HSU; LI-HAN
Patent Applications and Registrations
Patent applications and USPTO patent grants for HSU; LI-HAN.The latest application filed is for "communication apparatus and bracket device thereof".
Company Profile
20.84.44
- HSU; LI-HAN - HSINCHU TW
- Hsu; Li-Han - Hsin-Chu City TW
- Hsu; Li-Han - Hsin-Chu TW
- Hsu; Li-Han - Torrance CA
- HSU; Li-Han - Hsinchu City TW
- Hsu; Li-Han - Lomita CA
Patent Activity
| Patent | Date |
|---|---|
| Communication Apparatus And Bracket Device Thereof App 20220268400 - YANG; LAN-CHUN ; et al. | 2022-08-25 |
| Semiconductor Package With Redistribution Structure And Manufacturing Method Thereof App 20220093526 - Wu; Wei-Cheng ; et al. | 2022-03-24 |
| Semiconductor package including shielding plate in redistribution structure, semiconductor package including conductive via in redistribution structure, and manufacturing method thereof Grant 11,195,802 - Wu , et al. December 7, 2 | 2021-12-07 |
| Semiconductor Package And Manufacturing Method Thereof App 20210305122 - Lai; Wei-Chih ; et al. | 2021-09-30 |
| Connector for Modular Rack Assembly App 20210267363 - Hsu; Li-Han | 2021-09-02 |
| Method for forming package structure Grant 11,069,625 - Hsieh , et al. July 20, 2 | 2021-07-20 |
| Semiconductor Device App 20210217682 - Chiu; Chien-Chia ; et al. | 2021-07-15 |
| Redistribution Layers in Semiconductor Packages and Methods of Forming Same App 20210193618 - Hsieh; Cheng-Hsien ; et al. | 2021-06-24 |
| Opening in the Pad for Bonding Integrated Passive Device in InFO Package App 20210185810 - Hsieh; Cheng-Hsien ; et al. | 2021-06-17 |
| Connector for modular rack assembly Grant 11,013,318 - Hsu May 25, 2 | 2021-05-25 |
| Dummy features in redistribution layers (RDLS) and methods of forming same Grant 11,018,088 - Hsieh , et al. May 25, 2 | 2021-05-25 |
| Semiconductor device Grant 10,971,425 - Chiu , et al. April 6, 2 | 2021-04-06 |
| Semiconductor Package And Manufacturing Method Thereof App 20210098391 - Wu; Wei-Cheng ; et al. | 2021-04-01 |
| Redistribution layers in semiconductor packages and methods of forming same Grant 10,950,577 - Hsieh , et al. March 16, 2 | 2021-03-16 |
| Opening in the pad for bonding integrated passive device in InFO package Grant 10,939,551 - Hsieh , et al. March 2, 2 | 2021-03-02 |
| Dummy metal with zigzagged edges Grant 10,867,900 - Hsieh , et al. December 15, 2 | 2020-12-15 |
| Semiconductor Package and Method of Forming the Same App 20200343193 - Hsieh; Cheng-Hsien ; et al. | 2020-10-29 |
| Connector for Modular Rack Assembly App 20200281352 - Hsu; Li-Han | 2020-09-10 |
| Semiconductor package and method of forming the same Grant 10,714,426 - Hsieh , et al. | 2020-07-14 |
| Connector for modular rack assembly Grant 10,667,604 - Hsu | 2020-06-02 |
| Conductive vias in semiconductor packages and methods of forming same Grant 10,629,537 - Hsieh , et al. | 2020-04-21 |
| Semiconductor Device App 20200105640 - Chiu; Chien-Chia ; et al. | 2020-04-02 |
| Dummy Metal with Zigzagged Edges App 20200083156 - Hsieh; Cheng-Hsien ; et al. | 2020-03-12 |
| Redistribution Layers in Semiconductor Packages and Methods of Forming Same App 20200058616 - Hsieh; Cheng-Hsien ; et al. | 2020-02-20 |
| Connector for Modular Rack Assembly App 20190380485 - Hsu; Li-Han | 2019-12-19 |
| Dummy metal with zigzagged edges Grant 10,510,654 - Hsieh , et al. Dec | 2019-12-17 |
| Package structures and method of forming the same Grant 10,504,751 - Chen , et al. Dec | 2019-12-10 |
| Redistribution layers in semiconductor packages and methods of forming same Grant 10,475,768 - Hsieh , et al. Nov | 2019-11-12 |
| Dummy Features in Redistribution Layers (RDLS) and Methods of Forming Same App 20190295955 - Hsieh; Cheng-Hsien ; et al. | 2019-09-26 |
| Connector for modular rack assembly Grant 10,398,224 - Hsu Sep | 2019-09-03 |
| Dummy features in redistribution layers (RDLS) and methods of forming same Grant 10,319,681 - Hsieh , et al. | 2019-06-11 |
| Conductive vias in semiconductor packages and methods of forming same Grant 10,290,584 - Hsieh , et al. | 2019-05-14 |
| Method For Forming Package Structure App 20190131249 - HSIEH; Cheng-Hsien ; et al. | 2019-05-02 |
| Dummy Metal with Zigzagged Edges App 20190122975 - Hsieh; Cheng-Hsien ; et al. | 2019-04-25 |
| Conductive Vias in Semiconductor Packages and Methods of Forming Same App 20190115299 - Hsieh; Cheng-Hsien ; et al. | 2019-04-18 |
| Opening in the Pad for Bonding Integrated Passive Device in InFO Package App 20190098756 - Hsieh; Cheng-Hsien ; et al. | 2019-03-28 |
| Pan rack Grant D843,792 - Hsu | 2019-03-26 |
| Utility rack Grant D840,728 - Hsu Feb | 2019-02-19 |
| Package structure and method for forming the same Grant 10,163,805 - Hsieh , et al. Dec | 2018-12-25 |
| Opening in the pad for bonding integrated passive device in InFO package Grant 10,165,682 - Hsieh , et al. Dec | 2018-12-25 |
| Semiconductor Package and Method of Forming the Same App 20180366412 - Hsieh; Cheng-Hsien ; et al. | 2018-12-20 |
| Dummy metal with zigzagged edges Grant 10,157,825 - Hsieh , et al. Dec | 2018-12-18 |
| Conductive Vias In Semiconductor Packages And Methods Of Forming Same App 20180350745 - Hsieh; Cheng-Hsien ; et al. | 2018-12-06 |
| Package Structures and Method of Forming the Same App 20180330969 - Chen; Hsien-Wei ; et al. | 2018-11-15 |
| Drawer organizer Grant D830,792 - Hsu October 16, 2 | 2018-10-16 |
| Dummy Features in Redistribution Layers (RDLS) and Methods of Forming Same App 20180294228 - Hsieh; Cheng-Hsien ; et al. | 2018-10-11 |
| Semiconductor package and method of forming the same Grant 10,062,648 - Hsieh , et al. August 28, 2 | 2018-08-28 |
| Package structures and method of forming the same Grant 10,032,651 - Chen , et al. July 24, 2 | 2018-07-24 |
| Dummy features in redistribution layers (RDLS) and methods of forming same Grant 9,997,464 - Hsieh , et al. June 12, 2 | 2018-06-12 |
| Trivet Grant D820,034 - Hsu , et al. June 12, 2 | 2018-06-12 |
| Trivet Grant D820,035 - Hsu , et al. June 12, 2 | 2018-06-12 |
| Connector for Modular Rack Assembly App 20180084905 - Hsu; Li-Han | 2018-03-29 |
| Redistribution Layers in Semiconductor Packages and Methods of Forming Same App 20180076175 - Hsieh; Cheng-Hsien ; et al. | 2018-03-15 |
| Utility rack Grant D808,690 - Hsu January 30, 2 | 2018-01-30 |
| Package Structure And Method For Forming The Same App 20180005955 - HSIEH; Cheng-Hsien ; et al. | 2018-01-04 |
| Organizer Grant D804,864 - Hsu December 12, 2 | 2017-12-12 |
| Connector for modular rack assembly Grant 9,833,066 - Hsu December 5, 2 | 2017-12-05 |
| Integrated fan-out package, semiconductor device, and method of fabricating the same Grant 9,812,426 - Wang , et al. November 7, 2 | 2017-11-07 |
| Dummy Features In Redistribution Layers (rdls) And Methods Of Forming Same App 20170317029 - Hsieh; Cheng-Hsien ; et al. | 2017-11-02 |
| Mesh holder Grant D799,831 - Hsu , et al. October 17, 2 | 2017-10-17 |
| Chip-on-wafer process control monitoring for chip-on-wafer-on-substrate packages Grant 9,786,567 - Wu , et al. October 10, 2 | 2017-10-10 |
| Dummy structure for chip-on-wafer-on-substrate Grant 9,754,831 - Kuo , et al. September 5, 2 | 2017-09-05 |
| Semiconductor Package And Method Of Forming The Same App 20170250138 - Hsieh; Cheng-Hsien ; et al. | 2017-08-31 |
| Drawer organizer Grant D795,655 - Hsu August 29, 2 | 2017-08-29 |
| Redistribution layers in semiconductor packages and methods of forming same Grant 9,741,690 - Hsieh , et al. August 22, 2 | 2017-08-22 |
| Mesh basket Grant D792,099 - Hsu , et al. July 18, 2 | 2017-07-18 |
| Opening in the Pad for Bonding Integrated Passive Device in InFO Package App 20170188458 - Hsieh; Cheng-Hsien ; et al. | 2017-06-29 |
| Shoe rack Grant D787,242 - Hsu May 23, 2 | 2017-05-23 |
| Drawer organizer Grant D787,279 - Hsu May 23, 2 | 2017-05-23 |
| Drawer organizer Grant D787,278 - Hsu May 23, 2 | 2017-05-23 |
| Drawer organizer Grant D786,629 - Hsu May 16, 2 | 2017-05-16 |
| Chip-on-Wafer Process Control Monitoring for Chip-on-Wafer-on-Substrate Packages App 20170133282 - Wu; Wei-Cheng ; et al. | 2017-05-11 |
| Dummy Metal with Zigzagged Edges App 20170084529 - Hsieh; Cheng-Hsien ; et al. | 2017-03-23 |
| Organizer Grant D781,055 - Hsu , et al. March 14, 2 | 2017-03-14 |
| Chip-on-wafer process control monitoring for chip-on-wafer-on-substrate packages Grant 9,581,638 - Wu , et al. February 28, 2 | 2017-02-28 |
| Mesh basket Grant D779,206 - Hsu , et al. February 21, 2 | 2017-02-21 |
| Napkin holder Grant D778,119 - Hsu , et al. February 7, 2 | 2017-02-07 |
| Fruit bowl Grant D777,525 - Hsu January 31, 2 | 2017-01-31 |
| Dummy Structure for Chip-on-Wafer-on-Substrate App 20160358818 - Kuo; Pei-Ching ; et al. | 2016-12-08 |
| Paper towel holder Grant D771,969 - Hsu November 22, 2 | 2016-11-22 |
| Dummy metal with zigzagged edges Grant 9,502,343 - Hsieh , et al. November 22, 2 | 2016-11-22 |
| Cutlery caddy Grant D770,864 - Hsu , et al. November 8, 2 | 2016-11-08 |
| Shelf organizer Grant D764,844 - Hsu , et al. August 30, 2 | 2016-08-30 |
| Dummy structure for chip-on-wafer-on-substrate Grant 9,425,126 - Kuo , et al. August 23, 2 | 2016-08-23 |
| Package Structures and Method of Forming the Same App 20160240391 - Chen; Hsien-Wei ; et al. | 2016-08-18 |
| Modular utility rack Grant D762,402 - Hsu August 2, 2 | 2016-08-02 |
| Connector for Modular Rack Assembly App 20160206091 - Hsu; Li-Han | 2016-07-21 |
| Turntable Grant D761,621 - Hsu , et al. July 19, 2 | 2016-07-19 |
| Shelf organizer Grant D753,418 - Hsu April 12, 2 | 2016-04-12 |
| Organizer Grant D748,938 - Hsu , et al. February 9, 2 | 2016-02-09 |
| Organizer Grant D748,939 - Hsu , et al. February 9, 2 | 2016-02-09 |
| Connector for modular rack assembly Grant 9,247,809 - Hsu February 2, 2 | 2016-02-02 |
| Shelf organizer Grant D746,089 - Hsu , et al. December 29, 2 | 2015-12-29 |
| Bin Grant D745,781 - Hsu December 22, 2 | 2015-12-22 |
| Dummy Structure for Chip-on-Wafer-on-Substrate App 20150348872 - Kuo; Pei-Ching ; et al. | 2015-12-03 |
| Shelf Grant D742,664 - Hsu , et al. November 10, 2 | 2015-11-10 |
| Organizer Grant D742,145 - Hsu , et al. November 3, 2 | 2015-11-03 |
| Modular utility rack Grant D732,323 - Ho , et al. June 23, 2 | 2015-06-23 |
| Modular utility rack Grant D731,212 - Hsu , et al. June 9, 2 | 2015-06-09 |
| Probe pad design for 3DIC package yield analysis Grant 8,878,182 - Wang , et al. November 4, 2 | 2014-11-04 |
| Step shelf Grant D716,590 - Hsu , et al. November 4, 2 | 2014-11-04 |
| Shelf organizer Grant D716,077 - Hsu October 28, 2 | 2014-10-28 |
| Corner shelf Grant D716,083 - Hsu , et al. October 28, 2 | 2014-10-28 |
| Shelf organizer Grant D714,084 - Hsu , et al. September 30, 2 | 2014-09-30 |
| Chip-on-Wafer Process Control Monitoring for Chip-on-Wafer-on-Substrate Packages App 20140266283 - Wu; Wei-Cheng ; et al. | 2014-09-18 |
| Corner shelf organizer Grant D709,717 - Hsu July 29, 2 | 2014-07-29 |
| Organizer Grant D709,719 - Hsu July 29, 2 | 2014-07-29 |
| Shelf organizer Grant D704,482 - Hsu , et al. May 13, 2 | 2014-05-13 |
| Modular utility rack Grant D703,468 - Ho , et al. April 29, 2 | 2014-04-29 |
| Modular utility rack Grant D703,467 - Ho , et al. April 29, 2 | 2014-04-29 |
| Modular utility rack Grant D699,485 - Hsu , et al. February 18, 2 | 2014-02-18 |
| Basket organizer Grant D696,049 - Hsu , et al. December 24, 2 | 2013-12-24 |
| Probe Pad Design for 3DIC Package Yield Analysis App 20130092935 - Wang; Tzu-Yu ; et al. | 2013-04-18 |
| High frequency flip chip package structure of polymer substrate Grant 8,258,606 - Chang , et al. September 4, 2 | 2012-09-04 |
| Vertical transmission line structure that includes bump elements for flip-chip mounting Grant 8,169,276 - Chang , et al. May 1, 2 | 2012-05-01 |
| High frequency flip chip package process of polymer substrate and structure thereof Grant 8,033,039 - Chang , et al. October 11, 2 | 2011-10-11 |
| High Frequency Flip Chip Package Structure Of Polymer Substrate App 20110186974 - Chang; Edward-yi ; et al. | 2011-08-04 |
| Storage rack Grant 7,967,156 - Hsu June 28, 2 | 2011-06-28 |
| Vertical Transmission Structure App 20110121923 - Chang; Edward Yi ; et al. | 2011-05-26 |
| Vertical transmission line structure that includes bump elements for flip-chip mounting Grant 7,940,143 - Chang , et al. May 10, 2 | 2011-05-10 |
| Storage Rack App 20100252520 - HSU; Li-Han | 2010-10-07 |
| High Frequency Flip Chip Package Process of Polymer Substrate and Structure thereof App 20100248430 - Chang; Edward-yi ; et al. | 2010-09-30 |
| Storage rack App 20090314731 - Hsu; Li-Han | 2009-12-24 |
| Vertical Transmission Structure App 20090267201 - Chang; Edward Yi ; et al. | 2009-10-29 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 