loadpatents
name:-0.010409116744995
name:-0.003101110458374
name:-0.00046706199645996
Hsu; Feng-Yu Patent Filings

Hsu; Feng-Yu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hsu; Feng-Yu.The latest application filed is for "tube structure for preserving a flower".

Company Profile
0.3.10
  • Hsu; Feng-Yu - Taichung City TW
  • Hsu; Feng-Yu - Tainan Hsien TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Tube Structure For Preserving A Flower
App 20140137469 - Lin; Jui-Cheng ;   et al.
2014-05-22
Method for manufacturing a dual damascene opening comprising a trench opening and a via opening
Grant 8,084,357 - Chen , et al. December 27, 2
2011-12-27
Multi Cap Layer And Manufacturing Method Thereof
App 20090283310 - Chen; Wei-Chih ;   et al.
2009-11-19
Interconnect Structure
App 20090146311 - Hsu; Feng-Yu ;   et al.
2009-06-11
Interconnect structure and fabricating method thereof
Grant 7,514,347 - Hsu , et al. April 7, 2
2009-04-07
Method of fabricating interconnect structure
Grant 7,439,154 - Hsu , et al. October 21, 2
2008-10-21
Multi Cap Layer And Manufacturing Method Thereof
App 20080251931 - Chen; Wei-Chih ;   et al.
2008-10-16
Method Of Fabricating Interconnect Structure
App 20070093053 - Hsu; Feng-Yu ;   et al.
2007-04-26
Interconnect Structure And Fabricating Method Thereof
App 20070085210 - Hsu; Feng-Yu ;   et al.
2007-04-19
Interconnect Structure
App 20070085208 - Hsu; Feng-Yu ;   et al.
2007-04-19
Semiconductor Device With Low-resistance Inlaid Copper/barrier Interconnects And Method For Manufacturing The Same
App 20060199386 - Huang; Jim-Jey ;   et al.
2006-09-07
Semiconductor Device And Manufacturing Method Thereof
App 20060199367 - Huang; Jim-Jey ;   et al.
2006-09-07

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