loadpatents
Patent applications and USPTO patent grants for Hsu; Min-Shiang.The latest application filed is for "semiconductor structure with super via and manufacturing method thereof".
Patent | Date |
---|---|
Semiconductor structure with super via and manufacturing method thereof App 20220216144 - Hsu; Min-Shiang ;   et al. | 2022-07-07 |
Interconnection structure and manufacturing method thereof Grant 11,127,675 - Hsu , et al. September 21, 2 | 2021-09-21 |
Interconnection Structure And Manufacturing Method Thereof App 20210159170 - Hsu; Min-Shiang ;   et al. | 2021-05-27 |
Semiconductor device and method for fabricating the same Grant 10,600,732 - Hsu , et al. | 2020-03-24 |
Semiconductor Device And Method For Fabricating The Same App 20200075480 - Hsu; Min-Shiang ;   et al. | 2020-03-05 |
Method for removing damaged layer embedded in a dielectric layer Grant 10,204,826 - Hsu , et al. Feb | 2019-02-12 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.