| Patent | Date |
|---|
Semiconductor package with dual sides of metal routing
Grant 11,456,257 - Jeng , et al. September 27, 2 | 2022-09-27 |
Semiconductor Package And Method Of Manufacturing The Same
App 20220302081 - Hsu; Chia-Kuei ; et al. | 2022-09-22 |
Semiconductor Package
App 20220302030 - Hsu; Feng-Cheng ; et al. | 2022-09-22 |
Chip package structure with cavity in interposer
Grant 11,443,993 - Jeng , et al. September 13, 2 | 2022-09-13 |
Semiconductor Structure And Manufacturing Method Thereof
App 20220278034 - CHEN; SHUO-MAO ; et al. | 2022-09-01 |
Semiconductor Structure And Manufacturing Method Thereof
App 20220271024 - LU; HSIANG-TAI ; et al. | 2022-08-25 |
Semiconductor Package And Method Manufacturing The Same
App 20220262767 - Hsu; Feng-Cheng ; et al. | 2022-08-18 |
Semiconductor device encapsulated by molding material attached to redestribution layer
Grant 11,417,620 - Jeng , et al. August 16, 2 | 2022-08-16 |
Multi-chip Packages
App 20220246579 - Chen; Shuo-Mao ; et al. | 2022-08-04 |
Chip package structure with integrated device integrated beneath the semiconductor chip
Grant 11,404,394 - Hsu , et al. August 2, 2 | 2022-08-02 |
Reinforcing package using reinforcing patches
Grant 11,393,746 - Hsu , et al. July 19, 2 | 2022-07-19 |
Package Structure And Method Of Manufacturing The Same
App 20220223424 - Hsu; Feng-Cheng ; et al. | 2022-07-14 |
Semiconductor package having a semiconductor device bonded to a circuit substrate through connection terminals and dummy conductors and method of manufacturing the same
Grant 11,387,183 - Hsu , et al. July 12, 2 | 2022-07-12 |
Method For Forming Package Structure With Lid
App 20220181232 - JENG; Shin-Puu ; et al. | 2022-06-09 |
Semiconductor package and method manufacturing the same
Grant 11,355,474 - Hsu , et al. June 7, 2 | 2022-06-07 |
Integrated Passive Device Package And Methods Of Forming Same
App 20220165587 - Hsu; Feng-Cheng ; et al. | 2022-05-26 |
Semiconductor structure and manufacturing method thereof
Grant 11,342,255 - Chen , et al. May 24, 2 | 2022-05-24 |
Multi-chip wafer level packages
Grant 11,342,306 - Chen , et al. May 24, 2 | 2022-05-24 |
Semiconductor structure and manufacturing method thereof
Grant 11,335,672 - Lu , et al. May 17, 2 | 2022-05-17 |
Chip Package Structure
App 20220108967 - JENG; Shin-Puu ; et al. | 2022-04-07 |
Package structure and method of manufacturing the same
Grant 11,295,957 - Hsu , et al. April 5, 2 | 2022-04-05 |
Chip package structure having warpage control and method of forming the same
Grant 11,282,759 - Hsu , et al. March 22, 2 | 2022-03-22 |
Package structure with lid and method for forming the same
Grant 11,264,300 - Jeng , et al. March 1, 2 | 2022-03-01 |
Integrated passive device package and methods of forming same
Grant 11,251,054 - Hsu , et al. February 15, 2 | 2022-02-15 |
Method of fabricating package structure
Grant 11,251,142 - Lin , et al. February 15, 2 | 2022-02-15 |
Chip package structure
Grant 11,239,194 - Jeng , et al. February 1, 2 | 2022-02-01 |
Semiconductor package and method manufacturing the same
Grant 11,205,603 - Hsu , et al. December 21, 2 | 2021-12-21 |
Methods of forming multi-chip wafer level packages
Grant 11,189,596 - Chen , et al. November 30, 2 | 2021-11-30 |
Method of forming contact holes in a fan out package
Grant 11,164,829 - Hsu , et al. November 2, 2 | 2021-11-02 |
Method of forming contact holes in a fan out package
Grant 11,152,316 - Hsu , et al. October 19, 2 | 2021-10-19 |
Reinforcing Package Using Reinforcing Patches
App 20210296220 - Hsu; Chia-Kuei ; et al. | 2021-09-23 |
Method For Forming Semiconductor Package
App 20210272869 - WANG; Chin-Hua ; et al. | 2021-09-02 |
Multi fan-out package structure and method for forming the same
Grant 11,107,801 - Jeng , et al. August 31, 2 | 2021-08-31 |
Method Of Manufacturing Semiconductor Device
App 20210257326 - LIN; JING-CHENG ; et al. | 2021-08-19 |
Chip Package With Redistribution Structure
App 20210242122 - JENG; Shin-Puu ; et al. | 2021-08-05 |
Three-layer package-on-package structure and method forming same
Grant 11,069,656 - Hung , et al. July 20, 2 | 2021-07-20 |
Semiconductor package
Grant 11,063,023 - Hsu , et al. July 13, 2 | 2021-07-13 |
Integrated Circuit Package and Method Forming Same
App 20210193637 - Jeng; Shin-Puu ; et al. | 2021-06-24 |
Semiconductor Devices and Methods of Manufacture
App 20210159182 - Jeng; Shin-Puu ; et al. | 2021-05-27 |
Semiconductor device including solder bracing material with a rough surface, and manufacturing method thereof
Grant 11,018,106 - Lin , et al. May 25, 2 | 2021-05-25 |
Semiconductor package and method for forming the same
Grant 11,011,447 - Wang , et al. May 18, 2 | 2021-05-18 |
Chip package with recessed interposer substrate
Grant 10,985,100 - Jeng , et al. April 20, 2 | 2021-04-20 |
Semiconductor structure and manufacturing method thereof
Grant 10,971,483 - Jeng , et al. April 6, 2 | 2021-04-06 |
Method For Forming Chip Package Structure
App 20210098379 - JENG; Shin-Puu ; et al. | 2021-04-01 |
Semiconductor Package Structure
App 20210082882 - HSU; FENG-CHENG ; et al. | 2021-03-18 |
Chip Package Structure Having Warpage Control And Method Of Forming The Same
App 20210074602 - HSU; Feng-Cheng ; et al. | 2021-03-11 |
Chip Package Structure With Cavity In Interposer
App 20210074600 - JENG; Shin-Puu ; et al. | 2021-03-11 |
Chip Package Structure And Method Of Forming The Same
App 20210074682 - CHEN; Shuo-Mao ; et al. | 2021-03-11 |
Chip Package Structure With Integrated Device Integrated Beneath The Semiconductor Chip
App 20210074678 - HSU; Feng-Cheng ; et al. | 2021-03-11 |
Package Structure And Method Of Forming The Same
App 20210005562 - JENG; Shin-Puu ; et al. | 2021-01-07 |
Method Of Manufacturing Semiconductor Package Structure
App 20200411474 - JENG; SHIN-PUU ; et al. | 2020-12-31 |
Multi-chip Wafer Level Packages
App 20200395335 - Chen; Shuo-Mao ; et al. | 2020-12-17 |
Method for forming chip package structure
Grant 10,867,925 - Jeng , et al. December 15, 2 | 2020-12-15 |
Semiconductor package with redistribution structure and pre-made substrate on opposing sides for dual-side metal routing
Grant 10,867,924 - Jeng , et al. December 15, 2 | 2020-12-15 |
Semiconductor package structure
Grant 10,854,579 - Hsu , et al. December 1, 2 | 2020-12-01 |
Semiconductor Package
App 20200373278 - HSU; FENG-CHENG ; et al. | 2020-11-26 |
Semiconductor Structure And Manufacturing Method Thereof
App 20200357785 - LU; HSIANG-TAI ; et al. | 2020-11-12 |
Package Structure And Method Of Manufacturing The Same
App 20200343096 - Hsu; Feng-Cheng ; et al. | 2020-10-29 |
Methods Of Forming Multi-chip Wafer Level Packages
App 20200343220 - Chen; Shuo-Mao ; et al. | 2020-10-29 |
Semiconductor package structure and method of manufacturing the same
Grant 10,804,244 - Jeng , et al. October 13, 2 | 2020-10-13 |
Semiconductor Package And Method Manufacturing The Same
App 20200321313 - Hsu; Feng-Cheng ; et al. | 2020-10-08 |
Semiconductor Package And Method Manufacturing The Same
App 20200303277 - Hsu; Feng-Cheng ; et al. | 2020-09-24 |
Plurality of semiconductor devices encapsulated by a molding material attached to a redistribution layer
Grant 10,784,220 - Jeng , et al. Sept | 2020-09-22 |
Method Of Fabricating Package Structure
App 20200286744 - Lin; Chia-Hsiang ; et al. | 2020-09-10 |
Method Of Forming Semicondcutor Device Package
App 20200286878 - Lin; Po-Yao ; et al. | 2020-09-10 |
Semiconductor package and manufacturing method of the same
Grant 10,770,437 - Hung , et al. Sep | 2020-09-08 |
Multi-chip wafer level packages and methods of forming the same
Grant 10,763,239 - Chen , et al. Sep | 2020-09-01 |
Semiconductor Package
App 20200273797 - Hsu; Feng-Cheng ; et al. | 2020-08-27 |
Manufacturing method of semiconductor package
Grant 10,756,064 - Hsu , et al. A | 2020-08-25 |
Method For Manufacturing Semiconductor Package Structure
App 20200258849 - A1 | 2020-08-13 |
Package structure and method of manufacturing the same
Grant 10,741,404 - Hsu , et al. A | 2020-08-11 |
Semiconductor structure and manufacturing method thereof
Grant 10,741,537 - Lu , et al. A | 2020-08-11 |
Semiconductor package and method manufacturing the same
Grant 10,727,198 - Hsu , et al. | 2020-07-28 |
Method of forming semicondcutor device package
Grant 10,714,463 - Lin , et al. | 2020-07-14 |
Semiconductor package and method manufacturing the same
Grant 10,707,142 - Hsu , et al. | 2020-07-07 |
Semiconductor package with dummy bumps connected to non-solder mask defined pads
Grant 10,692,813 - Hsu , et al. | 2020-06-23 |
Package structure and method of fabricating the same
Grant 10,665,473 - Lin , et al. | 2020-05-26 |
Chip Package Structure
App 20200161267 - JENG; Shin-Puu ; et al. | 2020-05-21 |
Semiconductor Package Structure And Method Of Manufacturing The Same
App 20200152603 - JENG; SHIN-PUU ; et al. | 2020-05-14 |
Semiconductor Structure And Manufacturing Method Thereof
App 20200152563 - CHEN; SHUO-MAO ; et al. | 2020-05-14 |
Three-Layer Package-on-Package Structure and Method Forming Same
App 20200135694 - Hung; Jui-Pin ; et al. | 2020-04-30 |
Semiconductor package structure
Grant 10,636,747 - Hung , et al. | 2020-04-28 |
Chip Package With Interposer Substrate
App 20200126812 - JENG; Shin-Puu ; et al. | 2020-04-23 |
Manufacturing method of semiconductor package
Grant 10,622,336 - Hsu , et al. | 2020-04-14 |
Method Of Forming Semicondcutor Device Package
App 20200098739 - Lin; Po-Yao ; et al. | 2020-03-26 |
Package Structure With Lid And Method For Forming The Same
App 20200091029 - JENG; Shin-Puu ; et al. | 2020-03-19 |
Integrated Passive Device Package And Methods Of Forming Same
App 20200090955 - Hsu; Feng-Cheng ; et al. | 2020-03-19 |
Package Structure And Method For Forming The Same
App 20200075569 - JENG; Shin-Puu ; et al. | 2020-03-05 |
Semiconductor Package And Method For Forming The Same
App 20200058571 - WANG; Chin-Hua ; et al. | 2020-02-20 |
Manufacturing Method Of Semiconductor Package
App 20200043900 - HSU; FENG-CHENG ; et al. | 2020-02-06 |
Chip package structure
Grant 10,546,830 - Jeng , et al. Ja | 2020-01-28 |
Method For Forming Chip Package Structure
App 20200027837 - JENG; Shin-Puu ; et al. | 2020-01-23 |
Semiconductor package structure and method of manufacturing the same
Grant 10,535,632 - Jeng , et al. Ja | 2020-01-14 |
Semiconductor structure and manufacturing method thereof
Grant 10,535,597 - Chen , et al. Ja | 2020-01-14 |
Semiconductor Package With Dual Sides Of Metal Routing
App 20200006234 - Jeng; Shin-Puu ; et al. | 2020-01-02 |
Method of Forming Contact Holes in a Fan Out Package
App 20200006264 - Hsu; Feng-Cheng ; et al. | 2020-01-02 |
Method for forming chip package with recessed interposer substrate
Grant 10,515,827 - Jeng , et al. Dec | 2019-12-24 |
Three-layer package-on-package structure and method forming same
Grant 10,515,930 - Hung , et al. Dec | 2019-12-24 |
Integrated passive device package and methods of forming same
Grant 10,504,752 - Hsu , et al. Dec | 2019-12-10 |
Method of forming semicondcutor device package
Grant 10,504,880 - Lin , et al. Dec | 2019-12-10 |
Semiconductor package and manufacturing method of the same
Grant 10,475,769 - Hsu , et al. Nov | 2019-11-12 |
Semiconductor Package Structure
App 20190279968 - HSU; FENG-CHENG ; et al. | 2019-09-12 |
Semiconductor Package And Method Manufacturing The Same
App 20190259680 - Hsu; Feng-Cheng ; et al. | 2019-08-22 |
Chip Package Structure
App 20190259726 - JENG; Shin-Puu ; et al. | 2019-08-22 |
Method Of Forming Semicondcutor Device Package
App 20190252363 - Lin; Po-Yao ; et al. | 2019-08-15 |
Integrated fan-out structure with guiding trenches in buffer layer
Grant 10,354,982 - Tsai , et al. July 16, 2 | 2019-07-16 |
Semiconductor Structure And Manufacturing Method Thereof
App 20190148347 - JENG; SHIN-PUU ; et al. | 2019-05-16 |
Package Structure And Method Of Fabricating The Same
App 20190139784 - Lin; Chia-Hsiang ; et al. | 2019-05-09 |
Package Structure And Method Of Manufacturing The Same
App 20190139896 - Hsu; Feng-Cheng ; et al. | 2019-05-09 |
Chip package structure and method for forming the same
Grant 10,283,474 - Jeng , et al. | 2019-05-07 |
Semiconductor package and method manufacturing the same
Grant 10,283,428 - Hsu , et al. | 2019-05-07 |
Multi-chip Wafer Level Packages And Methods Of Forming The Same
App 20190131273 - Chen; Shuo-Mao ; et al. | 2019-05-02 |
Chip Package With Interposer Substrate And Method For Forming The Same
App 20190131284 - JENG; Shin-Puu ; et al. | 2019-05-02 |
Semiconductor device package and method of forming semiconductor device package
Grant 10,276,551 - Lin , et al. | 2019-04-30 |
Manufacturing Method Of Semiconductor Package
App 20190103382 - HSU; FENG-CHENG ; et al. | 2019-04-04 |
Semiconductor Package With Dual Sides Of Metal Routing
App 20190013273 - Jeng; Shin-Puu ; et al. | 2019-01-10 |
Semiconductor Package And Method Manufacturing The Same
App 20190006257 - Hsu; Feng-Cheng ; et al. | 2019-01-03 |
Chip Package Structure And Method For Forming The Same
App 20190006309 - JENG; Shin-Puu ; et al. | 2019-01-03 |
Semiconductor Package And Method Manufacturing The Same
App 20190006315 - Hsu; Feng-Cheng ; et al. | 2019-01-03 |
Semicondcutor Device Package And Method Of Forming Semicondcutor Device Package
App 20190006341 - Lin; Po-Yao ; et al. | 2019-01-03 |
Semiconductor structure and manufacturing method thereof
Grant 10,163,876 - Jeng , et al. Dec | 2018-12-25 |
Semiconductor package structure
Grant 10,163,860 - Hsu , et al. Dec | 2018-12-25 |
Semiconductor Package And Manufacturing Method Of The Same
App 20180350786 - HUNG; JUI-PIN ; et al. | 2018-12-06 |
Semiconductor Device And Manufacturing Method Thereof
App 20180301431 - LIN; JING-CHENG ; et al. | 2018-10-18 |
Semiconductor Package Structure
App 20180294237 - HUNG; JUI-PIN ; et al. | 2018-10-11 |
Integrated Fan-Out Structure with Guiding Trenches in Buffer Layer
App 20180286839 - Tsai; Po-Hao ; et al. | 2018-10-04 |
Package Structure And Method Of Forming Package Structure
App 20180286824 - JENG; Shin-Puu ; et al. | 2018-10-04 |
Integrated fan-out structure with guiding trenches in buffer layer
Grant 10,083,946 - Tsai , et al. September 25, 2 | 2018-09-25 |
Semiconductor Structure And Manufacturing Method Thereof
App 20180269189 - JENG; SHIN-PUU ; et al. | 2018-09-20 |
Method of Forming Contact Holes in a Fan Out Package
App 20180240764 - Hsu; Feng-Cheng ; et al. | 2018-08-23 |
Semiconductor package and manufacturing method of the same
Grant 10,050,024 - Hung , et al. August 14, 2 | 2018-08-14 |
Three-Layer Package-on-Package Structure and Method Forming Same
App 20180226378 - Hung; Jui-Pin ; et al. | 2018-08-09 |
Semiconductor Structure And Manufacturing Method Thereof
App 20180204791 - CHEN; SHUO-MAO ; et al. | 2018-07-19 |
Semiconductor Structure And Manufacturing Method Thereof
App 20180204828 - LU; HSIANG-TAI ; et al. | 2018-07-19 |
Integrated Passive Device Package and Methods of Forming Same
App 20180197755 - Hsu; Feng-Cheng ; et al. | 2018-07-12 |
Semiconductive packaging device and manufacturing method thereof
Grant 10,020,275 - Lin , et al. July 10, 2 | 2018-07-10 |
Semiconductor package structure and manufacturing method thereof
Grant 9,997,471 - Hung , et al. June 12, 2 | 2018-06-12 |
Semicondcutor Device
App 20180151495 - Hsu; Feng-Cheng ; et al. | 2018-05-31 |
Semiconductor structure and manufacturing method thereof
Grant 9,985,006 - Jeng , et al. May 29, 2 | 2018-05-29 |
Method of forming contact holes in a fan out package
Grant 9,947,629 - Hsu , et al. April 17, 2 | 2018-04-17 |
Three-layer Package-on-Package structure and method forming same
Grant 9,935,080 - Hung , et al. April 3, 2 | 2018-04-03 |
Semiconductor Package Structure And Method Of Manufacturing The Same
App 20180068978 - JENG; SHIN-PUU ; et al. | 2018-03-08 |
Integrated passive device package and methods of forming same
Grant 9,911,629 - Hsu , et al. March 6, 2 | 2018-03-06 |
Semiconductor Package Structure And Method For Manufacturing The Same
App 20180033770 - HSU; FENG-CHENG ; et al. | 2018-02-01 |
Semiconductor Package Structure And Manufacturing Method Thereof
App 20180025992 - HUNG; JUI-PIN ; et al. | 2018-01-25 |
Semiconductor Package And Manufacturing Method Of The Same
App 20170373039 - HSU; FENG-CHENG ; et al. | 2017-12-28 |
Semiconductor Package And Manufacturing Method Of The Same
App 20170365587 - HUNG; JUI-PIN ; et al. | 2017-12-21 |
Semiconductor Structure And Manufacturing Method Thereof
App 20170345804 - JENG; SHIN-PUU ; et al. | 2017-11-30 |
Three-Layer Package-on-Package Structure and Method Forming Same
App 20170317053 - Hung; Jui-Pin ; et al. | 2017-11-02 |
Integrated Passive Device Package And Methods Of Forming Same
App 20170229322 - Hsu; Feng-Cheng ; et al. | 2017-08-10 |
Integrated Fan-Out Structure with Guiding Trenches in Buffer Layer
App 20170229433 - Tsai; Po-Hao ; et al. | 2017-08-10 |
Integrated fan-out structure with guiding trenches in buffer layer
Grant 9,633,895 - Tsai , et al. April 25, 2 | 2017-04-25 |
Underfill pattern with gap
Grant 9,627,346 - Hsu , et al. April 18, 2 | 2017-04-18 |
Integrated Fan-Out Structure with Guiding Trenches in Buffer Layer
App 20160329307 - Tsai; Po-Hao ; et al. | 2016-11-10 |
Fan Out Package Method
App 20160284653 - Hsu; Feng-Cheng ; et al. | 2016-09-29 |
Integrated fan-out structure with guiding trenches in buffer layer
Grant 9,425,121 - Tsai , et al. August 23, 2 | 2016-08-23 |
Fan out package structure
Grant 9,379,041 - Hsu , et al. June 28, 2 | 2016-06-28 |
Double patterning strategy for contact hole and trench in photolithography
Grant 9,323,155 - Chen , et al. April 26, 2 | 2016-04-26 |
Semiconductor Device And Manufacturing Method Thereof
App 20150187716 - LIN; JING-CHENG ; et al. | 2015-07-02 |
Fan Out Package Structure and Methods of Forming
App 20150162256 - Hsu; Feng-Cheng ; et al. | 2015-06-11 |
Underfill Pattern with Gap
App 20150162258 - Hsu; Feng-Cheng ; et al. | 2015-06-11 |
Integrated Fan-Out Structure with Guiding Trenches in Buffer Layer
App 20150069623 - Tsai; Po-Hao ; et al. | 2015-03-12 |
Double Patterning Strategy For Contact Hole And Trench In Photolithography
App 20140272714 - CHEN; CHUN-KUANG ; et al. | 2014-09-18 |
Double patterning strategy for contact hole and trench in photolithography
Grant 8,741,552 - Chen , et al. June 3, 2 | 2014-06-03 |
Double patterning strategy for contact hole and trench in photolithography
Grant 8,450,052 - Hsu , et al. May 28, 2 | 2013-05-28 |
Double Patterning Strategy for Contact Hole and Trench in Photolithography
App 20120034778 - Hsu; Feng-Cheng ; et al. | 2012-02-09 |
Double patterning strategy for contact hole and trench in photolithography
Grant 8,048,616 - Hsu , et al. November 1, 2 | 2011-11-01 |
Double patterning strategy for contact hole and trench
Grant 7,935,477 - Hsu , et al. May 3, 2 | 2011-05-03 |
Double Patterning Strategy For Forming Fine Patterns In Photolithography
App 20110059407 - LIN; Li-Te S. ; et al. | 2011-03-10 |
Double Patterning Strategy For Contact Hole And Trench In Photolithography
App 20100310995 - Chen; Chun-Kuang ; et al. | 2010-12-09 |
Double Patterning Strategy For Contact Hole and Trench in Photolithography
App 20090233238 - Hsu; Feng-Cheng ; et al. | 2009-09-17 |
Double Patterning Strategy For Contact Hole And Trench
App 20090142701 - Hsu; Feng-Cheng ; et al. | 2009-06-04 |
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