HSU; Yu-Chen
Patent Applications and Registrations
Patent applications and USPTO patent grants for HSU; Yu-Chen.The latest application filed is for "probe module having microelectromechanical probe and method of manufacturing the same".
Company Profile
10.23.39
- HSU; Yu-Chen - Chu-Pei City TW
- Hsu; Yu-Chen - Hsinchu TW
- HSU; Yu-Chen - Beitou Dist TW
- Hsu; Yu-Chen - Hsin-Chu TW
- Hsu; Yu-Chen - Hsinchu Shien TW
- HSU; YU-CHEN - TAICHUNG CITY TW
- HSU; Yu-Chen - Hsinchu County TW
- Hsu; Yu Chen - New Taipei TW
- Hsu; Yu Chen - New Taipei City TW
- Hsu; Yu-Chen - Taipei TW
- Hsu; Yu-Chen - Taipei City TW
- Hsu; Yu-Chen - Tao Yuan Shien TW
- Hsu; Yu-Chen - Kuei Shan Hsiang TW
Patent Activity
| Patent | Date |
|---|---|
| Probe Module Having Microelectromechanical Probe And Method Of Manufacturing The Same App 20220043027 - HSU; Yu-Chen ; et al. | 2022-02-10 |
| Stress reduction apparatus and method Grant 11,244,940 - Chuang , et al. February 8, 2 | 2022-02-08 |
| Image Fusion For Image Capture And Processing Systems App 20210390747 - FENG; Wen-Chun ; et al. | 2021-12-16 |
| Semiconductor Package And Manufacturing Method Thereof App 20210305122 - Lai; Wei-Chih ; et al. | 2021-09-30 |
| Stress Reduction Apparatus and Method App 20200321326 - Chuang; Yao-Chun ; et al. | 2020-10-08 |
| Stress reduction apparatus and method Grant 10,692,848 - Chuang , et al. | 2020-06-23 |
| Probe Module Having Microelectromechanical Probe And Method Of Manufacturing The Same App 20200116758 - HSU; Yu-Chen ; et al. | 2020-04-16 |
| Stress Reduction Apparatus and Method App 20200006311 - Chuang; Yao-Chun ; et al. | 2020-01-02 |
| Probe module having cantilever MEMS probe and method of making the same Grant 10,436,818 - Hsu , et al. O | 2019-10-08 |
| Bone Graft Composition With Osteogenic Capacity App 20190231926 - CHEN; SUNG-CHING ; et al. | 2019-08-01 |
| Pre-applying supporting materials between bonded package components Grant 10,366,971 - Hsu , et al. July 30, 2 | 2019-07-30 |
| Probe Card App 20190212368 - HSU; Hsien-Ta ; et al. | 2019-07-11 |
| Electronic device Grant 10,290,919 - Hsu , et al. | 2019-05-14 |
| Electronic Device App 20190006736 - Hsu; Yu Chen ; et al. | 2019-01-03 |
| Microelectromechanical Probe And Probe Head Having The Same App 20180267083 - WEI; Shao-Lun ; et al. | 2018-09-20 |
| Probe Module Having Cantilever Mems Probe And Method Of Making The Same App 20180024163 - HSU; YU-CHEN ; et al. | 2018-01-25 |
| Seal rings structures in semiconductor device interconnect layers and methods of forming the same Grant 9,780,046 - Pan , et al. October 3, 2 | 2017-10-03 |
| Microelectromechanical Probe, Method Of Manufacturing The Same And Probe Set App 20170176497 - WEI; Shao-Lun ; et al. | 2017-06-22 |
| Packages with molding material forming steps Grant 9,673,184 - Hsu , et al. June 6, 2 | 2017-06-06 |
| Seal Rings Structures In Semiconductor Device Interconnect Layers And Methods Of Forming The Same App 20170141052 - Pan; Hsin-Yu ; et al. | 2017-05-18 |
| Pre-Applying Supporting Materials Between Bonded Package Components App 20160172348 - Hsu; Yu-Chen ; et al. | 2016-06-16 |
| Stress Reduction Apparatus and Method App 20160155733 - Chuang; Yao-Chun ; et al. | 2016-06-02 |
| Pre-applying supporting materials between bonded package components Grant 9,293,404 - Hsu , et al. March 22, 2 | 2016-03-22 |
| Stress reduction apparatus Grant 9,257,412 - Chuang , et al. February 9, 2 | 2016-02-09 |
| Probe And Method For Manufacturing The Probe App 20150355235 - HSU; Yu-Chen ; et al. | 2015-12-10 |
| Bump interconnection techniques Grant 9,053,990 - Chuang , et al. June 9, 2 | 2015-06-09 |
| Packages with Molding Material Forming Steps App 20150147847 - Hsu; Yu-Chen ; et al. | 2015-05-28 |
| Packages with molding material forming steps Grant 8,970,024 - Hsu , et al. March 3, 2 | 2015-03-03 |
| Packages with Molding Material Forming Steps App 20140264810 - Hsu; Yu-Chen ; et al. | 2014-09-18 |
| Electronic-ink display panel Grant 8,797,255 - Hsu , et al. August 5, 2 | 2014-08-05 |
| Pre-Applying Supporting Materials between Bonded Package Components App 20140203456 - Hsu; Yu-Chen ; et al. | 2014-07-24 |
| Bump Interconnection Ratio for Robust CPI Window App 20140117532 - Chuang; Chita ; et al. | 2014-05-01 |
| Stress Reduction Apparatus App 20140070402 - Chuang; Yao-Chun ; et al. | 2014-03-13 |
| Repairing method and structure of display electrode Grant 8,643,577 - Chiou , et al. February 4, 2 | 2014-02-04 |
| Thin film transistor array substrate and electronic ink display device Grant 8,115,202 - Hsu , et al. February 14, 2 | 2012-02-14 |
| Pin definition layout of electronic paper display screen Grant 8,063,314 - Hsu , et al. November 22, 2 | 2011-11-22 |
| Electronic-ink display apparatus and the manufacturing method thereof Grant 7,884,363 - Hsu , et al. February 8, 2 | 2011-02-08 |
| E-ink display and method for repairing the same Grant 7,816,190 - Hsu , et al. October 19, 2 | 2010-10-19 |
| E-ink display and method for repairing the same Grant 7,687,806 - Hsu , et al. March 30, 2 | 2010-03-30 |
| Pin Definition Layout Of Electronic Paper Display Screen App 20100014222 - Hsu; Yu-Chen ; et al. | 2010-01-21 |
| Electronic-Ink Display Panel App 20080273132 - Hsu; Yu-Chen ; et al. | 2008-11-06 |
| Repairing Method and Structure of Display Electrode App 20080224991 - Chiou; Chih-Chien ; et al. | 2008-09-18 |
| Electronic-ink Display Apparatus And The Manufacturing Method Thereof App 20080142801 - Hsu; Yu-Chen ; et al. | 2008-06-19 |
| Electronic ink display device and active device array substrate App 20080143640 - Hsu; Yu-Chen ; et al. | 2008-06-19 |
| E-ink display panel App 20080043317 - Hsu; Yu-Chen ; et al. | 2008-02-21 |
| Electronic ink display panel App 20080024427 - Kuo; Chia-Hao ; et al. | 2008-01-31 |
| Active matrix device App 20070268637 - Hsu; Yu-Chen ; et al. | 2007-11-22 |
| E-ink display panel and active device array substrate thereof App 20070228379 - Hsu; Yu-Chen ; et al. | 2007-10-04 |
| Thin film transistor array substrate and electronic ink display device App 20070228389 - Hsu; Yu-Chen ; et al. | 2007-10-04 |
| Thin film transistor array substrate and electronic ink display device App 20070234151 - Hsu; Yu-Chen ; et al. | 2007-10-04 |
| E-ink display and method for repairing the same App 20070224742 - Hsu; Yu-Chen ; et al. | 2007-09-27 |
| E-ink display and method for repairing the same App 20070221951 - Hsu; Yu-Chen ; et al. | 2007-09-27 |
| Light source protective structure of a backlight module Grant 7,267,472 - Shiau , et al. September 11, 2 | 2007-09-11 |
| Lamp positioning structure Grant 7,264,365 - Kuo , et al. September 4, 2 | 2007-09-04 |
| Electronic Ink Display App 20070195252 - Tsai; Yu-chi ; et al. | 2007-08-23 |
| Active-matrix display panel App 20060232738 - Lin; Tung-Liang ; et al. | 2006-10-19 |
| Lamp positioning structure App 20060171169 - Kuo; Yi-Chen ; et al. | 2006-08-03 |
| Light source protective structure of a backlight module App 20060092670 - Shiau; Deng-Kuen ; et al. | 2006-05-04 |
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