| Patent | Date |
|---|
Intermediate Substrate And Fabrication Method Thereof
App 20220285257 - Hsu; Shih-Ping ; et al. | 2022-09-08 |
Manufacturing Method For Semiconductor Package Structure
App 20210320096 - Hu; Chu-Chin ; et al. | 2021-10-14 |
Method of fabricating packaging substrate
Grant 11,031,329 - Hu , et al. June 8, 2 | 2021-06-08 |
Electronic package
Grant 10,784,205 - Hu , et al. Sept | 2020-09-22 |
Semiconductor Package Structure And Method Of Making The Same
App 20200135693 - Hu; Chu-Chin ; et al. | 2020-04-30 |
Electronic Package And Method For Fabricating The Same
App 20200075554 - Hsu; Che-Wei ; et al. | 2020-03-05 |
Package substrate and associated fabrication method with varying depths for circuit device terminals
Grant 10,580,739 - Hu , et al. | 2020-03-03 |
Flip-chip Package Substrate
App 20190341357 - Hu; Chu-Chin ; et al. | 2019-11-07 |
Electronic Package And Method Of Manufacturing The Same
App 20190206754 - Hsu; Che-Wei ; et al. | 2019-07-04 |
Electronic package and conductive structure thereof
Grant 10,204,865 - Hu , et al. Feb | 2019-02-12 |
Package substrate having a plurality of chips electrically connected by conductive vias and wiring bonding
Grant 10,079,220 - Hu , et al. September 18, 2 | 2018-09-18 |
Packaging Substrate And Method Of Fabricating The Same
App 20180240747 - Hu; Chu-Chin ; et al. | 2018-08-23 |
Packaging Substrate And Method Of Fabricating The Same
App 20180240748 - Hu; Chu-Chin ; et al. | 2018-08-23 |
Packaging substrate and method of fabricating the same
Grant 10,002,823 - Hu , et al. June 19, 2 | 2018-06-19 |
Package Substrate And Its Fabrication Method
App 20180130745 - Hu; Chu-Chin ; et al. | 2018-05-10 |
Package Substrate And Its Fabrication Method
App 20180130771 - HU; CHU-CHIN ; et al. | 2018-05-10 |
Method of fabricating package substrates
Grant 9,831,217 - Hu , et al. November 28, 2 | 2017-11-28 |
Packaging Substrate And Method Of Fabricating The Same
App 20170338174 - Hu; Chu-Chin ; et al. | 2017-11-23 |
Fabrication Method OF A Package Substrate
App 20170317031 - HU; CHU-CHIN ; et al. | 2017-11-02 |
Method Of Fabricating Package Substrates
App 20170301652 - HU; CHU-CHIN ; et al. | 2017-10-19 |
Packaging module and substrate structure thereof
Grant 9,754,982 - Yu , et al. September 5, 2 | 2017-09-05 |
Package Substrate And Its Fabrication Method
App 20170194262 - HU; CHU-CHIN ; et al. | 2017-07-06 |
Electronic package
Grant 9,613,894 - Hu , et al. April 4, 2 | 2017-04-04 |
Package apparatus and manufacturing method thereof
Grant 9,601,402 - Chou , et al. March 21, 2 | 2017-03-21 |
Package apparatus and manufacturing method thereof
Grant 9,589,935 - Hu , et al. March 7, 2 | 2017-03-07 |
Packaging Module And Substrate Structure Thereof
App 20160268326 - Yu; Chun-Hsien ; et al. | 2016-09-15 |
Electronic Package
App 20160212852 - Hu; Chu-Chin ; et al. | 2016-07-21 |
Electronic Package
App 20160211204 - Hu; Chu-Chin ; et al. | 2016-07-21 |
Electronic Package And Conductive Structure Thereof
App 20160212851 - Hu; Chu-Chin ; et al. | 2016-07-21 |
Stacked Package Structure
App 20160192525 - Hu; Chu-Chin ; et al. | 2016-06-30 |
Package Apparatus And Manufacturing Method Thereof
App 20160163677 - HU; CHU-CHIN ; et al. | 2016-06-09 |
Packaging substrate, method for manufacturing same, and chip packaging body having same
Grant 9,357,647 - Hu , et al. May 31, 2 | 2016-05-31 |
Package Apparatus And Manufacturing Method Thereof
App 20150382469 - HU; Chu-Chin ; et al. | 2015-12-31 |
Package Apparatus And Manufacturing Method Thereof
App 20150235916 - CHOU; E-TUNG ; et al. | 2015-08-20 |
Packaging Substrate, Method For Manufacturing Same, And Chip Packaging Body Having Same
App 20140078706 - HU; CHU-CHIN ; et al. | 2014-03-20 |
Packaging Substrate, Method For Manufacturing Same, And Chip Packaging Body Having Same
App 20140036465 - HU; CHU-CHIN ; et al. | 2014-02-06 |
Package stack device and fabrication method thereof
Grant 8,531,021 - Hu , et al. September 10, 2 | 2013-09-10 |
Carrier board structure with embedded semiconductor chip and fabrication method thereof
Grant 8,354,338 - Hu , et al. January 15, 2 | 2013-01-15 |
Package Stack Device And Fabrication Method Thereof
App 20120193789 - Hu; Chu-Chin ; et al. | 2012-08-02 |
Fabrication method of package structure
Grant 8,222,080 - Hu July 17, 2 | 2012-07-17 |
Fabrication Method Of Package Structure
App 20110053318 - Hu; Chu-Chin | 2011-03-03 |
Direct connection multi-chip semiconductor element structure
Grant 7,417,299 - Hu August 26, 2 | 2008-08-26 |
Carrier Board Structure With Embedded Semiconductor Chip And Fabrication Method Thereof
App 20080029895 - HU; Chu-Chin ; et al. | 2008-02-07 |
Substrate for pre-soldering material and fabrication method thereof
Grant 7,319,276 - Hsu , et al. January 15, 2 | 2008-01-15 |
Integrated library core for embedded passive components and method for forming electronic device thereon
Grant 7,190,592 - Hu March 13, 2 | 2007-03-13 |
Circuit board structure integrated with semiconductor chip and method of fabricating the same
App 20070020812 - Hsu; Shih-Ping ; et al. | 2007-01-25 |
Wafer and single chip having circuit rearranged structure and method for fabricating the same
App 20060284288 - Hu; Chu-Chin | 2006-12-21 |
Substrate for Pre-Soldering Material and Fabrication Method Thereof
App 20060278999 - Hsu; Shih-Ping ; et al. | 2006-12-14 |
Pre-solder structure on semiconductor package substrate and method for fabricating the same
App 20060279000 - Chang; Ruei-Chih ; et al. | 2006-12-14 |
Substrate for pre-soldering material and fabrication method thereof
Grant 7,112,524 - Hsu , et al. September 26, 2 | 2006-09-26 |
Direct connection multi-chip semiconductor element structure
App 20060001152 - Hu; Chu-Chin | 2006-01-05 |
Method for releasing stress of embedded chip and chip embedded structure
App 20050239269 - Hu, Chu-Chin ; et al. | 2005-10-27 |
Pre-solder structure on semiconductor package substrate and method for fabricating the same
App 20050167830 - Chang, Ruei-Chih ; et al. | 2005-08-04 |
Substrate for pre-soldering material and fabrication method thereof
App 20050070084 - Hsu, Shih-Ping ; et al. | 2005-03-31 |
Integrated library core for embedded passive components and method for forming electronic device thereon
App 20040150966 - Hu, Chu-Chin | 2004-08-05 |
Method and structure for producing bumps on an IC package substrate
Grant 6,576,541 - Hu June 10, 2 | 2003-06-10 |
Method and structure for producing bumps on an IC package substrate
App 20020060160 - Hu, Chu-Chin | 2002-05-23 |
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