Hsieh; Mei-Lin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hsieh; Mei-Lin.The latest application filed is for "lead frame, package structure and method for manufacturing the same".
- Hsieh; Mei-Lin - Kaohsiung TW
- Hsieh; Mei-Lin - Zhongli TW
- Hsieh; Mei-Lin - Taoyuan County TW
- Hsieh; Mei-Lin - Phoenix AZ
- Hsieh; Mei-Lin - Zhongli City TW
| Patent | Date |
|---|---|
| Lead frame, package structure and method for manufacturing the same Grant 11,450,596 - Hsu , et al. September 20, 2 | 2022-09-20 |
| Device including a plurality of leads surrounding a die paddle and method for manufacturing the same Grant 11,139,225 - Chen , et al. October 5, 2 | 2021-10-05 |
| Lead Frame, Package Structure And Method For Manufacturing The Same App 20210159155 - HSU; Yi-Cheng ; et al. | 2021-05-27 |
| Device And Method For Manufacturing The Same App 20200395275 - CHEN; Kuang-Hsiung ; et al. | 2020-12-17 |
| Semiconductor device packages with protective layer and related methods Grant 8,592,962 - Chen , et al. November 26, 2 | 2013-11-26 |
| Leadframe and chip package Grant 8,304,865 - Hsu , et al. November 6, 2 | 2012-11-06 |
| Position source selection Grant 8,214,139 - Yonker , et al. July 3, 2 | 2012-07-03 |
| Semiconductor Device Packages With Protective Layer And Related Methods App 20120104584 - Chen; Kuang-Hsiung ; et al. | 2012-05-03 |
| Leadframe And Chip Package App 20110062567 - Hsu; Yueh-Chen ; et al. | 2011-03-17 |
| Position Source Selection App 20090192709 - Yonker; Jason B. ; et al. | 2009-07-30 |
| Chip Package Structure App 20080230882 - Hsieh; Mei-Lin ; et al. | 2008-09-25 |
| Semiconductor Package Structure And Carrier Structure App 20080185698 - Tseng; Yen-Wen ; et al. | 2008-08-07 |
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