HU; Dongdong
Patent Applications and Registrations
Patent applications and USPTO patent grants for HU; Dongdong.The latest application filed is for "rotatable faraday cleaning apparatus and plasma processing system".
- HU; Dongdong - Jiangsu CN
- Hu; Dongdong - Xuzhou CN
- Hu; Dongdong - Huzhou CN
Trademarks
| Patent | Date |
|---|---|
| Rotatable Faraday Cleaning Apparatus And Plasma Processing System App 20220297168 - LIU; Haiyang ; et al. | 2022-09-22 |
| Device For Blocking Plasma Backflow In Process Chamber To Protect Air Inlet Structure App 20220254615 - LI; Na ; et al. | 2022-08-11 |
| Ceramic Air Inlet Radio Frequency Connection Type Cleaning Device App 20220254605 - LIU; Haiyang ; et al. | 2022-08-11 |
| Inductively Coupled Plasma Treatment System App 20220254604 - LIU; Haiyang ; et al. | 2022-08-11 |
| Ion beam etching system Grant 11,373,842 - Li , et al. June 28, 2 | 2022-06-28 |
| Etching Uniformity Regulating Device And Method App 20220013331 - LIU; Xiaobo ; et al. | 2022-01-13 |
| Method For Manufacturing Magnetic Tunnel Junction App 20210399214 - CHE; Dongchen ; et al. | 2021-12-23 |
| Reaction Chamber Lining App 20210398781 - LI; Na ; et al. | 2021-12-23 |
| Etching Device And Method Of Inductively Coupled Plasma App 20210398774 - LIU; Xiaobo ; et al. | 2021-12-23 |
| Etching Method For Single-isolated Magnetic Tunnel Junction App 20210399215 - HU; Dongdong ; et al. | 2021-12-23 |
| Semiconductor Device Manufacturing Method App 20210399217 - JIANG; Zhongyuan ; et al. | 2021-12-23 |
| Method For Etching Magnetic Tunnel Junction App 20210399216 - LIU; Ziming ; et al. | 2021-12-23 |
| Multilayer Magnetic Tunnel Junction Etching Method And Mram Device App 20210376232 - WANG; Juebin ; et al. | 2021-12-02 |
| Etching Method For Magnetic Tunnel Junction App 20210351343 - XU; Kaidong ; et al. | 2021-11-11 |
| Ion Beam Etching System App 20200161088 - LI; Na ; et al. | 2020-05-21 |
| Sewing thimble Grant D876,813 - Hu | 2020-03-03 |
| Lower Electrode Wafer Chuck Of An Etching Machine App 20190341288 - CHE; Dongchen ; et al. | 2019-11-07 |
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