Hsu; Kun-Chi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hsu; Kun-Chi.The latest application filed is for "head of a chip picker".
- Hsu; Kun-Chi - Hsinchu TW
- HSU; Kun-Chi - Hukou Township TW
- HSU; Kun-Chi - Hukou TW
- Hsu; Kun-Chi - Hsinchu County TW
| Patent | Date |
|---|---|
| Semiconductor package having partial outer metal layer and packaging method thereof Grant 11,410,945 - Chen , et al. August 9, 2 | 2022-08-09 |
| Head Of A Chip Picker App 20220118631 - CHOU; Wu-Yi ; et al. | 2022-04-21 |
| Laser Cutting Method For A Wafer App 20210339338 - CHIU; Chui-Liang ; et al. | 2021-11-04 |
| Semiconductor Package Having Partial Outer Metal Layer And Packaging Method Thereof App 20210288003 - CHEN; Shih-Chun ; et al. | 2021-09-16 |
| Chip Carrier Device App 20210217641 - CHEN; Shih-Chun ; et al. | 2021-07-15 |
| Semiconductor Packaging Structure With Back-deposited Shielding Layer And Manufacturing Method Thereof App 20210217632 - CHEN; Shih-Chun ; et al. | 2021-07-15 |
| Flux Transfer Tool And Flux Transfer Method App 20190275600 - Hsu; Kun-Chi ; et al. | 2019-09-12 |
| Flux Transfer Tool And Flux Transfer Method App 20190267346 - Hsu; Kun-Chi ; et al. | 2019-08-29 |
| Wafer processing method with full edge trimming Grant 10,388,535 - Chiu , et al. A | 2019-08-20 |
| Flux Transfer Method App 20190247944 - Hsu; Kun-Chi ; et al. | 2019-08-15 |
| Laser Color Marking Method For A Semiconductor Package App 20190229064 - Wu; Chin-Ta ; et al. | 2019-07-25 |
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