workpiece App 20200275030 - WANG; Ming-Han ; et al.	2020-08-27
Semiconductor Package Structure And Electronic Device App 20200266123 - CHEN; Hsin-En ; et al.	2020-08-20
Semiconductor Package Structure And Semiconductor Manufacturing Process App 20200161206 - HU; Ian ; et al.	2020-05-21
Semiconductor Package Structure And Assembly Structure App 20200111728 - CHEN; Hsin-En ; et al.	2020-04-09
Apparatus And Method For Measuring Warpage App 20200098605 - TSAI; Chun Hung ; et al.	2020-03-26
Semiconductor Package Structure App 20200091036 - CHEN; Hsin-En ; et al.	2020-03-19
Electronic Device App 20200083143 - TSAI; Jung-Che ; et al.	2020-03-12
Semiconductor device package and a method of manufacturing the same Grant 10,522,508 - Hu , et al. Dec	2019-12-31
Semiconductor Device Package And A Method Of Manufacturing The Same App 20190341368 - HU; Ian ; et al.	2019-11-07
Semiconductor package structure, semiconductor device and method for manufacturing the same Grant 10,453,802 - Hu Oc	2019-10-22
Semiconductor device package and method for manufacturing the same Grant 10,410,942 - Chen , et al. Sept	2019-09-10
Semiconductor Device Package And Method For Manufacturing The Same App 20190164859 - CHEN; Tsan-Hsien ; et al.	2019-05-30
Multi-moldings Fan-out Package And Process App 20190080975 - LEE; Wei-Hsuan ; et al.	2019-03-14
Semiconductor Package Structure, Semiconductor Device And Method For Manufacturing The Same App 20190067207 - HU; Ian	2019-02-28
Semiconductor Package App 20180226320 - HU; Ian ; et al.	2018-08-09

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