Hsieh; Yuan-Chih
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hsieh; Yuan-Chih.The latest application filed is for "conductive bond structure to increase membrane sensitivty in mems device".
Company Profile
17.93.96
- Hsieh; Yuan-Chih - Hsinchu City TW
- Hsieh; Yuan-Chih - Hsinchu TW
- Hsieh; Yuan-Chih - Hsin-Chu TW
- Hsieh; Yuan-Chih - Hsin-Chu City TW
Patent Activity
| Patent | Date |
|---|---|
| Conductive Bond Structure To Increase Membrane Sensitivty In Mems Device App 20220219973 - Lin; Hung-Hua ; et al. | 2022-07-14 |
| Integrate Rinse Module in Hybrid Bonding Platform App 20220216052 - Huang; Xin-Hua ; et al. | 2022-07-07 |
| Undercut-free patterned aluminum nitride structure and methods for forming the same Grant 11,371,133 - Hsieh , et al. June 28, 2 | 2022-06-28 |
| Conductive bond structure to increase membrane sensitivity in MEMS device Grant 11,292,715 - Lin , et al. April 5, 2 | 2022-04-05 |
| Structure For Microelectromechanical Systems (mems) Devices To Control Pressure At High Temperature App 20220089434 - Wang; Yi-Ren ; et al. | 2022-03-24 |
| Integrate rinse module in hybrid bonding platform Grant 11,282,697 - Huang , et al. March 22, 2 | 2022-03-22 |
| Packaging Method And Associated Packaging Structure App 20220017363 - CHEN; Chih-Ming ; et al. | 2022-01-20 |
| Undercut-free Patterned Aluminum Nitride Structure And Methods For Forming The Same App 20220018009 - Hsieh; Yuan-Chih ; et al. | 2022-01-20 |
| Structure for microelectromechanical systems (MEMS) devices to control pressure at high temperature Grant 11,198,606 - Wang , et al. December 14, 2 | 2021-12-14 |
| Segmented Pedestal For Mounting Device On Chip App 20210331915 - Tseng; Lee-Chuan ; et al. | 2021-10-28 |
| Microelectromechanical Systems Device Having A Mechanically Robust Anti-stiction/outgassing Structure App 20210309508 - Chang; Kuei-Sung ; et al. | 2021-10-07 |
| Method To Protect Electrodes From Oxidation In A Mems Device App 20210265557 - Wang; Yi-Ren ; et al. | 2021-08-26 |
| Segmented pedestal for mounting device on chip Grant 11,084,715 - Tseng , et al. August 10, 2 | 2021-08-10 |
| Packaging method and associated packaging structure Grant 11,078,075 - Chen , et al. August 3, 2 | 2021-08-03 |
| Method to protect electrodes from oxidation in a MEMS device Grant 11,050,012 - Wang , et al. June 29, 2 | 2021-06-29 |
| Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structure Grant 11,040,870 - Chang , et al. June 22, 2 | 2021-06-22 |
| Methods For Patterning A Silicon Oxide-silicon Nitride-silicon Oxide Stack And Structures Formed By The Same App 20210183641 - Wang; Yi-Ren ; et al. | 2021-06-17 |
| Method of forming semiconductor package and semiconductor package Grant 11,014,805 - Cheng , et al. May 25, 2 | 2021-05-25 |
| Semiconductor Structure And Manufacturing Method For The Same App 20210122625 - HSIEH; YUAN-CHIH ; et al. | 2021-04-29 |
| Semiconductor arrangement and formation thereof Grant 10,981,781 - Huang , et al. April 20, 2 | 2021-04-20 |
| Structure For Microelectromechanical Systems (mems) Devices To Control Pressure At High Temperature App 20210087055 - Wang; Yi-Ren ; et al. | 2021-03-25 |
| Semiconductor Mems Structure App 20210053816 - HSIEH; Yuan-Chih ; et al. | 2021-02-25 |
| Microelectromechanical Systems Device Having A Mechanically Robust Anti-stiction/outgassing Structure App 20210024348 - Chang; Kuei-Sung ; et al. | 2021-01-28 |
| Conductive Bond Structure To Increase Membrane Sensitivty In Mems Device App 20200407220 - Lin; Hung-Hua ; et al. | 2020-12-31 |
| Method and apparatus for reducing in-process and in-use stiction for MEMS devices Grant 10,870,574 - Tseng , et al. December 22, 2 | 2020-12-22 |
| Packaging method and associated packaging structure Grant 10,865,103 - Chen , et al. December 15, 2 | 2020-12-15 |
| Segmented Pedestal For Mounting Device On Chip App 20200369515 - Tseng; Lee-Chuan ; et al. | 2020-11-26 |
| Method To Protect Electrodes From Oxidation In A Mems Device App 20200313073 - Wang; Yi-Ren ; et al. | 2020-10-01 |
| Semiconductor MEMS structure Grant 10,787,360 - Hsieh , et al. September 29, 2 | 2020-09-29 |
| Integrate rinse module in hybrid bonding platform Grant 10,665,449 - Huang , et al. | 2020-05-26 |
| Semiconductor Arrangement And Formation Thereof App 20200062587 - Huang; Hsin-Ting ; et al. | 2020-02-27 |
| Method Of Forming Semiconductor Package And Semiconductor Package App 20200002161 - CHENG; Chun-wen ; et al. | 2020-01-02 |
| Integrate Rinse Module in Hybrid Bonding Platform App 20200006052 - Huang; Xin-Hua ; et al. | 2020-01-02 |
| Semiconductor arrangement and formation thereof Grant 10,464,808 - Huang , et al. No | 2019-11-05 |
| Semiconductor Mems Structure App 20190256346 - HSIEH; Yuan-Chih ; et al. | 2019-08-22 |
| Method of forming micro electromechanical system sensor Grant 10,384,933 - Cheng , et al. A | 2019-08-20 |
| Method And Apparatus For Reducing In-process And In-use Stiction For Mems Devices App 20190241425 - Tseng; Lee-Chuan ; et al. | 2019-08-08 |
| Method and apparatus for reducing in-process and in-use stiction for MEMS devices Grant 10,273,143 - Tseng , et al. | 2019-04-30 |
| Semiconductor MEMS structure Grant 10,273,142 - Hsieh , et al. | 2019-04-30 |
| Packaging Method And Associated Packaging Structure App 20190100431 - Chen; Chih-Ming ; et al. | 2019-04-04 |
| Method and apparatus for a semiconductor structure Grant 10,160,638 - Chu , et al. Dec | 2018-12-25 |
| Structure to reduce backside silicon damage Grant 10,138,118 - Chou , et al. Nov | 2018-11-27 |
| Biological sensing structures Grant 10,119,909 - Lin , et al. November 6, 2 | 2018-11-06 |
| Method of selectively removing an anti-stiction layer on a eutectic bonding area Grant 10,053,361 - Hsieh , et al. August 21, 2 | 2018-08-21 |
| Wafer Level Hermetic Seal Process for microelectromechanical systems (MEMS) devices Grant 9,975,757 - Tseng , et al. May 22, 2 | 2018-05-22 |
| Method And Apparatus For Reducing In-process And In-use Stiction For Mems Devices App 20180134542 - Tseng; Lee-Chuan ; et al. | 2018-05-17 |
| Semiconductor Mems Structure App 20180099865 - HSIEH; Yuan-Chih ; et al. | 2018-04-12 |
| Method and apparatus for reducing in-process and in-use stiction for MEMS devices Grant 9,878,899 - Tseng , et al. January 30, 2 | 2018-01-30 |
| Semiconductor Arrangement And Formation Thereof App 20180022602 - Huang; Hsin-Ting ; et al. | 2018-01-25 |
| Multiple bonding in wafer level packaging Grant 9,873,610 - Lin , et al. January 23, 2 | 2018-01-23 |
| Structure To Reduce Backside Silicon Damage App 20170355598 - Chou; Chung-Yen ; et al. | 2017-12-14 |
| Semiconductor MEMS structure and manufacturing method thereof Grant 9,828,234 - Hsieh , et al. November 28, 2 | 2017-11-28 |
| Method Of Forming Micro Electromechanical System Sensor App 20170313581 - CHENG; Chun-wen ; et al. | 2017-11-02 |
| Semiconductor Mems Structure And Manufacturing Method Thereof App 20170313574 - HSIEH; YUAN-CHIH ; et al. | 2017-11-02 |
| Method for fabricating a micro-well of a biosensor Grant 9,796,584 - Chang , et al. October 24, 2 | 2017-10-24 |
| Method for controlling surface roughness in MEMS structure Grant 9,776,852 - Hsieh , et al. October 3, 2 | 2017-10-03 |
| Semiconductor arrangement and formation thereof Grant 9,776,858 - Huang , et al. October 3, 2 | 2017-10-03 |
| Structure to reduce backside silicon damage Grant 9,738,516 - Chou , et al. August 22, 2 | 2017-08-22 |
| Packaging Method And Associated Packaging Structure App 20170225947 - CHEN; CHIH-MING ; et al. | 2017-08-10 |
| Micro electromechanical system sensor and method of forming the same Grant 9,725,310 - Cheng , et al. August 8, 2 | 2017-08-08 |
| Method For Controlling Surface Roughness In Mems Structure App 20170217756 - HSIEH; YUAN-CHIH ; et al. | 2017-08-03 |
| CMOS compatible biofet Grant 9,714,914 - Tseng , et al. July 25, 2 | 2017-07-25 |
| Method of improving getter efficiency by increasing superficial area Grant 9,708,179 - Hsieh , et al. July 18, 2 | 2017-07-18 |
| Method For Fabricating A Micro-well Of A Biosensor App 20170158500 - Chang; Che-Ming ; et al. | 2017-06-08 |
| Cup-like getter scheme Grant 9,637,378 - Chan , et al. May 2, 2 | 2017-05-02 |
| Method And Apparatus For Reducing In-process And In-use Stiction For Mems Devices App 20170096328 - Tseng; Lee-Chuan ; et al. | 2017-04-06 |
| Self-removal anti-stiction coating for bonding process Grant 9,611,141 - Liu , et al. April 4, 2 | 2017-04-04 |
| Method for fabricating a micro-well of a biosensor Grant 9,606,081 - Chang , et al. March 28, 2 | 2017-03-28 |
| Integrate Rinse Module in Hybrid Bonding Platform App 20170004964 - Huang; Xin-Hua ; et al. | 2017-01-05 |
| MEMS structures and methods for forming the same Grant 9,533,876 - Liu , et al. January 3, 2 | 2017-01-03 |
| Grinding wheel for wafer edge trimming Grant 9,527,188 - Huang , et al. December 27, 2 | 2016-12-27 |
| Wafer Level Hermetic Seal Process For Microelectromechanical Systems (mems) Devices App 20160355394 - Tseng; Lee-Chuan ; et al. | 2016-12-08 |
| Structure To Reduce Backside Silicon Damage App 20160318757 - Chou; Chung-Yen ; et al. | 2016-11-03 |
| Semiconductor having a high aspect ratio via Grant 9,472,504 - Hsieh , et al. October 18, 2 | 2016-10-18 |
| Biological Sensing Structures App 20160299068 - Lin; Hung-Hua ; et al. | 2016-10-13 |
| Integrate rinse module in hybrid bonding platform Grant 9,446,467 - Huang , et al. September 20, 2 | 2016-09-20 |
| Method For Fabricating A Micro-well Of A Biosensor App 20160266063 - Chang; Che-Ming ; et al. | 2016-09-15 |
| Robot blade design Grant 9,434,076 - Tseng , et al. September 6, 2 | 2016-09-06 |
| Self-removal Anti-stiction Coating For Bonding Process App 20160229693 - Liu; Ping-Yin ; et al. | 2016-08-11 |
| Cmos Compatible Biofet App 20160209355 - Tseng; Lee-Chuan ; et al. | 2016-07-21 |
| Method of Selectively Removing an Anti-Stiction Layer on a Eutectic Bonding Area App 20160185592 - Hsieh; Yuan-Chih ; et al. | 2016-06-30 |
| Biological sensing structures Grant 9,377,401 - Lin , et al. June 28, 2 | 2016-06-28 |
| Transfer module for bowed wafers Grant 9,355,882 - Wu , et al. May 31, 2 | 2016-05-31 |
| Hermetic wafer level packaging Grant 9,337,168 - Chu , et al. May 10, 2 | 2016-05-10 |
| Method Of Improving Getter Efficiency By Increasing Superficial Area App 20160101976 - Hsieh; Yuan-Chih ; et al. | 2016-04-14 |
| Wafer level packaging bond Grant 9,293,445 - Liu , et al. March 22, 2 | 2016-03-22 |
| Method of improving getter efficiency by increasing superficial area Grant 9,242,853 - Hsieh , et al. January 26, 2 | 2016-01-26 |
| Noble gas bombardment to reduce scallops in bosch etching Grant 9,224,615 - Chang , et al. December 29, 2 | 2015-12-29 |
| Semiconductor Having A High Aspect Ratio Via App 20150332968 - Hsieh; Yuan-Chih ; et al. | 2015-11-19 |
| MEMS Structures and Methods for Forming the Same App 20150266722 - Liu; Ping-Yin ; et al. | 2015-09-24 |
| Semiconductor Arrangement And Formation Thereof App 20150239732 - Huang; Hsin-Ting ; et al. | 2015-08-27 |
| Semiconductor having a high aspect ratio via Grant 9,099,476 - Hsieh , et al. August 4, 2 | 2015-08-04 |
| Micro Electromechanical System Sensor And Method Of Forming The Same App 20150175407 - CHENG; Chun-wen ; et al. | 2015-06-25 |
| MEMS structures and methods for forming the same Grant 9,054,121 - Liu , et al. June 9, 2 | 2015-06-09 |
| Transfer Module for Bowed Wafers App 20150155196 - Wu; Ming-Tung ; et al. | 2015-06-04 |
| MEMS device and method of formation thereof Grant 9,034,677 - Huang , et al. May 19, 2 | 2015-05-19 |
| Method of Improving Getter Efficiency by Increasing Superficial Area App 20150102432 - Hsieh; Yuan-Chih ; et al. | 2015-04-16 |
| Noble Gas Bombardment To Reduce Scallops In Bosch Etching App 20150069581 - Chang; Che-Ming ; et al. | 2015-03-12 |
| Cup-Like Getter Scheme App 20150069539 - Chan; Chih-Jen ; et al. | 2015-03-12 |
| MEMS devices Grant 8,969,979 - Lee , et al. March 3, 2 | 2015-03-03 |
| Robot Blade Design App 20150044008 - Tseng; Lee-Chuan ; et al. | 2015-02-12 |
| Biological Sensing Structures App 20150044759 - LIN; Hung-Hua ; et al. | 2015-02-12 |
| Systems and methods of separating bonded wafers Grant 8,945,344 - Huang , et al. February 3, 2 | 2015-02-03 |
| Transistor Having Partially Or Wholly Replaced Substrate And Method Of Making The Same App 20150021666 - CHEN; Chi-Ming ; et al. | 2015-01-22 |
| Self-removal anti-stiction coating for bonding process Grant 8,905,293 - Liu , et al. December 9, 2 | 2014-12-09 |
| Biological sensing structures and methods of forming the same Grant 8,846,129 - Lin , et al. September 30, 2 | 2014-09-30 |
| Integrate Rinse Module in Hybrid Bonding Platform App 20140263586 - Huang; Xin-Hua ; et al. | 2014-09-18 |
| MEMS Device and Method of Formation Thereof App 20140248730 - Huang; Hsin-Ting ; et al. | 2014-09-04 |
| Method of making wafer structure for backside illuminated color image sensor Grant 8,790,954 - Hsu , et al. July 29, 2 | 2014-07-29 |
| Methods of bonding caps for MEMS devices Grant 8,790,946 - Huang , et al. July 29, 2 | 2014-07-29 |
| Method and Apparatus for a Semiconductor Structure App 20140191341 - Chu; Li-Cheng ; et al. | 2014-07-10 |
| Hermetic Wafer Level Packaging App 20140154841 - Chu; Richard ; et al. | 2014-06-05 |
| Method to prevent metal pad damage in wafer level package Grant 8,735,260 - Tsai , et al. May 27, 2 | 2014-05-27 |
| Wafer Level Packaging Bond App 20140138853 - Liu; Martin ; et al. | 2014-05-22 |
| Embedded bonding pad for image sensors Grant 8,710,560 - Hsieh , et al. April 29, 2 | 2014-04-29 |
| MEMS Devices and Methods for Forming the Same App 20140103462 - Lee; Te-Hao ; et al. | 2014-04-17 |
| Semiconductor Having a High Aspect Ratio Via App 20140054779 - Hsieh; Yuan-Chih ; et al. | 2014-02-27 |
| Grinding Wheel For Wafer Edge Trimming App 20140051336 - HUANG; Xin-Hua ; et al. | 2014-02-20 |
| Wafer level packaging bond Grant 8,647,962 - Liu , et al. February 11, 2 | 2014-02-11 |
| Hermetic wafer level packaging Grant 8,648,468 - Chu , et al. February 11, 2 | 2014-02-11 |
| Systems and Methods of Separating Bonded Wafers App 20140020818 - Huang; Xin-Hua ; et al. | 2014-01-23 |
| Power devices having reduced on-resistance and methods of their manufacture Grant 8,633,086 - Kalnitsky , et al. January 21, 2 | 2014-01-21 |
| Methods for forming MEMS devices Grant 8,623,768 - Lee , et al. January 7, 2 | 2014-01-07 |
| Method of Making Wafer Structure for Backside Illuminated Color Image Sensor App 20130344640 - Hsu; Tzu-Hsuan ; et al. | 2013-12-26 |
| Semiconductor having a high aspect ratio via Grant 8,598,687 - Hsieh , et al. December 3, 2 | 2013-12-03 |
| Method of fabricating a semiconductor device having recessed bonding site Grant 8,580,594 - Huang , et al. November 12, 2 | 2013-11-12 |
| Multiple Bonding In Wafer Level Packaging App 20130285170 - Lin; Chung-Hsien ; et al. | 2013-10-31 |
| Biological Sensing Structures And Methods Of Forming The Same App 20130208371 - LIN; Hung-Hua ; et al. | 2013-08-15 |
| Methods of Bonding Caps for MEMS Devices App 20130203199 - Huang; Xin-Hua ; et al. | 2013-08-08 |
| Multiple bonding in wafer level packaging Grant 8,486,744 - Lin , et al. July 16, 2 | 2013-07-16 |
| MEMS Devices and Methods for Forming the Same App 20130140650 - Lee; Te-Hao ; et al. | 2013-06-06 |
| Semiconductor having a high aspect ratio via Grant 8,445,380 - Hsieh , et al. May 21, 2 | 2013-05-21 |
| MEMS Structures and Methods for Forming the Same App 20130099355 - Liu; Ping-Yin ; et al. | 2013-04-25 |
| Handling layer for transparent substrate Grant 8,405,169 - Cheng , et al. March 26, 2 | 2013-03-26 |
| Mems Device And Method Of Formation Thereof App 20130037891 - Huang; Hsin-Ting ; et al. | 2013-02-14 |
| Method of fabricating backside illuminated image sensor Grant 8,357,561 - Fu , et al. January 22, 2 | 2013-01-22 |
| Semiconductor Having A High Aspect Ratio Via App 20120238091 - Hsieh; Yuan-Chih ; et al. | 2012-09-20 |
| Semiconductor Having A High Aspect Ratio Via App 20120235300 - Hsieh; Yuan-Chih ; et al. | 2012-09-20 |
| Semiconductor having a high aspect ratio via Grant 8,207,595 - Hsieh , et al. June 26, 2 | 2012-06-26 |
| Self-removal Anti-stiction Coating For Bonding Process App 20120148870 - Liu; Ping-Yin ; et al. | 2012-06-14 |
| Method To Prevent Metal Pad Damage In Wafer Level Package App 20120149152 - Tsai; Shang-Ying ; et al. | 2012-06-14 |
| Handling Layer For Transparent Substrate App 20120091598 - Cheng; Chun-Ren ; et al. | 2012-04-19 |
| Semiconductor Having A High Aspect Ratio Via App 20120080761 - Hsieh; Yuan-Chih ; et al. | 2012-04-05 |
| Multiple Bonding In Wafer Level Packaging App 20120074590 - Lin; Chung-Hsien ; et al. | 2012-03-29 |
| Hermetic Wafer Level Packaging App 20120025389 - Chu; Richard ; et al. | 2012-02-02 |
| Wafer Level Packaging Bond App 20110233621 - Liu; Martin ; et al. | 2011-09-29 |
| Power Devices Having Reduced On-resistance And Methods Of Their Manufacture App 20110156217 - Kalnitsky; Alex ; et al. | 2011-06-30 |
| Method Of Fabricating Backside Illuminated Image Sensor App 20110159631 - Fu; Shih-Chu ; et al. | 2011-06-30 |
| Method of fabricating backside illuminated image sensor Grant 7,923,344 - Fu , et al. April 12, 2 | 2011-04-12 |
| Semiconductor device with bonding pad Grant 7,883,917 - Liu , et al. February 8, 2 | 2011-02-08 |
| Methods for fabricating image sensor devices Grant 7,883,926 - Shiau , et al. February 8, 2 | 2011-02-08 |
| Reduced refractive index and extinction coefficient layer for enhanced photosensitivity Grant 7,799,654 - Hsieh , et al. September 21, 2 | 2010-09-21 |
| Methods For Fabricating Image Sensor Devices App 20100151615 - Shiau; Gwo-Yuh ; et al. | 2010-06-17 |
| Process for wafer bonding Grant 7,732,299 - Chang , et al. June 8, 2 | 2010-06-08 |
| Methods for fabricating image sensor devices Grant 7,709,872 - Shiau , et al. May 4, 2 | 2010-05-04 |
| Method Of Fabricating Backside Illuminated Image Sensor App 20100087029 - Fu; Shih-Chi ; et al. | 2010-04-08 |
| Method of fabricating backside illuminated image sensor Grant 7,648,851 - Fu , et al. January 19, 2 | 2010-01-19 |
| Semiconductor Device With Bonding Pad App 20090124073 - Liu; Ming-Chyi ; et al. | 2009-05-14 |
| Embedded Bonding Pad For Image Sensors App 20090039452 - Hsieh; Yuan-Chih ; et al. | 2009-02-12 |
| Semiconductor Device With Bonding Pad App 20080246152 - Liu; Ming-Chyi ; et al. | 2008-10-09 |
| Process For Wafer Bonding App 20080194076 - Chang; Fa-Yuan ; et al. | 2008-08-14 |
| Methods For Fabricating Image Sensor Devices App 20080061330 - Shiau; Gwo-Yuh ; et al. | 2008-03-13 |
| Methods Of Avoiding Wafer Breakage During Manufacture Of Backside Illuminated Image Sensors App 20080044984 - Hsieh; Yuan-Chih ; et al. | 2008-02-21 |
| Method of fabricating backside illuminated image sensor App 20070207566 - Fu; Shih-Chi ; et al. | 2007-09-06 |
| Reduced refractive index and extinction coefficient layer for enhanced photosensitivity App 20070048965 - Hsieh; Yuan-Chih ; et al. | 2007-03-01 |
| [electroplating Apparatus] App 20050067274 - TING, SHAO-YU ; et al. | 2005-03-31 |
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