Hsu; Shao Ta

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hsu; Shao Ta.The latest application filed is for "capacitor array and method of fabricating the same".

Company Profile

0.8.11

Hsu; Shao Ta - Luzhu Township Taoyuan County TW
Hsu; Shao-Ta - Tai-Nan TW
Hsu; Shao-Ta - Tai-Nan City TW
HSU; SHAO-TA - Tainan City TW
Hsu; Shao-Ta - Tainan TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Capacitor array and method of fabricating the same Grant 8,921,977 - Huang , et al. December 30, 2	2014-12-30
Capacitor Array And Method Of Fabricating The Same App 20130161786 - Huang; Jen Jui ; et al.	2013-06-27
Method of forming metal-oxide-semiconductor transistors Grant 7,642,166 - Lee , et al. January 5, 2	2010-01-05
STI of a semiconductor device and fabrication method thereof Grant 7,541,298 - Hsu , et al. June 2, 2	2009-06-02
Method Of Forming Metal-oxide-semiconductor Transistors App 20090068805 - Lee; Kun-Hsien ; et al.	2009-03-12
Metal-oxide-semiconductor transistor and method of forming the same Grant 7,494,878 - Lee , et al. February 24, 2	2009-02-24
Semiconductor Device, Method For Fabricating Thereof And Method For Increasing Film Stress App 20080188091 - HSU; SHAO-TA ; et al.	2008-08-07
Smiconductor Device, Method For Fabricating Thereof And Method For Increasing Film Stress App 20080185655 - Hsu; Shao-Ta ; et al.	2008-08-07
Sti Of A Semiconductor Device And Fabrication Method Thereof App 20080166888 - Hsu; Shao-Ta ; et al.	2008-07-10
Metal-oxide-semiconductor Transistor And Method Of Forming The Same App 20080099801 - Lee; Kun-Hsien ; et al.	2008-05-01
Method of forming contact Grant 7,294,572 - Yang , et al. November 13, 2	2007-11-13
Seamless trench fill method utilizing sub-atmospheric pressure chemical vapor deposition technique Grant 7,238,586 - Hsu , et al. July 3, 2	2007-07-03
Method Of Forming Contact App 20070117375 - Yang; Chao-Lon ; et al.	2007-05-24
MIM structure and fabrication process with improved capacitance reliability Grant 7,205,634 - Liao , et al. April 17, 2	2007-04-17
Seamless Trench Fill Method Utilizing Sub-atmospheric Pressure Chemical Vapor Deposition Technique App 20070020875 - Hsu; Shao-Ta ; et al.	2007-01-25
Method and structure for improving adhesion between intermetal dielectric layer and cap layer App 20050253268 - Hsu, Shao-Ta ; et al.	2005-11-17
MIM structure and fabrication process with improved capacitance reliability App 20050202616 - Liao, Miao-Cheng ; et al.	2005-09-15

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