Hsu; Hsing-Chou

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hsu; Hsing-Chou.The latest application filed is for "measuring equipment for probe-effect cancellation and method thereof".

Company Profile

0.9.12

Hsu; Hsing-Chou - Sinshih Township Tainan County TW
Hsu; Hsing-Chou - Tainan County TW
Hsu; Hsing-Chou - Hsin-Tien TW
Hsu; Hsing-Chou - Taipei Hsien TW
Hsu; Hsing-Chou - Hsin-Tien City TW
Hsu; Hsing-Chou - Hsintien TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Impedance design method Grant 8,332,804 - Hsu , et al. December 11, 2	2012-12-11
Measuring Equipment For Probe-effect Cancellation And Method Thereof App 20120176150 - Hsu; Hsing-Chou ; et al.	2012-07-12
Impedance Design Method App 20120159413 - HSU; Hsing-Chou ; et al.	2012-06-21
Signal analyzing method for electronic device having on-chip network and off-chip network Grant 8,204,731 - Hsu , et al. June 19, 2	2012-06-19
Impedance design method Grant 8,151,241 - Hsu , et al. April 3, 2	2012-04-03
Circuit board with a reference plane having multi-part non-conductive regions for decreased crosstalk Grant 8,120,441 - Hsu , et al. February 21, 2	2012-02-21
Signal Analyzing Method For Electronic Device Having On-chip Network And Off-chip Network App 20110213604 - Hsu; Hsing-Chou ; et al.	2011-09-01
Impedance Design Method App 20110185336 - Hsu; Hsing-Chou ; et al.	2011-07-28
Circuit Board With Decreased Crosstalk App 20110128086 - Hsu; Hsing-Chou ; et al.	2011-06-02
Arrangement of non-signal through vias and wiring board applying the same Grant 7,615,708 - Hsu , et al. November 10, 2	2009-11-10
Plunger and chip-testing module applying the same Grant 7,586,320 - Wu , et al. September 8, 2	2009-09-08
Chip structure with arrangement of side pads Grant 7,449,788 - Liaw , et al. November 11, 2	2008-11-11
Signal transmission structure and circuit substrate thereof Grant 7,291,916 - Hsu , et al. November 6, 2	2007-11-06
Testing assembly for electrical test of electronic package and testing socket thereof Grant 7,279,913 - Wu , et al. October 9, 2	2007-10-09
Plunger and chip-testing module applying the same App 20070200583 - Wu; Hsin-Kuan ; et al.	2007-08-30
Arrangement of non-signal through vias and wiring board applying the same App 20070194432 - Hsu; Hsing-Chou ; et al.	2007-08-23
Differential signal transmission structure, wiring board, and chip package App 20070194434 - Lin; Chin-Sung ; et al.	2007-08-23
Lead arrangement and chip package using the same App 20070102794 - Hsiao; Chao-Yang ; et al.	2007-05-10
Testing assembly for electrical test of electronic package and testing socket thereof App 20060284634 - Wu; Hsin-Kuan ; et al.	2006-12-21
Chip structure with arrangement of side pads App 20060261496 - Liaw; Yuan-Tsang ; et al.	2006-11-23
Signal transmission structure and circuit substrate thereof App 20060065434 - Hsu; Chi-Hsing ; et al.	2006-03-30

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