HSU; Min-Wei
Patent Applications and Registrations
Patent applications and USPTO patent grants for HSU; Min-Wei.The latest application filed is for "electrically and thermally conductive gaskets".
- HSU; Min-Wei - New Taipei City TW
- Hsu; Min-Wei - New Taipei TW
| Patent | Date |
|---|---|
| Electrically And Thermally Conductive Gaskets App 20220186835 - LIN; Yi-Shen ; et al. | 2022-06-16 |
| Systems And Methods Of Applying Materials To Components App 20220023984 - TSAI; Tsang-I ; et al. | 2022-01-27 |
| Systems and methods of applying materials to components Grant 11,141,823 - Tsai , et al. October 12, 2 | 2021-10-12 |
| Systems And Methods Of Applying Materials To Components App 20190329367 - TSAI; Tsang-I ; et al. | 2019-10-31 |
| Flame retardant, electrically conductive adhesive materials and related methods Grant 8,968,861 - Creasy, Jr. , et al. March 3, 2 | 2015-03-03 |
| Flame Retardant, Electrically Conductive Adhesive Materials And Related Methods App 20140272351 - Creasy, JR.; Larry Don ; et al. | 2014-09-18 |
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