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Hsu; Julia Wan-Ping Patent Filings

Hsu; Julia Wan-Ping

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hsu; Julia Wan-Ping.The latest application filed is for "forming electrical contacts to a molecular layer".

Company Profile
0.2.5
  • Hsu; Julia Wan-Ping - Berkeley Heights NJ
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Forming Electrical Contacts To A Molecular Layer
App 20070142619 - Hsu; Julia Wan-Ping ;   et al.
2007-06-21
Forming electrical contacts to a molecular layer
Grant 7,229,847 - Hsu , et al. June 12, 2
2007-06-12
Apparatus with improved layers of group III-nitride semiconductor
App 20040124427 - Hsu, Julia Wan-Ping ;   et al.
2004-07-01
Method for growing layers of group III-nitride semiconductor having electrically passivated threading defects
Grant 6,699,760 - Hsu , et al. March 2, 2
2004-03-02
Forming electrical contacts to a molecular layer
App 20030235921 - Hsu, Julia Wan-Ping ;   et al.
2003-12-25
Method For Growing Layers Of Group Iii - Nitride Semiconductor Having Electrically Passivated Threading Defects
App 20030235970 - Hsu, Julia Wan-Ping ;   et al.
2003-12-25
Forming electrical contacts to a molecular layer
App 20030175154 - Hsu, Julia Wan-Ping ;   et al.
2003-09-18

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