Patent applications and USPTO patent grants for Hsu; Chia Yun.The latest application filed is for "semiconductor package structures and methods of manufacturing the same".
Patent | Date |
---|---|
Optical package Grant 11,276,720 - Tang , et al. March 15, 2 | 2022-03-15 |
Semiconductor Package Structures And Methods Of Manufacturing The Same App 20210175135 - HSU; Chia Yun ;   et al. | 2021-06-10 |
Optical Package App 20210134857 - TANG; Shih-Chieh ;   et al. | 2021-05-06 |
Optical package structure and method for manufacturing the same Grant 10,872,915 - Hsu , et al. December 22, 2 | 2020-12-22 |
Optical Package Structure And Method For Manufacturing The Same App 20200235153 - HSU; Chia Yun ;   et al. | 2020-07-23 |
Electronic device, package structure and method of manufacturing the same Grant 9,911,877 - Ho , et al. March 6, 2 | 2018-03-06 |
Electronic Device, Package Structure And Method Of Manufacturing The Same App 20170207352 - HO; Hsin-Ying ;   et al. | 2017-07-20 |
Light-emitting device package structure Grant 8,710,529 - Chen , et al. April 29, 2 | 2014-04-29 |
Light-emitting diode structure Grant 8,378,368 - Hsu , et al. February 19, 2 | 2013-02-19 |
Light-Emitting Device Package Structure App 20120267667 - Chen; Ying-Zhong ;   et al. | 2012-10-25 |
Light-emitting device package structure Grant 8,247,830 - Chen , et al. August 21, 2 | 2012-08-21 |
Illumination module Grant 8,240,879 - Hsu , et al. August 14, 2 | 2012-08-14 |
Light-emitting Diode Structure App 20110079806 - Hsu; Chia-Yun ;   et al. | 2011-04-07 |
Optical Pointing Device App 20110080734 - Hsu; Chia-Yun | 2011-04-07 |
Light-emitting Device Package Structure And Manufacturing Method Thereof App 20100187562 - Chen; Ying-Zhong ;   et al. | 2010-07-29 |
Illumination Module App 20100128476 - Hsu; Chia-Yun ;   et al. | 2010-05-27 |
Light source protective structure of a backlight module Grant 7,267,472 - Shiau , et al. September 11, 2 | 2007-09-11 |
Light source protective structure of a backlight module App 20060092670 - Shiau; Deng-Kuen ;   et al. | 2006-05-04 |
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