loadpatents
Patent applications and USPTO patent grants for Hsieh; Kun Han.The latest application filed is for "photosensitive polyimide resin composition and polyimide film thereof".
Patent | Date |
---|---|
Photosensitive Polyimide Resin Composition And Polyimide Film Thereof App 20210109443 - Huang; Tang Chieh ;   et al. | 2021-04-15 |
Photosensitive Polyimide Resin Composition And Polyimide Film Thereof App 20210088903 - Huang; Tang Chieh ;   et al. | 2021-03-25 |
Method for making support structure for probing device Grant 9,643,271 - Hsieh , et al. May 9, 2 | 2017-05-09 |
Method For Making Support Structure For Probing Device App 20150206850 - HSIEH; Kun-Han ;   et al. | 2015-07-23 |
Illumination device having light sources and angled reflection body Grant 7,635,199 - Guo , et al. December 22, 2 | 2009-12-22 |
Illumination device App 20070147048 - Guo; Huang-Chen ;   et al. | 2007-06-28 |
Illuminating device App 20070133212 - Lin; Wan-Chun ;   et al. | 2007-06-14 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.