loadpatents
Patent applications and USPTO patent grants for Hsu; Jyh-Shiou.The latest application filed is for "interface tool".
Patent | Date |
---|---|
Interface Tool App 20220285192 - Hsu; Jyh-Shiou ;   et al. | 2022-09-08 |
Oxygen And Humidity Control In Storage Device App 20210235583 - YANG; Shen-Min ;   et al. | 2021-07-29 |
Method of manufacturing semiconductor structure Grant 10,991,604 - Hsu , et al. April 27, 2 | 2021-04-27 |
Method Of Manufacturing Semiconductor Structure App 20200035524 - HSU; JYH-SHIOU ;   et al. | 2020-01-30 |
System and method of cleaning FOUP Grant 9,579,697 - Hsu , et al. February 28, 2 | 2017-02-28 |
In-situ charging neutralization Grant 9,530,617 - Wu , et al. December 27, 2 | 2016-12-27 |
In-Situ Charging Neutralization App 20140210506 - Wu; Lin-Jung ;   et al. | 2014-07-31 |
System And Method Of Cleaning Foup App 20140158172 - Hsu; Jyh-Shiou ;   et al. | 2014-06-12 |
Trench photolithography rework for removal of photoresist residue Grant 7,265,053 - Hsu September 4, 2 | 2007-09-04 |
Method to improve etching of resist protective oxide (RPO) to prevent photo-resist peeling Grant 7,015,089 - Hsu , et al. March 21, 2 | 2006-03-21 |
Method to control spacer width Grant 7,001,784 - Hsu , et al. February 21, 2 | 2006-02-21 |
Trench photolithography rework for removal of photoresist residue App 20050239290 - Hsu, Jyh-Shiou | 2005-10-27 |
Novel method to control spacer width App 20050064722 - Hsu, Jyh-Shiou ;   et al. | 2005-03-24 |
Method to improve etching of resist protective oxide (RPO) to prevent photo-resist peeling App 20040092070 - Hsu, Jyh-Shiou ;   et al. | 2004-05-13 |
Plasma etching method to form dual damascene with improved via profile Grant 6,569,777 - Hsu , et al. May 27, 2 | 2003-05-27 |
Prevention of defects formed in photoresist during wet etching Grant 6,498,106 - Hsin , et al. December 24, 2 | 2002-12-24 |
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