HSIEH; Tung-Hsien

Patent Applications and Registrations

Patent applications and USPTO patent grants for HSIEH; Tung-Hsien.The latest application filed is for "probe card assembly".

Company Profile

2.20.28

HSIEH; Tung-Hsien - Hsinchu City TW
Hsieh; Tung-Hsien - Huwei TW
Hsieh; Tung-Hsien - Yunlin TW
Hsieh; Tung-Hsien - Hsinchu County TW
Hsieh; Tung-Hsien - Zhubei TW
HSIEH; Tung-Hsien - Zhubei City TW
Hsieh; Tung-Hsien - Yunlin Hsien TW
Hsieh; Tung-Hsien - Changhua County TW
Hsieh; Tung-Hsien - Dajia Township Taichung County TW
Hsieh; Tung-Hsien - Dajia Townsip TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Probe Card Assembly App 20220196706 - HSIEH; Tung-Hsien	2022-06-23
Many-to-many state identification system of equipment names that are broadcasted from Internet-of-Things Grant 11,290,571 - Jywe , et al. March 29, 2	2022-03-29
Many-to-many State Identification System Of Equipment Names That Are Broadcasted From Internet-of-things App 20210258402 - JYWE; Wen-Yuh ; et al.	2021-08-19
Optical detecting apparatus for detecting a degree of freedom error of a spindle and a detecting method thereof Grant 10,571,259 - Jywe , et al. Feb	2020-02-25
Semiconductor device and wafer level package including such semiconductor device Grant 10,224,287 - Syu , et al.	2019-03-05
Semiconductor package assembly Grant 10,147,674 - Hsieh , et al. De	2018-12-04
Optical Detecting Apparatus For Detecting A Degree Of Freedom Error Of A Spindle And A Detecting Method Thereof App 20180299263 - Jywe; Wen-Yuh ; et al.	2018-10-18
Semiconductor chip package assembly with improved heat dissipation performance Grant 10,079,192 - Hsiao , et al. September 18, 2	2018-09-18
Semiconductor Package Assembly App 20170271250 - HSIEH; Tung-Hsien ; et al.	2017-09-21
Semiconductor Device And Wafer Level Package Including Such Semiconductor Device App 20170271265 - Syu; Shih-Yi ; et al.	2017-09-21
Semiconductor package assembly Grant 9,704,792 - Hsieh , et al. July 11, 2	2017-07-11
Semiconductor device and wafer level package including such semiconductor device Grant 9,704,808 - Syu , et al. July 11, 2	2017-07-11
Semiconductor package with die paddle Grant 9,704,785 - Hsieh , et al. July 11, 2	2017-07-11
Semiconductor Chip Package Assembly With Improved Heat Dissipation Performance App 20160329262 - Hsiao; Ching-Wen ; et al.	2016-11-10
Semiconductor Device And Wafer Level Package Including Such Semiconductor Device App 20160276277 - Syu; Shih-Yi ; et al.	2016-09-22
Semiconductor Package Assembly App 20160260659 - HSIEH; Tung-Hsien ; et al.	2016-09-08
Semiconductor Package App 20160204053 - HSIEH; Tung-Hsien ; et al.	2016-07-14
Semiconductor package assembly with decoupling capacitor Grant 9,331,054 - Chang , et al. May 3, 2	2016-05-03
Method of numerical-control scraping of a work piece Grant 9,244,458 - Jywe , et al. January 26, 2	2016-01-26
Semiconductor Package Assembly App 20140264812 - CHANG; Sheng-Ming ; et al.	2014-09-18
Flip-chip Package App 20140042615 - HUANG; Ching-Liou ; et al.	2014-02-13
Chip Package App 20130277801 - CHEN; Nan-Cheng ; et al.	2013-10-24
Method Of Numerical-control Scraping Of A Work Piece App 20130190912 - JYWE; Wen-Yuh ; et al.	2013-07-25
Package Structure And Method For Fabricating The Same App 20130020699 - HSIEH; Tung-Hsien	2013-01-24
Semiconductor chip package and method for designing the same Grant 8,288,870 - Hsieh October 16, 2	2012-10-16
Semiconductor flip chip package utilizing wire bonding for net switching Grant 8,084,853 - Hsieh December 27, 2	2011-12-27
QFN semiconductor package Grant 8,044,496 - Hsieh , et al. October 25, 2	2011-10-25
Method for fabricating QFN semiconductor package Grant 8,039,319 - Hsieh , et al. October 18, 2	2011-10-18
QFN semiconductor package Grant 8,039,933 - Hsieh , et al. October 18, 2	2011-10-18
Semiconductor Flip Chip Package App 20110074008 - Hsieh; Tung-Hsien	2011-03-31
Qfn Semiconductor Package And Circuit Board Structure Adapted For The Same App 20110042794 - Hsieh; Tung-Hsien ; et al.	2011-02-24
Semiconductor chip package and method for designing the same Grant 7,884,481 - Hsieh February 8, 2	2011-02-08
Semiconductor Chip Package and Method for Designing the Same App 20110001239 - Hsieh; Tung-Hsien	2011-01-06
Semiconductor Chip Package App 20100283141 - Chang; Chun-Wei ; et al.	2010-11-11
Qfn Semiconductor Package App 20100283137 - Hsieh; Tung-Hsien ; et al.	2010-11-11
Method For Fabricating Qfn Semiconductor Package App 20100285638 - Hsieh; Tung-Hsien ; et al.	2010-11-11
Qfn Semiconductor Package App 20100283136 - Hsieh; Tung-Hsien ; et al.	2010-11-11
QFN Semiconductor package Grant 7,786,557 - Hsieh , et al. August 31, 2	2010-08-31
Wire Bond Chip Package App 20100213588 - Hsieh; Tung-Hsien ; et al.	2010-08-26
Multi-chip Package App 20100213589 - Hsieh; Tung-Hsien	2010-08-26
Means for measuring a working machine's structural deviation from five reference axes Grant 7,773,234 - Jywe , et al. August 10, 2	2010-08-10
Means for Measuring a Working Machine's Structural Deviation from Five Reference Axes App 20100060906 - Jywe; Wen-Yuh ; et al.	2010-03-11
Static/dynamic multi-function measuring device for linear unit Grant 7,636,170 - Jywe , et al. December 22, 2	2009-12-22
Qfn Semiconductor Package And Fabrication Method Thereof App 20090283882 - Hsieh; Tung-Hsien ; et al.	2009-11-19
Semiconductor Chip Package And Method For Designing The Same App 20090032948 - Hsieh; Tung-Hsien	2009-02-05

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