Hsu; Chia-Kuei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hsu; Chia-Kuei.The latest application filed is for "metallization structure and package structure".

Company Profile

7.8.19

Hsu; Chia-Kuei - Hsinchu TW
Hsu; Chia-Kuei - Hsinchu City TW
Hsu; Chia-Kuei - Hsinchu County TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Metallization Structure And Package Structure App 20220310503 - Hsu; Chia-Kuei ; et al.	2022-09-29
Package Structure And Methods Of Manufacturing The Same App 20220310532 - Yeh; Shu-Shen ; et al.	2022-09-29
Semiconductor Package And Method Of Manufacturing The Same App 20220302081 - Hsu; Chia-Kuei ; et al.	2022-09-22
Semiconductor Package And Manufacturing Method Thereof App 20220278037 - Hsu; Chia-Kuei ; et al.	2022-09-01
Semiconductor Device and Method of Manufacture App 20220246490 - Yeh; Shu-Shen ; et al.	2022-08-04
Reinforcing package using reinforcing patches Grant 11,393,746 - Hsu , et al. July 19, 2	2022-07-19
Semiconductor Package App 20220208707 - Hsu; Chia-Kuei ; et al.	2022-06-30
Semiconductor Device And Method App 20220181298 - Hsu; Chia-Kuei ; et al.	2022-06-09
Organic Interposer Including Intra-die Structural Reinforcement Structures And Methods Of Forming The Same App 20220139816 - LIAO; Li-Ling ; et al.	2022-05-05
Multi-Bump Connection to Interconnect Structure and Manufacturing Method Thereof App 20220139860 - Lee; Tsung-Yen ; et al.	2022-05-05
Organic interposer including stress-resistant bonding structures and methods of forming the same Grant 11,282,756 - Lee , et al. March 22, 2	2022-03-22
Device, semiconductor package and method of manufacturing semiconductor package Grant 11,282,803 - Hsu , et al. March 22, 2	2022-03-22
Chip bonded to a redistribution structure with curved conductive lines Grant 11,264,359 - Hsu , et al. March 1, 2	2022-03-01
Organic Interposer Including Stress-resistant Bonding Structures And Methods Of Forming The Same App 20220051959 - LEE; Tsung-Yen ; et al.	2022-02-17
Package Structure And Method App 20220037243 - Yeh; Shu-Shen ; et al.	2022-02-03
Semiconductor Package and Method of Manufacture App 20220037247 - Hsu; Chia-Kuei ; et al.	2022-02-03
Eccentric Via Structures for Stress Reduction App 20220020693 - Yeh; Shu-Shen ; et al.	2022-01-20
Fan-out packages and methods of forming the same Grant 11,164,754 - Tsai , et al. November 2, 2	2021-11-02
Semiconductor Device and Method App 20210335753 - Hsu; Chia-Kuei ; et al.	2021-10-28
Reinforcing Package Using Reinforcing Patches App 20210296220 - Hsu; Chia-Kuei ; et al.	2021-09-23
Device, Semiconductor Package And Method Of Manufacturing Semiconductor Package App 20210082847 - Hsu; Chia-Kuei ; et al.	2021-03-18
Device, semiconductor package and method of manufacturing semiconductor package Grant 10,854,563 - Hsu , et al. December 1, 2	2020-12-01
Device, Semiconductor Package And Method Of Manufacturing Semiconductor Package App 20200286843 - Hsu; Chia-Kuei ; et al.	2020-09-10
Device, semiconductor package and method of manufacturing semiconductor package Grant 10,665,559 - Hsu , et al.	2020-05-26
Fan-Out Packages And Methods Of Forming The Same App 20200105544 - Tsai; Po-Hao ; et al.	2020-04-02
Clock generating device and clock generating method Grant 10,601,427 - Hsu , et al.	2020-03-24
Device, Semiconductor Package And Method Of Manufacturing Semiconductor Package App 20190319002 - Hsu; Chia-Kuei ; et al.	2019-10-17

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