Hsu; Shin-Ping

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hsu; Shin-Ping.The latest application filed is for "package structure".

Company Profile

0.6.6

Hsu; Shin-Ping - Hsin-Chu N/A TW
Hsu; Shin-Ping - Taoyuan TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package structure Grant 8,421,213 - Hsu , et al. April 16, 2	2013-04-16
Package substrate structure Grant 8,188,379 - Hsu May 29, 2	2012-05-29
Package substrate having embedded photosensitive semiconductor chip and fabrication method thereof Grant 8,129,829 - Hsu , et al. March 6, 2	2012-03-06
Package substrate having embedded semiconductor chip and fabrication method thereof Grant 7,973,397 - Hsu , et al. July 5, 2	2011-07-05
Method for fabricating printed circuit board having capacitance components Grant 7,908,744 - Hsu , et al. March 22, 2	2011-03-22
Package Structure App 20110042800 - Hsu; Shin-Ping ; et al.	2011-02-24
Method For Fabricating Printed Circuit Board Having Capacitance Components App 20100115767 - Hsu; Shin-Ping ; et al.	2010-05-13
Printed Circuit Board With Embedded Semiconductor Component and Method for Fabricating the Same App 20100006331 - Hsu; Shin-Ping	2010-01-14
Package Substrate Structure App 20100002405 - Hsu; Shin-Ping	2010-01-07
Circuit Board Having Semiconductor Chip Embedded Therein App 20100002406 - Hsu; Shin-Ping	2010-01-07
Package Substrate Having Embedded Semiconductor Chip And Fabrication Method Thereof App 20090309202 - Hsu; Shin-Ping ; et al.	2009-12-17

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