Hsu; Wen Tsung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hsu; Wen Tsung.The latest application filed is for "semiconductor package".
- Hsu; Wen Tsung - Kaohsiung TW
- Hsu; Wen-Tsung - Taipei City TW
- Hsu; Wen-Tsung - Tainan TW
| Patent | Date |
|---|---|
| Semiconductor package having improved package-on-package interconnection Grant 10,032,652 - Hsu , et al. July 24, 2 | 2018-07-24 |
| Semiconductor package including substrates spaced by at least one electrical connecting element Grant 9,922,917 - Yu , et al. March 20, 2 | 2018-03-20 |
| Semiconductor Package App 20160372397 - YU; Cheng-Hsien ; et al. | 2016-12-22 |
| Semiconductor package Grant 9,443,785 - Yu , et al. September 13, 2 | 2016-09-13 |
| Semiconductor Package App 20160181176 - YU; Cheng-Hsien ; et al. | 2016-06-23 |
| Semiconductor Package And Method Of Manufacturing The Same App 20160163612 - HSU; Wen Tsung ; et al. | 2016-06-09 |
| Boosting adaptor for jack App 20060185472 - Chiu; Ting-Yin ; et al. | 2006-08-24 |
| Air-permeable buffering structure Grant 5,753,332 - Hsu May 19, 1 | 1998-05-19 |
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