Hsieh; Yi-Hwa

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hsieh; Yi-Hwa.The latest application filed is for "printed circuit board assembly and assembling method thereof".

Company Profile

2.10.10

Hsieh; Yi-Hwa - Taoyuan TW
Hsieh; Yi-Hwa - Taoyuan City TW
Hsieh; Yi-Hwa - Taoyuan Hsien N/A TW
Hsieh, Yi Hwa - Taoyuan Shien TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Printed circuit board assembly and assembling method thereof Grant 10,568,207 - Kuo , et al. Feb	2020-02-18
Printed circuit board assembly and assembling method thereof Grant 10,568,206 - Kuo , et al. Feb	2020-02-18
Printed circuit board assembly and assembling method thereof Grant 10,321,565 - Kuo , et al.	2019-06-11
Printed Circuit Board Assembly And Assembling Method Thereof App 20190166692 - Kuo; Ching-Chi ; et al.	2019-05-30
Printed Circuit Board Assembly And Assembling Method Thereof App 20190150281 - Kuo; Ching-Chi ; et al.	2019-05-16
Printed Circuit Board Assembly And Assembling Method Thereof App 20180352655 - Kuo; Ching-Chi ; et al.	2018-12-06
Modular heat-dissipating device Grant 8,467,188 - Hsieh , et al. June 18, 2	2013-06-18
Heat-dissipating module and electronic device using same Grant 8,462,509 - Hsieh , et al. June 11, 2	2013-06-11
Heat-dissipating Module And Electronic Device Using Same App 20110222246 - Hsieh; Yi-Hwa ; et al.	2011-09-15
Modular Heat-dissipating Device App 20110192568 - Hsieh; Yi-Hwa ; et al.	2011-08-11
Circuit Module And Circuit Board Assembly Having Sip Connector App 20090097211 - Chen; Tsu-Cheng ; et al.	2009-04-16
Power module fabrication method and structure thereof Grant 7,491,583 - Kuo , et al. February 17, 2	2009-02-17
Electronic device with dual heat dissipating structures Grant 7,365,972 - Chen , et al. April 29, 2	2008-04-29
Electronic device with dual heat dissipating structures App 20070115643 - Chen; Tsu-Cheng ; et al.	2007-05-24
Power module fabrication method and structure thereof App 20070090513 - Kuo; Chin Chi ; et al.	2007-04-26
Assembling structure of electronic device App 20020154492 - Huang, Kai Hung ; et al.	2002-10-24
Power supply device for enhancing heat-dissipating effect App 20020041506 - Chen, Kun-Feng ; et al.	2002-04-11
Power supply device for enhancing heat-dissipating effect Grant 6,366,486 - Chen , et al. April 2, 2	2002-04-02

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.