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name:-0.0063982009887695
name:-0.0031421184539795
name:-0.00071406364440918
Hsieh; Kun Han Patent Filings

Hsieh; Kun Han

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hsieh; Kun Han.The latest application filed is for "photosensitive polyimide resin composition and polyimide film thereof".

Company Profile
0.2.5
  • Hsieh; Kun Han - Tainan City TW
  • Hsieh; Kun-Han - Chu-Pei TW
  • HSIEH; Kun-Han - CHU-PEI CITY TW
  • Hsieh; Kun-Han - Junghe TW
  • Hsieh; Kun-Han - Taipei TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Photosensitive Polyimide Resin Composition And Polyimide Film Thereof
App 20210109443 - Huang; Tang Chieh ;   et al.
2021-04-15
Photosensitive Polyimide Resin Composition And Polyimide Film Thereof
App 20210088903 - Huang; Tang Chieh ;   et al.
2021-03-25
Method for making support structure for probing device
Grant 9,643,271 - Hsieh , et al. May 9, 2
2017-05-09
Method For Making Support Structure For Probing Device
App 20150206850 - HSIEH; Kun-Han ;   et al.
2015-07-23
Illumination device having light sources and angled reflection body
Grant 7,635,199 - Guo , et al. December 22, 2
2009-12-22
Illumination device
App 20070147048 - Guo; Huang-Chen ;   et al.
2007-06-28
Illuminating device
App 20070133212 - Lin; Wan-Chun ;   et al.
2007-06-14

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