Hsu; Tsung-Ju
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hsu; Tsung-Ju.The latest application filed is for "adhesive composition".
- Hsu; Tsung-Ju - Taichung TW
- HSU; Tsung-Ju - Taichung City TW
- Hsu; Tsung-Ju - Fengyuan N/A TW
- Hsu; Tsung-Ju - Fengyuan City TW
| Patent | Date |
|---|---|
| Adhesive composition Grant 9,018,307 - Hsu , et al. April 28, 2 | 2015-04-28 |
| Adhesive Composition App 20140350185 - HSU; Tsung-Ju ; et al. | 2014-11-27 |
| Method for preparing nano silver particles Grant 8,882,879 - Hsu , et al. November 11, 2 | 2014-11-11 |
| Encapsulant compositions and method for fabricating encapsulant materials Grant 8,367,768 - Liu , et al. February 5, 2 | 2013-02-05 |
| Method For Preparing Nano Silver Particles App 20130008287 - HSU; Tsung-Ju ; et al. | 2013-01-10 |
| Flexible and Transparent Conductive Film Containing Silver Nanowires and Manufacturing Method Thereof App 20120196114 - HSU; Tsung-Ju ; et al. | 2012-08-02 |
| Silver Nanowires And Preparation Method Thereof App 20120164469 - HSU; Tsung-Ju ; et al. | 2012-06-28 |
| Encapsulant Compositions And Method For Fabricating Encapsulant Materials App 20100148666 - Liu; Lung-Chang ; et al. | 2010-06-17 |
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