Hsu; Hsi-Chang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hsu; Hsi-Chang.The latest application filed is for "electronic package and manufacturing method thereof".

Company Profile

3.8.15

Hsu; Hsi-Chang - Taichung City TW
Hsu; Hsi-Chang - Taichung TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic Package And Manufacturing Method Thereof App 20220181225 - Chen; Chi-Jen ; et al.	2022-06-09
Electronic Package And Fabrication Method Thereof App 20220173052 - Hsu; Chih-Hsun ; et al.	2022-06-02
Electronic Package, Packaging Substrate, And Methods For Fabricating The Same App 20210104465 - Ding; Jun-Chang ; et al.	2021-04-08
Electronic package, packaging substrate, and methods for fabricating the same Grant 10,903,167 - Ding , et al. January 26, 2	2021-01-26
Electronic Package, Packaging Substrate, And Methods For Fabricating The Same App 20200203277 - Ding; Jun-Chang ; et al.	2020-06-25
Positioning Structure Having Positioning Unit App 20190109092 - Tai; Rui-Feng ; et al.	2019-04-11
Package structure and fabrication method thereof Grant 9,607,974 - Lin , et al. March 28, 2	2017-03-28
Fabrication method of semiconductor package having embedded semiconductor elements Grant 9,397,081 - Chen , et al. July 19, 2	2016-07-19
Package Structure And Fabrication Method Thereof App 20160141227 - Lin; Chun-Tang ; et al.	2016-05-19
Fabrication Method Of Semiconductor Package Having Embedded Semiconductor Elements App 20160141281 - Chen; Yan-Heng ; et al.	2016-05-19
Package Structure And Fabrication Method Thereof App 20160005695 - Tai; Rui-Feng ; et al.	2016-01-07
Semiconductor package having embedded semiconductor elements Grant 9,177,859 - Chen , et al. November 3, 2	2015-11-03
Chip scale package with electronic component received in encapsulant, and fabrication method thereof Grant 9,040,361 - Chang , et al. May 26, 2	2015-05-26
Semiconductor Package And Fabrication Method Thereof App 20140332976 - Chen; Yan-Heng ; et al.	2014-11-13
Semiconductor package and method of manufacturing the same Grant 8,828,796 - Chi , et al. September 9, 2	2014-09-09
Semiconductor Package And Fabrication Method Thereof App 20140183721 - Chen; Yan-Heng ; et al.	2014-07-03
Method of fabricating a semiconductor package Grant 8,766,456 - Hsu , et al. July 1, 2	2014-07-01
Method For Fabricating Semiconductor Package App 20140134797 - Chi; Chieh-Yuan ; et al.	2014-05-15
Semiconductor Package And Method Of Fabricating The Same App 20140042638 - Liu; Hung-Wen ; et al.	2014-02-13
Method Of Fabricating A Semiconductor Package App 20140035156 - Hsu; Hsi-Chang ; et al.	2014-02-06
Chip-scale Package App 20120313243 - Chang; Chiang-Cheng ; et al.	2012-12-13
Chip Scale Package And Fabrication Method Thereof App 20120038044 - Chang; Chiang-Cheng ; et al.	2012-02-16

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