Hsu, Wen-Rui
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hsu, Wen-Rui.The latest application filed is for "monolithic microwave integrated circuit package having thermal via".
- Hsu, Wen-Rui - Taoyuan TW
- Hsu, Wen-Rui - Tao Yuan TW
| Patent | Date |
|---|---|
| Monolithic microwave integrated circuit package having thermal via App 20030160322 - Hsieh, Tsung-Ying ; et al. | 2003-08-28 |
| Flip Chip Package Of Monolithic Microwave Integrated Circuit App 20020180062 - Hsieh, Tsung-Ying ; et al. | 2002-12-05 |
| High power monolithic microwave integrated circuit package Grant 6,483,186 - Hsieh , et al. November 19, 2 | 2002-11-19 |
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