loadpatents
Patent applications and USPTO patent grants for Hu; Ching-Hsiang.The latest application filed is for "wafer bonding alignment".
Patent | Date |
---|---|
Multifunctional collimator for contact image sensors Grant 11,454,820 - Chen , et al. September 27, 2 | 2022-09-27 |
Multifunctional collimator for contact image sensors Grant 11,448,891 - Chen , et al. September 20, 2 | 2022-09-20 |
Wafer Bonding Alignment App 20220293557 - HSU; Hsi-Cheng ;   et al. | 2022-09-15 |
Inter-poly connection for parasitic capacitor and die size improvement Grant 11,407,636 - Cheng , et al. August 9, 2 | 2022-08-09 |
Anti-stiction Process For Mems Device App 20220242724 - WENG; Jui-Chun ;   et al. | 2022-08-04 |
Roughness Selectivity For Mems Movement Stiction Reduction App 20220135397 - HSU; Hsi-Cheng ;   et al. | 2022-05-05 |
Anti-stiction process for MEMS device Grant 11,305,980 - Weng , et al. April 19, 2 | 2022-04-19 |
Mutifunctional Collimator For Contact Image Sensors App 20210116713 - CHEN; Hsin-Yu ;   et al. | 2021-04-22 |
Multifunctional Collimator For Contact Image Sensors App 20210116714 - CHEN; Hsin-Yu ;   et al. | 2021-04-22 |
Anti-stiction Process For Mems Device App 20200123003 - Weng; Jui-Chun ;   et al. | 2020-04-23 |
Anti-stiction process for MEMS device Grant 10,513,432 - Weng , et al. Dec | 2019-12-24 |
Anti-stiction Process For Mems Device App 20190031503 - WENG; Jui-Chun ;   et al. | 2019-01-31 |
Inter-poly Connection For Parasitic Capacitor And Die Size Improvement App 20180370790 - Cheng; Shyh-Wei ;   et al. | 2018-12-27 |
Inter-poly connection for parasitic capacitor and die size improvement Grant 10,155,656 - Cheng , et al. Dec | 2018-12-18 |
Selective nitride outgassing process for MEMS cavity pressure control Grant 9,884,758 - Cheng , et al. February 6, 2 | 2018-02-06 |
Selective Nitride Outgassing Process For Mems Cavity Pressure Control App 20170203962 - Cheng; Shyh-Wei ;   et al. | 2017-07-20 |
Inter-poly Connection For Parasitic Capacitor And Die Size Improvement App 20170107097 - Cheng; Shyh-Wei ;   et al. | 2017-04-20 |
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