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Patent applications and USPTO patent grants for Hsu; Chia Hsiung.The latest application filed is for "novel substrate design for semiconductor device".
Patent | Date |
---|---|
Novel substrate design for semiconductor device App 20080246147 - Su; Chao-Yuan ;   et al. | 2008-10-09 |
Semiconductor bond pad structures and methods of manufacturing thereof Grant 7,157,734 - Tsao , et al. January 2, 2 | 2007-01-02 |
Semiconductor Bond Pad Structures And Methods Of Manufacturing Thereof App 20060267008 - Tsao; Pei-Haw ;   et al. | 2006-11-30 |
Fine pitch bonding pad layout and method of manufacturing same App 20060091535 - Tsao; Pei-Haw ;   et al. | 2006-05-04 |
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