Hsu; Marcus

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hsu; Marcus.The latest application filed is for "package having a substrate comprising surface interconnects aligned with a surface of the substrate".

Company Profile

3.3.9

Hsu; Marcus - San Diego CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated circuit (IC) packages employing split, double-sided metallization structures to facilitate a semiconductor die ("die") module employing stacked dice, and related fabrication methods Grant 11,456,291 - We , et al. September 27, 2	2022-09-27
Package Having A Substrate Comprising Surface Interconnects Aligned With A Surface Of The Substrate App 20220246496 - WE; Hong Bok ; et al.	2022-08-04
Package comprising a substrate configured as a heat spreader Grant 11,404,343 - Rae , et al. August 2, 2	2022-08-02
Bump Pad Structure App 20220102298 - KANG; Kuiwon ; et al.	2022-03-31
Redistribution Layer Connection App 20220028816 - PATIL; Aniket ; et al.	2022-01-27
Integrated Circuit (ic) Packages Employing Split, Double-sided Metallization Structures To Facilitate A Semiconductor Die ("die") Module Employing Stacked Dice, And Related Fabrication Methods App 20210407979 - We; Hong Bok ; et al.	2021-12-30
Passive Component Embedded In An Embedded Trace Substrate (ets) App 20210407918 - KANG; Kuiwon ; et al.	2021-12-30
Integrated Circuit (ic) Packages Employing Split, Double-sided Metallization Structures To Facilitate A Semiconductor Die ("die") Module Employing Stacked Dice, And Related Fabrication Methods App 20210280523 - We; Hong Bok ; et al.	2021-09-09
Package Comprising A Substrate Configured As A Heat Spreader App 20210249325 - RAE; David Fraser ; et al.	2021-08-12
High density embedded interconnects in substrate Grant 10,804,195 - Kang , et al. October 13, 2	2020-10-13
High Density Embedded Interconnects In Substrate App 20200051907 - KANG; Kuiwon ; et al.	2020-02-13
Symmetric Embedded Trace Substrate App 20180350630 - KANG; Kuiwon ; et al.	2018-12-06

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