Hsu; Hou-Jun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hsu; Hou-Jun.The latest application filed is for "structure and method of forming pillar bumps with controllable shape and size".
- Hsu; Hou-Jun - Taipei TW
| Patent | Date |
|---|---|
| Method for packaging micromachined devices Grant 8,288,850 - Huang , et al. October 16, 2 | 2012-10-16 |
| Structure and method of forming pillar bumps with controllable shape and size App 20110244675 - Huang; Jung-Tang ; et al. | 2011-10-06 |
| General strength and sensitivity enhancement method for micromachined device App 20110115035 - Huang; Jung-Tang ; et al. | 2011-05-19 |
| Method for packaging micromachined devices App 20110018113 - Huang; Jung-Tang ; et al. | 2011-01-27 |
| Fabrication method for drug-eluting stent with medicine-compatible loading mechanisms App 20080255659 - Huang; Jung-Tang ; et al. | 2008-10-16 |
| Method of fabrication on high coplanarity of copper pillar for flip chip packaging application App 20070184579 - Huang; Jung-Tang ; et al. | 2007-08-09 |
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