Hsu; Shih-Yuan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hsu; Shih-Yuan.The latest application filed is for "circuit and method for sensing a capacitance".
- Hsu; Shih-Yuan - Yunlin County TW
- Hsu; Shih-Yuan - Hsinchu N/A TW
- HSU; SHIH-YUAN - Hukou TW
| Patent | Date |
|---|---|
| Circuit and method for sensing a capacitance Grant 9,562,937 - Huang , et al. February 7, 2 | 2017-02-07 |
| Circuit And Method For Sensing A Capacitance App 20150260771 - HUANG; Chun-Chung ; et al. | 2015-09-17 |
| Circuit and method for sensing a capacitance Grant 9,075,486 - Huang , et al. July 7, 2 | 2015-07-07 |
| Sensing unit, sensing arrangement and sensing method for touch panel application Grant 8,952,922 - Lin , et al. February 10, 2 | 2015-02-10 |
| Light emitting diode package Grant 8,912,558 - Hu , et al. December 16, 2 | 2014-12-16 |
| Light emitting diode with sidewise light output structure and method for manufacturing the same Grant 8,890,192 - Hsu , et al. November 18, 2 | 2014-11-18 |
| Light Emitting Diode Package App 20140183587 - HU; PI-CHIANG ; et al. | 2014-07-03 |
| Light-emitting diode package and method for manufacturing the same Grant 8,709,842 - Hu , et al. April 29, 2 | 2014-04-29 |
| Method For Manufacturing Supporting Boards Of Light Emitting Diode Modules App 20130283609 - LIN; Hou-Te ; et al. | 2013-10-31 |
| Light emitting diode package Grant 8,569,779 - Wang , et al. October 29, 2 | 2013-10-29 |
| LED package with light-absorbing layer Grant 8,569,781 - Hu , et al. October 29, 2 | 2013-10-29 |
| Light Emitting Diode With Sidewise Light Output Structure And Method For Manufacturing The Same App 20130161671 - HSU; SHIH-YUAN ; et al. | 2013-06-27 |
| LED package and method for making the same Grant 8,471,287 - Hu , et al. June 25, 2 | 2013-06-25 |
| Led Package Device App 20130062642 - HU; PI-CHIANG ; et al. | 2013-03-14 |
| Light-emitting Diode Package And Method For Manufacturing The Same App 20130026520 - HU; PI-CHIANG ; et al. | 2013-01-31 |
| Light emitting diode package having improved wire bonding structure Grant 8,344,408 - Wang , et al. January 1, 2 | 2013-01-01 |
| Led Package And Method For Making The Same App 20120326175 - HU; PI-CHIANG ; et al. | 2012-12-27 |
| Led Package App 20120235193 - HU; PI-CHIANG ; et al. | 2012-09-20 |
| Light Emitting Diode Package App 20120175656 - FANG; JUNG-HSI ; et al. | 2012-07-12 |
| Light Emitting Diode Package App 20120161179 - FANG; JUNG-HSI ; et al. | 2012-06-28 |
| Light Emitting Diode Package App 20120153326 - WANG; KAI-LUN ; et al. | 2012-06-21 |
| Circuit And Method For Sensing A Capacitance App 20120146726 - HUANG; Chun-Chung ; et al. | 2012-06-14 |
| Led Package App 20120126265 - HSU; SHIH-YUAN ; et al. | 2012-05-24 |
| Light Emitting Diode Package Structure App 20120104438 - WANG; KAI-LUN ; et al. | 2012-05-03 |
| Light Emitting Diode Package App 20120098003 - WANG; KAI-LUN ; et al. | 2012-04-26 |
| Sensing Unit, Sensing Arrangement And Sensing Method For Touch Panel Application App 20110267312 - LIN; CHIA-HSING ; et al. | 2011-11-03 |
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