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name:-0.0071790218353271
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HSU; Yu-Nu Patent Filings

HSU; Yu-Nu

Patent Applications and Registrations

Patent applications and USPTO patent grants for HSU; Yu-Nu.The latest application filed is for "method for forming package structure with a barrier layer".

Company Profile
7.6.8
  • HSU; Yu-Nu - Tainan City TW
  • Hsu; Yu-Nu - Tainan TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method For Forming Package Structure With A Barrier Layer
App 20210035937 - CHEN; Cheng-Hung ;   et al.
2021-02-04
Conductive External Connector Structure and Method of Forming
App 20200373267 - Shih; Meng-Fu ;   et al.
2020-11-26
Package structure with a barrier layer and method for forming the same
Grant 10,811,377 - Chen , et al. October 20, 2
2020-10-20
Conductive external connector structure and method of forming
Grant 10,741,513 - Shih , et al. A
2020-08-11
Semiconductor Device Manufacturing Method And Associated Semiconductor Die
App 20200020655 - TSAI; MING-HO ;   et al.
2020-01-16
Package Structure And Method For Forming The Same
App 20190189577 - CHEN; Cheng-Hung ;   et al.
2019-06-20
Conductive External Connector Structure and Method of Forming
App 20190131263 - Shih; Meng-Fu ;   et al.
2019-05-02
Conductive external connector structure and method of forming
Grant 10,163,836 - Shih , et al. Dec
2018-12-25
Conductive External Connector Structure and Method of Forming
App 20180166409 - Shih; Meng-Fu ;   et al.
2018-06-14
Conductive external connector structure and method of forming
Grant 9,875,979 - Shih , et al. January 23, 2
2018-01-23
Conductive External Connector Structure and Method of Forming
App 20170141059 - Shih; Meng-Fu ;   et al.
2017-05-18
Multi-sacrificial layer and method
Grant 8,722,537 - Huang , et al. May 13, 2
2014-05-13
Multi-Sacrificial Layer and Method
App 20100240215 - Huang; Yao-Te ;   et al.
2010-09-23

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