loadpatents
Patent applications and USPTO patent grants for Hsieh; Tsung-Yang.The latest application filed is for "semiconductor package and manufacturing process thereof".
Patent | Date |
---|---|
Semiconductor Package And Manufacturing Process Thereof App 20220246511 - Chu; Li-Huan ;   et al. | 2022-08-04 |
Semiconductor package and manufacturing process thereof Grant 11,315,860 - Chu , et al. April 26, 2 | 2022-04-26 |
Semiconductor device and method of manufacture Grant 11,183,399 - Wei , et al. November 23, 2 | 2021-11-23 |
Semiconductor device and method of manufacture Grant 11,101,140 - Wei , et al. August 24, 2 | 2021-08-24 |
Semiconductor Package And Manufacturing Process Thereof App 20210118789 - Chu; Li-Huan ;   et al. | 2021-04-22 |
Semiconductor Device and Method of Manufacture App 20200027750 - Wei; Wen-Hsin ;   et al. | 2020-01-23 |
Semiconductor Device and Method of Manufacture App 20190148166 - Wei; Wen-Hsin ;   et al. | 2019-05-16 |
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