loadpatents
Patent applications and USPTO patent grants for Hsu; Feng-Yu.The latest application filed is for "tube structure for preserving a flower".
Patent | Date |
---|---|
Tube Structure For Preserving A Flower App 20140137469 - Lin; Jui-Cheng ;   et al. | 2014-05-22 |
Method for manufacturing a dual damascene opening comprising a trench opening and a via opening Grant 8,084,357 - Chen , et al. December 27, 2 | 2011-12-27 |
Multi Cap Layer And Manufacturing Method Thereof App 20090283310 - Chen; Wei-Chih ;   et al. | 2009-11-19 |
Interconnect Structure App 20090146311 - Hsu; Feng-Yu ;   et al. | 2009-06-11 |
Interconnect structure and fabricating method thereof Grant 7,514,347 - Hsu , et al. April 7, 2 | 2009-04-07 |
Method of fabricating interconnect structure Grant 7,439,154 - Hsu , et al. October 21, 2 | 2008-10-21 |
Multi Cap Layer And Manufacturing Method Thereof App 20080251931 - Chen; Wei-Chih ;   et al. | 2008-10-16 |
Method Of Fabricating Interconnect Structure App 20070093053 - Hsu; Feng-Yu ;   et al. | 2007-04-26 |
Interconnect Structure And Fabricating Method Thereof App 20070085210 - Hsu; Feng-Yu ;   et al. | 2007-04-19 |
Interconnect Structure App 20070085208 - Hsu; Feng-Yu ;   et al. | 2007-04-19 |
Semiconductor Device With Low-resistance Inlaid Copper/barrier Interconnects And Method For Manufacturing The Same App 20060199386 - Huang; Jim-Jey ;   et al. | 2006-09-07 |
Semiconductor Device And Manufacturing Method Thereof App 20060199367 - Huang; Jim-Jey ;   et al. | 2006-09-07 |
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