Hsieh; Po Tsung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hsieh; Po Tsung.The latest application filed is for "chip packaging device and alignment bonding method thereof".
- Hsieh; Po Tsung - Tainan TW
- Hsieh; Po-Tsung - Tainan City TW
- Hsieh; Po-Tsung - Kaohsiung City TW
| Patent | Date |
|---|---|
| Sample chip for electron microscope and its related application Grant 10,978,269 - Hsieh , et al. April 13, 2 | 2021-04-13 |
| Chip packaging device and alignment bonding method thereof Grant 10,685,852 - Hsieh , et al. | 2020-06-16 |
| Chip Packaging Device And Alignment Bonding Method Thereof App 20200144078 - Hsieh; Po-Tsung ; et al. | 2020-05-07 |
| Sample Chip For Electron Microscope And Its Related Application App 20190272972 - Hsieh; Po Tsung ; et al. | 2019-09-05 |
| Liquid Sample Carrier App 20190164720 - Hsieh; Po-Tsung ; et al. | 2019-05-30 |
| Solar Cell And Solar Module Including The Same App 20150255656 - Wang; Liang-Tang ; et al. | 2015-09-10 |
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