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name:-0.0044519901275635
name:-0.00301194190979
Hsuku; Wen-Cheng Patent Filings

Hsuku; Wen-Cheng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hsuku; Wen-Cheng.The latest application filed is for "selective growth for high-aspect ratio metal fill".

Company Profile
2.3.3
  • Hsuku; Wen-Cheng - Hsin-Chu TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Selective growth for high-aspect ratio metal fill
Grant 11,257,953 - Wu , et al. February 22, 2
2022-02-22
Selective growth for high-aspect ratio metal fill
Grant 10,797,176 - Wu , et al. October 6, 2
2020-10-06
Selective Growth for High-Aspect Ratio Metal Fill
App 20200066911 - Wu; Chih-Nan ;   et al.
2020-02-27
Selective Growth for High-Aspect Ratio Metal Fill
App 20190058063 - Wu; Chih-Nan ;   et al.
2019-02-21
Selective growth for high-aspect ratio metal fill
Grant 10,109,741 - Wu , et al. October 23, 2
2018-10-23
Selective Growth For High-aspect Ratio Metal Fill
App 20170033222 - WU; Chih-Nan ;   et al.
2017-02-02

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