Hsieh; Harry W. S.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hsieh; Harry W. S..The latest application filed is for "high speed cure sealant".
- Hsieh; Harry W. S. - Rahway NJ
- Hsieh; Harry W. S. - Edison NJ
| Patent | Date |
|---|---|
| High speed cure sealant Grant 4,780,520 - Rizk , et al. * October 25, 1 | 1988-10-25 |
| High speed cure sealant Grant 4,758,648 - Rizk , et al. July 19, 1 | 1988-07-19 |
| Bonding method employing moisture curable polyurethane polymers Grant 4,687,533 - Rizk , et al. August 18, 1 | 1987-08-18 |
| Heat curable one package polyurethane resin composition Grant 4,624,996 - Rizk , et al. November 25, 1 | 1986-11-25 |
| Moisture curable polyurethane polymers Grant 4,625,012 - Rizk , et al. November 25, 1 | 1986-11-25 |
| Acrylic resin having pendant silane groups thereon, and methods of making and using the same Grant 4,567,107 - Rizk , et al. January 28, 1 | 1986-01-28 |
| Acrylic resin having pendant silane groups thereon, and methods of making and using the same Grant 4,491,650 - Rizk , et al. January 1, 1 | 1985-01-01 |
| Silicon-terminated polyurethane polymer Grant 4,345,053 - Rizk , et al. August 17, 1 | 1982-08-17 |
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