Hsu; Heng-Ming

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hsu; Heng-Ming.The latest application filed is for "wireless communication device and signal receiving/transmitting method thereof".

Company Profile

0.12.9

Hsu; Heng-Ming - Sunnyvale CA
Hsu; Heng-Ming - Taichung TW
Hsu; Heng-Ming - Taichung City TW
Hsu; Heng-Ming - Tai-Chung TW
Hsu; Heng-Ming - Hsin-Chu TW
Hsu, Heng-Ming - Science-Based Industrial Park Hsin-chu TW
Hsu; Heng-Ming - Ta-Lie TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fine-grained attribute access control Grant 7,836,510 - Angal , et al. November 16, 2	2010-11-16
Wireless communication device and signal receiving/transmitting method thereof Grant 7,542,009 - Hsu , et al. June 2, 2	2009-06-02
Methods for more flexible SAML session Grant 7,506,162 - Hsu , et al. March 17, 2	2009-03-17
Wireless Communication Device And Signal Receiving/transmitting Method Thereof App 20080218428 - Hsu; Heng-Ming ; et al.	2008-09-11
Three dimensional transformer Grant 7,405,642 - Hsu , et al. July 29, 2	2008-07-29
Planar spiral inductor structure having enhanced Q value App 20080174398 - Hsu; Heng-Ming ; et al.	2008-07-24
Method and system for implementing policies, resources and privileges for using services in LDAP Grant 7,031,967 - Cheng , et al. April 18, 2	2006-04-18
Method and system for implementing policies, resources and privileges for using services in LDAP App 20050171958 - Cheng, Qingwen ; et al.	2005-08-04
Inductor device having improved quality factor Grant 6,903,644 - Wang , et al. June 7, 2	2005-06-07
Metal-insulator-metal (MIM) capacitor structure in copper-CMOS circuits using a pad protect layer Grant 6,881,996 - Chen , et al. April 19, 2	2005-04-19
Method for making a new metal-insulator-metal (MIM) capacitor structure in copper-CMOS circuits using a pad protect layer App 20050029566 - Chen, Chun-Hon ; et al.	2005-02-10
Inductor device having improved quality factor App 20050024176 - Wang, Sung-Hsiung ; et al.	2005-02-03
Method for making a new metal-insulator-metal (MIM) capacitor structure in copper-CMOS circuits using a pad protect layer Grant 6,812,088 - Chen , et al. November 2, 2	2004-11-02
Semiconductor device with a spiral inductor and magnetic material App 20030234436 - Hsu, Heng-Ming ; et al.	2003-12-25
Method of fabricating a damascene copper inductor structure using a sub-0.18 um CMOS process Grant 6,667,217 - Hsu , et al. December 23, 2	2003-12-23
Microelectronic inductor structure with annular magnetic shielding layer App 20030231093 - Hsu, Heng-Ming ; et al.	2003-12-18
Method and system for implementing policies, resources and privileges for using services in LDAP App 20030191763 - Cheng, Qingwen ; et al.	2003-10-09
Dual damascene interconnect structures that include radio frequency capacitors and inductors Grant 6,472,721 - Ma , et al. October 29, 2	2002-10-29
High Q inductor with Cu damascene via/trench etching simultaneous module Grant 6,444,517 - Hsu , et al. September 3, 2	2002-09-03
Copper MIM structure and process for mixed-signal and Rf capacitors and inductors App 20020019123 - Ma, Ssu-Pin ; et al.	2002-02-14
Copper process compatible CMOS metal-insulator-metal capacitor structure and its process flow Grant 6,329,234 - Ma , et al. December 11, 2	2001-12-11

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