Hsu; Chang-Sheng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hsu; Chang-Sheng.The latest application filed is for "semiconductor sensor and method of manufacturing the same".

Company Profile

10.25.21

Hsu; Chang-Sheng - Hsinchu TW
Hsu; Chang-Sheng - Hsinchu City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor sensor and method of manufacturing the same Grant 11,345,590 - Hu , et al. May 31, 2	2022-05-31
Semiconductor Sensor And Method Of Manufacturing The Same App 20210061643 - Hu; Chih-Fan ; et al.	2021-03-04
Semiconductor sensor and method of manufacturing the same Grant 10,870,576 - Hu , et al. December 22, 2	2020-12-22
Microelectromechanical system structure and method for fabricating the same Grant 10,793,426 - Hsu , et al. October 6, 2	2020-10-06
Micro-electro-mechanical system structure and method for fabricating the same Grant 10,737,932 - Lin , et al. A	2020-08-11
Micro-electro-mechanical System Structure And Method For Fabricating The Same App 20200223687 - LIN; Yuan-Sheng ; et al.	2020-07-16
Semiconductor Sensor And Method Of Manufacturing The Same App 20200216304 - Hu; Chih-Fan ; et al.	2020-07-09
Semiconductor sensor and method of manufacturing the same Grant 10,640,368 - Hu , et al.	2020-05-05
Method for manufacturing semiconductor device Grant 10,475,640 - Chen , et al. Nov	2019-11-12
Structure of gas sensor Grant 10,408,780 - Lee , et al. Sept	2019-09-10
Method For Manufacturing Semiconductor Device App 20190027358 - CHEN; YAN-DA ; et al.	2019-01-24
Microelectromechanical System Structure And Method For Fabricating The Same App 20180354783 - Hsu; Chang-Sheng ; et al.	2018-12-13
Semiconductor device and method for manufacturing the same Grant 10,115,582 - Chen , et al. October 30, 2	2018-10-30
Structure Of Gas Sensor App 20180306738 - LEE; Chia-Wei ; et al.	2018-10-25
Microelectromechanical system structure including thermal stability layer whose material has higher growth temperature, and method for fabricating the same Grant 10,087,072 - Hsu , et al. October 2, 2	2018-10-02
Piezoresistive microphone and method of fabricating the same Grant 9,961,450 - Hsu , et al. May 1, 2	2018-05-01
Semiconductor Sensor And Method Of Manufacturing The Same App 20180057354 - Hu; Chih-Fan ; et al.	2018-03-01
Avalanche photo detector device and manufacturing method thereof Grant 9,905,711 - Tan , et al. February 27, 2	2018-02-27
Piezoresistive Microphone And Method Of Fabricating The Same App 20180027337 - Hsu; Chang-Sheng ; et al.	2018-01-25
Microelectromechanical System Structure And Method For Fabricating The Same App 20170320727 - Hsu; Chang-Sheng ; et al.	2017-11-09
Avalanche Photo Detector Device And Manufacturing Method Thereof App 20170271529 - Tan; Tzung-Han ; et al.	2017-09-21
Microelectromechanical system microphone Grant 9,668,064 - Hsu , et al. May 30, 2	2017-05-30
Semiconductor Device and Method for Manufacturing the Same App 20160355398 - CHEN; YAN-DA ; et al.	2016-12-08
Semiconductor Structure And Method For Manufacturing The Same App 20160229692 - Lin; Yuan-Sheng ; et al.	2016-08-11
Microelectromechanical System Microphone App 20160212551 - Hsu; Chang-Sheng ; et al.	2016-07-21
Etching method for manufacturing MEMS device Grant 9,107,017 - Chiu , et al. August 11, 2	2015-08-11
Semiconductor device and method of forming the same Grant 8,981,501 - Lin , et al. March 17, 2	2015-03-17
Semiconductor Device And Method Of Forming The Same App 20140319693 - Lin; Meng-Jia ; et al.	2014-10-30
Method for supporting semiconductor wafer and wafer supporting assembly Grant 8,776,363 - Hsu , et al. July 15, 2	2014-07-15
Thinned wafer and fabricating method thereof Grant 8,754,504 - Hsu , et al. June 17, 2	2014-06-17
Chip package and fabrication method thereof Grant 8,716,109 - Ni , et al. May 6, 2	2014-05-06
Chip Package And Fabrication Method Thereof App 20140017854 - NI; Ching-Yu ; et al.	2014-01-16
Method For Supporting Semiconductor Wafer And Wafer Supporting Assembly App 20130312246 - Hsu; Chang-Sheng ; et al.	2013-11-28
Thinned Wafer And Fabricating Method Thereof App 20130313691 - Hsu; Chang-Sheng ; et al.	2013-11-28
Chip package and fabrication method thereof Grant 8,564,123 - Ni , et al. October 22, 2	2013-10-22
Wafer with eutectic bonding carrier and method of manufacturing the same Grant 8,536,709 - Hsu , et al. September 17, 2	2013-09-17
Chip package and fabrication method thereof Grant 8,432,032 - Lin , et al. April 30, 2	2013-04-30
Chip Package And Fabrication Method Thereof App 20110175221 - NI; Ching-Yu ; et al.	2011-07-21
Chip Package And Fabrication Method Thereof App 20110169139 - Lin; Chia-Sheng ; et al.	2011-07-14

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