Hsieh; Yun Chen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hsieh; Yun Chen.The latest application filed is for "processes for reducing leakage and improving adhesion".

Company Profile

19.12.15

Hsieh; Yun Chen - Baoshan Township TW
Hsieh; Yun-Chen - Hsinchu County TW
Hsieh; Yun Chen - Hsinchu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package and method Grant 11,404,308 - Kuo , et al. August 2, 2	2022-08-02
Processes for Reducing Leakage and Improving Adhesion App 20210242083 - Hsieh; Yun Chen ; et al.	2021-08-05
Semiconductor Device Having Via Sidewall Adhesion with Encapsulant App 20210225751 - Yu; Chen-Hua ; et al.	2021-07-22
Semiconductor device having via sidewall adhesion with encapsulant Grant 10,971,442 - Yu , et al. April 6, 2	2021-04-06
Method of Forming RDLS and Structure Formed Thereof App 20210098383 - Kuo; Hung-Jui ; et al.	2021-04-01
Processes for reducing leakage and improving adhesion Grant 10,964,591 - Hsieh , et al. March 30, 2	2021-03-30
Semiconductor Package and Method App 20210082745 - Kuo; Hung-Jui ; et al.	2021-03-18
Method of manufacturing conductive feature and method of manufacturing package Grant 10,892,228 - Tsai , et al. January 12, 2	2021-01-12
Method of forming RDLS and structure formed thereof Grant 10,886,231 - Kuo , et al. January 5, 2	2021-01-05
Semiconductor device and method Grant 10,867,874 - Yu , et al. December 15, 2	2020-12-15
Semiconductor package and method Grant 10,840,129 - Kuo , et al. November 17, 2	2020-11-17
Semiconductor Package and Method App 20200126850 - Kuo; Hung-Jui ; et al.	2020-04-23
Semiconductor Structure and Method of Forming the Same App 20200051949 - Tsai; Hui-Jung ; et al.	2020-02-13
Semiconductor Structure and Method of Forming the Same App 20200013750 - Tsai; Hui-Jung ; et al.	2020-01-09
Method of Forming RDLS and Structure Formed Thereof App 20200006240 - Kuo; Hung-Jui ; et al.	2020-01-02
Semiconductor structure and method of forming the same Grant 10,522,501 - Tsai , et al. Dec	2019-12-31
Semiconductor package and method Grant 10,515,848 - Kuo , et al. Dec	2019-12-24
Processes for Reducing Leakage and Improving Adhesion App 20190326167 - Hsieh; Yun Chen ; et al.	2019-10-24
Semiconductor Device Having Via Sidewall Adhesion With Encapsulant App 20190318986 - Yu; Chen-Hua ; et al.	2019-10-17
Methods Of Manufacturing Conductive Feature And Method Of Manufacturing Package App 20190273045 - Tsai; Hui-Jung ; et al.	2019-09-05
Processes for reducing leakage and improving adhesion Grant 10,361,122 - Hsieh , et al.	2019-07-23
Semiconductor Device and Method App 20190214317 - Yu; Chen-Hua ; et al.	2019-07-11
Three-step Etching to Form RDL App 20190157240 - Tsai; Hui-Jung ; et al.	2019-05-23
Method of manufacturing redistribution circuit structure and method of manufacturing integrated fan-out package Grant 10,297,551 - Tsai , et al.	2019-05-21
Semiconductor device and method Grant 10,186,462 - Yu , et al. Ja	2019-01-22
Semiconductor Device and Method App 20180151453 - Yu; Chen-Hua ; et al.	2018-05-31
Method Of Manufacturing Redistribution Circuit Structure And Method Of Manufacturing Integrated Fan-out Package App 20180047674 - Tsai; Hui-Jung ; et al.	2018-02-15

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