Hsu; Chao-Shun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hsu; Chao-Shun.The latest application filed is for "programmable semiconductor interposer for electronic package and method of forming".

Company Profile

0.12.9

Hsu; Chao-Shun - San Shin TW
Hsu; Chao-Shun - I-Land County N/A TW
Hsu; Chao-Shun - Sansing Township Yilan County TW
Hsu; Chao-Shun - San-Shih TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Programmable semiconductor interposer for electronic package and method of forming Grant 8,945,998 - Hsu , et al. February 3, 2	2015-02-03
Barrier structures and methods for through substrate vias Grant 8,704,375 - Liu , et al. April 22, 2	2014-04-22
Programmable Semiconductor Interposer for Electronic Package and Method of Forming App 20130295727 - Hsu; Chao-Shun ; et al.	2013-11-07
On-chip inductors with through-silicon-via fence for Q improvement Grant 8,492,872 - Yang , et al. July 23, 2	2013-07-23
Programmable semiconductor interposer for electronic package and method of forming Grant 8,476,735 - Hsu , et al. July 2, 2	2013-07-02
TSV-enabled twisted pair Grant 7,812,426 - Peng , et al. October 12, 2	2010-10-12
Methods for forming single dies with multi-layer interconnect structures and structures formed therefrom Grant 7,795,735 - Hsu , et al. September 14, 2	2010-09-14
Barrier Structures and Methods for Through Substrate Vias App 20100193954 - Liu; Max ; et al.	2010-08-05
Extra High Bandwidth Memory Die Stack App 20100174858 - CHEN; Ming-Fa ; et al.	2010-07-08
TSV-Enabled Twisted Pair App 20090294915 - Peng; Mark Shane ; et al.	2009-12-03
SiP (system in package) design systems and methods Grant 7,565,635 - Chao , et al. July 21, 2	2009-07-21
On-chip inductors with through-silicon-via fence for Q improvement App 20090090995 - Yang; Li-Chun ; et al.	2009-04-09
Design techniques for stacking identical memory dies Grant 7,494,846 - Hsu , et al. February 24, 2	2009-02-24
Programmable semiconductor interposer for electronic package and method of forming App 20080296697 - Hsu; Chao-Shun ; et al.	2008-12-04
Sip (system In Package) Design Systems And Methods App 20080250182 - Chao; Clinton ; et al.	2008-10-09
Methods For Forming Single Dies With Multi-layer Interconnect Structures And Structures Formed Therefrom App 20080233710 - Hsu; Chao-Shun ; et al.	2008-09-25
Electromagnetic shielding using through-silicon vias Grant 7,427,803 - Chao , et al. September 23, 2	2008-09-23
Design techniques for stacking identical memory dies App 20080220565 - Hsu; Chao-Shun ; et al.	2008-09-11

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