Hsieh; Han-Kun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hsieh; Han-Kun.The latest application filed is for "padless high density circuit board and manufacturing method thereof".

Company Profile

0.5.4

Hsieh; Han-Kun - MiaoLi TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Formation of electroplate solder on an organic circuit board for flip chip joints and board to board solder joints Grant 7,098,126 - Hsieh , et al. August 29, 2	2006-08-29
Padless high density circuit board Grant 6,864,586 - Hsieh , et al. March 8, 2	2005-03-08
Method for fabricating conductive bumps and substrate with metal bumps for flip chip packaging Grant 6,790,758 - Hsieh , et al. September 14, 2	2004-09-14
Padless high density circuit board and manufacturing method thereof App 20040169288 - Hsieh, Han-Kun ; et al.	2004-09-02
Method for fabricating conductive bumps and substrate with metal bumps for flip chip packaging App 20040102028 - Hsieh, Han-Kun ; et al.	2004-05-27
Flip chip assembly process for forming an underfill encapsulant Grant 6,720,246 - Hsieh , et al. April 13, 2	2004-04-13
Chip-packaging substrate and test method therefor Grant 6,707,677 - Hsieh , et al. March 16, 2	2004-03-16
Formation of electroplate solder on an organic circuit board for flip chip joints and board to board solder joints App 20030022477 - Hsieh, Han-Kun ; et al.	2003-01-30
Thin core substrate for fabricating a build-up circuit board App 20020152611 - Tung, I-Chung ; et al.	2002-10-24

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.