| Patent | Date |
|---|
Negative Capacitance Transistor Having A Multilayer Ferroelectric Structure Or A Ferroelectric Layer With A Gradient Doping Profile
App 20220285521 - Hsu; Chi-Hsing ; et al. | 2022-09-08 |
Negative capacitance transistor having a multilayer ferroelectric structure or a ferroelectric layer with a gradient doping profile
Grant 11,349,008 - Hsu , et al. May 31, 2 | 2022-05-31 |
Negative Capacitance Transistor With External Ferroelectric Structure
App 20220130976 - Hsu; Chi-Hsing ; et al. | 2022-04-28 |
Negative capacitance transistor with external ferroelectric structure
Grant 11,222,958 - Hsu , et al. January 11, 2 | 2022-01-11 |
Method Of Forming High Performance Mosfets Having Varying Channel Structures
App 20210296317 - Ohtou; Tetsu ; et al. | 2021-09-23 |
Method of forming high performance MOSFETs having varying channel structures
Grant 11,031,395 - Ohtou , et al. June 8, 2 | 2021-06-08 |
Negative Capacitance Transistor with a Diffusion Blocking Layer
App 20210098618 - Hsu; Chi-Hsing ; et al. | 2021-04-01 |
Negative capacitance finFET and method of fabricating thereof
Grant 10,879,238 - Ching , et al. December 29, 2 | 2020-12-29 |
Negative capacitance transistor with a diffusion blocking layer
Grant 10,861,973 - Hsu , et al. December 8, 2 | 2020-12-08 |
Negative Capacitance Transistor With External Ferroelectric Structure
App 20200105898 - Hsu; Chi-Hsing ; et al. | 2020-04-02 |
Negative Capacitance Transistor Having A Multilayer Ferroelectric Structure Or A Ferroelectric Layer With A Gradient Doping Prof
App 20200105897 - Hsu; Chi-Hsing ; et al. | 2020-04-02 |
High Performance Mosfet
App 20200043926 - Ohtou; Tetsu ; et al. | 2020-02-06 |
High Performance Mosfet
App 20200020689 - OHTOU; Tetsu ; et al. | 2020-01-16 |
Negative Capacitance Transistor with a Diffusion Blocking Layer
App 20200006547 - Hsu; Chi-Hsing ; et al. | 2020-01-02 |
X-ray Sensing Device And Manufacturing Method Thereof
App 20190317226 - HSU; Chi-Hsing | 2019-10-17 |
Negative Capacitance Finfet And Method Of Fabricating Thereof
App 20190237464 - CHING; Kuo-Cheng ; et al. | 2019-08-01 |
Biosensor Package Structure And Manufacturing Method Thereof
App 20180354781 - HSU; Chi-Hsing | 2018-12-13 |
Portable electronic device and image capturing module thereof
Grant 9,860,431 - Hsu January 2, 2 | 2018-01-02 |
Portable electronic device and image capturing module thereof
Grant 9,786,709 - Hsu October 10, 2 | 2017-10-10 |
Image sensing module and method of manufacturing the same
Grant 9,349,903 - Hsu May 24, 2 | 2016-05-24 |
Production apparatus for manufacturing sensor package structure
Grant 9,287,306 - Hsu , et al. March 15, 2 | 2016-03-15 |
Biochip Package
App 20160059230 - HSU; Chi-Hsing | 2016-03-03 |
Audiovisual apparatus for reducing echo
Grant 9,007,419 - Hsu , et al. April 14, 2 | 2015-04-14 |
Sensor Package Structure And Production Apparatus For Manufacturing The Same
App 20150053849 - HSU; CHI-HSING ; et al. | 2015-02-26 |
Image Sensing Module And Method Of Manufacturing The Same
App 20150048386 - HSU; CHI-HSING | 2015-02-19 |
Audiovisual Apparatus For Reducing Echo
App 20140125756 - HSU; CHI-HSING ; et al. | 2014-05-08 |
Image-capturing module for simplifying optical component
Grant 8,593,560 - Hsu , et al. November 26, 2 | 2013-11-26 |
Image-sensing Module For Reducing Its Whole Thickness
App 20130307105 - HSU; CHI-HSING | 2013-11-21 |
Image-sensing Module
App 20130234272 - HSU; CHI-HSING | 2013-09-12 |
Vertical stacked light emitting structure
Grant 8,519,428 - Hsu , et al. August 27, 2 | 2013-08-27 |
Vertical stacked light emitting structure
Grant 8,476,651 - Hsu , et al. July 2, 2 | 2013-07-02 |
Optical Touch Control Module
App 20130162597 - LU; CHUN-YU ; et al. | 2013-06-27 |
Optical Touch Control Module
App 20130161491 - LU; CHUN-YU ; et al. | 2013-06-27 |
Image-capturing module for simplifying optical component and reducing assembly time
Grant 8,368,003 - Hsu , et al. February 5, 2 | 2013-02-05 |
Vertical Stacked Light Emitting Structure
App 20130009174 - HSU; CHI-HSING ; et al. | 2013-01-10 |
Vertical Stacked Light Emitting Structure
App 20130009175 - HSU; CHI-HSING ; et al. | 2013-01-10 |
Image-capturing module for simplifying optical component
Grant 8,274,594 - Hsu , et al. September 25, 2 | 2012-09-25 |
Flexible thin image-sensing module with anti-EMI function and flexible thin PCB module with anti-EMI function
Grant 8,093,509 - Hsu January 10, 2 | 2012-01-10 |
Image-sensing module for reducing overall thickness thereof and preventing EMI
Grant 8,054,639 - Hsu November 8, 2 | 2011-11-08 |
LED package structure for increasing light-emitting efficiency
Grant 8,053,969 - Hsu , et al. November 8, 2 | 2011-11-08 |
Image-capturing Module For Simplifying Optical Component And Reducing Assembly Time
App 20110253885 - HSU; CHI-HSING ; et al. | 2011-10-20 |
Image-sensing chip package module for reducing its whole thickness
Grant 8,023,019 - Hsu September 20, 2 | 2011-09-20 |
Led Package Structure For Increasing Light-emitting Efficiency
App 20110215695 - HSU; CHI-HSING ; et al. | 2011-09-08 |
Flip-chip Type Image-capturing Module
App 20110057130 - HSU; Chi-Hsing ; et al. | 2011-03-10 |
Image-capturing Module With A Flexible Type Substrate Structure
App 20110058088 - HSU; Chi-Hsing ; et al. | 2011-03-10 |
Image-capturing Module For Electrically Connecting Two Circuit Substrates With Each Other
App 20110058090 - HSU; Chi-Hsing ; et al. | 2011-03-10 |
Image-capturing Module For Simplifying Optical Component
App 20110058092 - HSU; Chi-Hsing ; et al. | 2011-03-10 |
Image-capturing Module With A Flexible Type Substrate Structure
App 20110058091 - HSU; Chi-Hsing ; et al. | 2011-03-10 |
Image-capturing Module For Simplifying Optical Component
App 20110058027 - HSU; Chi-Hsing ; et al. | 2011-03-10 |
Light-emitting module and image-capturing module for arbitrarily changing light-emitting position
App 20100321199 - Hsu; Chi-Hsing ; et al. | 2010-12-23 |
Flexible thin image-sensing module with anti-EMI function and flexible thin PCB module with anti-EMI function
App 20100258343 - Hsu; Chi-Hsing | 2010-10-14 |
Image-sensing module for reducing overall thickness thereof and preventing EMI
App 20100134985 - Hsu; Chi-Hsing | 2010-06-03 |
Chip package and stacked structure of chip packages
Grant 7,642,634 - Hsu January 5, 2 | 2010-01-05 |
Image-sensing chip package module for reducing its whole thickness
App 20090273698 - Hsu; Chi-Hsing | 2009-11-05 |
Electronic device with flexible heat spreader
Grant 7,608,923 - Hsu October 27, 2 | 2009-10-27 |
Package and package module of the package
Grant 7,547,965 - Hsu June 16, 2 | 2009-06-16 |
Electronic device with package module
App 20090045505 - Hsu; Chi-Hsing | 2009-02-19 |
Chip structure with bevel pad row
Grant 7,485,974 - Liaw , et al. February 3, 2 | 2009-02-03 |
Multi-conducting through hole structure
Grant 7,470,864 - Ho , et al. December 30, 2 | 2008-12-30 |
Chip structure with arrangement of side pads
Grant 7,449,788 - Liaw , et al. November 11, 2 | 2008-11-11 |
Chip Package
App 20080197503 - Hsu; Chi-Hsing | 2008-08-21 |
Circuit substrate and method of manufacturing plated through slot thereon
Grant 7,382,629 - Hsu June 3, 2 | 2008-06-03 |
Signal transmission structure and circuit substrate thereof
Grant 7,378,601 - Hsu , et al. May 27, 2 | 2008-05-27 |
Multi-chip Structure
App 20080116585 - Hsu; Chi-Hsing | 2008-05-22 |
Multi-chip structure
Grant 7,365,418 - Hsu April 29, 2 | 2008-04-29 |
Chip Package And Manufacturing Method Thereof
App 20080093733 - HSU; CHI-HSING | 2008-04-24 |
Bumpless chip package
Grant 7,361,982 - Hsu April 22, 2 | 2008-04-22 |
Die Pad Arrangement And Bumpless Chip Package Applying The Same
App 20080042257 - Hsu; Chi-Hsing | 2008-02-21 |
Multi-chip Structure
App 20080036062 - Hsu; Chi-Hsing | 2008-02-14 |
Circuit Board And Manufacturing Method Thereof
App 20070278661 - Hsu; Chi-Hsing | 2007-12-06 |
Chip Package
App 20070257361 - Hsu; Chi-Hsing | 2007-11-08 |
Signal transmission structure and circuit substrate thereof
Grant 7,291,916 - Hsu , et al. November 6, 2 | 2007-11-06 |
Chip package and stacked structure of chip packages
App 20070194426 - Hsu; Chi-Hsing | 2007-08-23 |
Semiconductor packaging substrate and method of producing the same
Grant 7,253,526 - Hsu , et al. August 7, 2 | 2007-08-07 |
Chip package with embedded component
Grant 7,230,332 - Hsu June 12, 2 | 2007-06-12 |
Chip package with embedded panel-shaped component
Grant 7,224,062 - Hsu May 29, 2 | 2007-05-29 |
Package and package module of the package
App 20070108625 - Hsu; Chi-Hsing | 2007-05-17 |
Circuit structure of package substrate
Grant 7,193,324 - Hsu March 20, 2 | 2007-03-20 |
Bumpless chip package
App 20070040259 - Hsu; Chi-Hsing | 2007-02-22 |
Circuit substrate and method of manufacturing plated through slot thereon
App 20070017697 - Hsu; Chi-Hsing | 2007-01-25 |
Die pad arrangement and bumpless chip package applying the same
App 20070013079 - Hsu; Chi-Hsing | 2007-01-18 |
Circuit carrier and package structure thereof
Grant 7,145,234 - Chang , et al. December 5, 2 | 2006-12-05 |
Chip structure with bevel pad row
App 20060261497 - Liaw; Yuan-Tsang ; et al. | 2006-11-23 |
Chip structure with arrangement of side pads
App 20060261496 - Liaw; Yuan-Tsang ; et al. | 2006-11-23 |
Chip package and electrical connection structure between chip and substrate
Grant 7,129,568 - Lee , et al. October 31, 2 | 2006-10-31 |
Flip chip package and process of forming the same
Grant 7,129,146 - Hsu October 31, 2 | 2006-10-31 |
Bump-less chip package
App 20060163723 - Hsu; Chi-Hsing | 2006-07-27 |
Chip package
App 20060157847 - Hsu; Chi-Hsing | 2006-07-20 |
Interconnection structure through passive component
App 20060158863 - Hsu; Chi-Hsing | 2006-07-20 |
Surrounding structure for a probe card
Grant 7,053,638 - Hsu , et al. May 30, 2 | 2006-05-30 |
Signal transmission structure and circuit substrate thereof
App 20060108143 - Hsu; Jimmy ; et al. | 2006-05-25 |
Chip package structure with glass substrate
Grant 7,038,309 - Hsu , et al. May 2, 2 | 2006-05-02 |
Circuit Structure
App 20060081990 - Hsu; Chi-Hsing | 2006-04-20 |
Circuit substrate and method of manufacturing plated through slot thereon
App 20060081396 - Hsu; Chi-Hsing | 2006-04-20 |
Signal transmission structure and circuit substrate thereof
App 20060065434 - Hsu; Chi-Hsing ; et al. | 2006-03-30 |
Multi-conducting through hole structure
App 20060012030 - Ho; Kwun-Yao ; et al. | 2006-01-19 |
Circuit substrate and method of manufacturing plated through slot thereon
App 20050252683 - Hsu, Chi-Hsing | 2005-11-17 |
Flip chip package and process of forming the same
App 20050253275 - Hsu, Chi-Hsing | 2005-11-17 |
Surrounding structure for a probe card
App 20050253604 - Hsu, Chi-Hsing ; et al. | 2005-11-17 |
Semiconductor packaging substrate and method of producing the same
App 20050230814 - Hsu, Chi-Hsing ; et al. | 2005-10-20 |
Semiconductor packaging substrate and method of producing the same
Grant 6,946,738 - Hsu , et al. September 20, 2 | 2005-09-20 |
Circuit carrier and package structure thereof
App 20050167815 - Chang, Kenny ; et al. | 2005-08-04 |
Chip package and electrical connection structure between chip and substrate
App 20050082645 - Lee, Sheng-Yuan ; et al. | 2005-04-21 |
Quad flat no-lead chip carrier
Grant 6,882,057 - Hsu April 19, 2 | 2005-04-19 |
Flip-chip die and flip-chip package substrate
Grant 6,861,740 - Hsu March 1, 2 | 2005-03-01 |
Chip package structure
App 20050035448 - Hsu, Chi-Hsing ; et al. | 2005-02-17 |
Package substrate and process thereof
App 20050035181 - Chang, Kenny ; et al. | 2005-02-17 |
[quad Flat No-lead Chip Carrier]
App 20040262724 - HSU, CHI-HSING | 2004-12-30 |
Flip chip package carrier
Grant 6,809,262 - Hsu October 26, 2 | 2004-10-26 |
[flip-chip Die And Flip-chip Package Substrate]
App 20040188856 - Hsu, Chi-Hsing | 2004-09-30 |
Semiconductor packaging substrate and method of producing the same
App 20040183213 - Hsu, Chi-Hsing ; et al. | 2004-09-23 |
Flip-chip package substrate
Grant 6,777,804 - Hsu August 17, 2 | 2004-08-17 |
Flip-chip package substrate
Grant 6,774,498 - Hsu , et al. August 10, 2 | 2004-08-10 |
Flip-chip package substrate
Grant 6,740,965 - Hsu , et al. May 25, 2 | 2004-05-25 |
Flip-chip die for joining with a flip-chip substrate
Grant 6,710,459 - Hsu March 23, 2 | 2004-03-23 |
Chip package structure
App 20040046255 - Hsu, Chi-Hsing ; et al. | 2004-03-11 |
Immersion cooling type light emitting diode and its packaging method
App 20040004435 - Hsu, Chi-Hsing | 2004-01-08 |
Flip-chip package substrate
App 20030234118 - Hsu, Chi-Hsing ; et al. | 2003-12-25 |
Flip-chip package substrate and flip chip die
App 20030227093 - Hsu, Chi-Hsing | 2003-12-11 |
Multi-chip package with embedded cooling element
Grant 6,643,136 - Hsu November 4, 2 | 2003-11-04 |
Flip-chip package substrate
App 20030201122 - Hsu, Chi-Hsing ; et al. | 2003-10-30 |
Flip-chip die and flip-chip package substrate
App 20030201528 - Hsu, Chi-Hsing | 2003-10-30 |
Method of making wafer level packaging and chip structure
Grant 6,596,560 - Hsu July 22, 2 | 2003-07-22 |
Wafer levelpackaging and chip structure
App 20030122253 - Hsu, Chi-Hsing | 2003-07-03 |
Semiconductor packaging substrate and method of producing the same
App 20030122213 - Hsu, Chi-Hsing ; et al. | 2003-07-03 |
Wafer Level Packaging And Chip Structure
App 20030124768 - Hsu, Chi-Hsing | 2003-07-03 |
Multi-chip package with embedded cooling element
App 20030112604 - Hsu, Chi-Hsing | 2003-06-19 |
Method of fabricating a wafer level package
App 20030008476 - Hsu, Wen ; et al. | 2003-01-09 |
Method for improving the liquid dispensing of IC packages
App 20010001070 - Hsu, Chi-Hsing ; et al. | 2001-05-10 |
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