Hsieh; Jerwei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hsieh; Jerwei.The latest application filed is for "integrated mems device".
- Hsieh; Jerwei - Hsinchu TW
- Hsieh; Jerwei - Hsinchu City TW
- Hsieh; Jerwei - Sanchong City TW
- Hsieh; Jerwei - Sanchong TW
- Hsieh; Jerwei - San-chong TW
- Hsieh, Jerwei - San-chong City TW
| Patent | Date |
|---|---|
| Integrated MEMS device Grant 9,676,609 - Hsieh June 13, 2 | 2017-06-13 |
| Integrated MEMS Device App 20160244323 - Hsieh; Jerwei | 2016-08-25 |
| Method for manufacturing an integrated MEMS device Grant 9,359,193 - Hsieh June 7, 2 | 2016-06-07 |
| Integrated Mems Device and Its Manufacturing Method App 20150274514 - Hsieh; Jerwei | 2015-10-01 |
| Package structure and substrate bonding method Grant 8,916,449 - Yin , et al. December 23, 2 | 2014-12-23 |
| Package Structure and Substrate Bonding Method App 20130285248 - Yin; Hung-Lin ; et al. | 2013-10-31 |
| Combo Transducer and Combo Transducer Package App 20130205899 - Wu; Chang-Wen ; et al. | 2013-08-15 |
| Tunable dispersive optical system Grant 7,317,575 - Shieh , et al. January 8, 2 | 2008-01-08 |
| Apparatus for driving microfluid and driving method thereof App 20070286739 - Hsieh; Jerwei ; et al. | 2007-12-13 |
| Device for controlling fluid sequence App 20070207063 - Hsieh; Jerwei | 2007-09-06 |
| Selective etching method Grant 7,247,247 - Hsieh , et al. July 24, 2 | 2007-07-24 |
| Corner compensation method for fabricating MEMS and structure thereof Grant 7,180,144 - Hsieh , et al. February 20, 2 | 2007-02-20 |
| High-aspect-ratio-microstructure (HARM) Grant 7,088,030 - Hsieh , et al. August 8, 2 | 2006-08-08 |
| Tunable dispersive optical system App 20060169881 - Shieh; Kuen-Wey ; et al. | 2006-08-03 |
| Corner compensation method for fabricating MEMS and structure thereof App 20050224449 - Hsieh, Jerwei ; et al. | 2005-10-13 |
| Corner compensation method for fabricating MEMS and structure thereof Grant 6,949,396 - Hsieh , et al. September 27, 2 | 2005-09-27 |
| Selective etching method App 20040232110 - Hsieh, Jerwei ; et al. | 2004-11-25 |
| High-aspect-ratio-microstructure (HARM) App 20040232502 - Hsieh, Jerwei ; et al. | 2004-11-25 |
| Corner compensation method for fabricating MEMS and structure thereof App 20040097001 - Hsieh, Jerwei ; et al. | 2004-05-20 |
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